Stackup Templates
Jumpstart your PCB projects with stackup project templates from leading manufacturers like JLCPCB, AISLER, OSHPARK, and Seeed Studio. These templates are ideal for all skill levels, offering detailed stackups, material specifications, and layer configurations customized to each manufacturer's process. Significantly, these templates integrate manufacturers' constraints as global rules, streamlining the design to align with efficient production workflows. Whether you're working on high-speed digital, RF designs, or standard multi-layer boards, these templates lay a solid groundwork. Stay ahead in PCB design with Flux.ai community-driven library, constantly updated with the latest technology and industry standards. Leverage these top manufacturers' stackup project templates for sophisticated and reliable PCB design
[4-layer] OSHPARK Constraints
Use this template if you're planning to get your board manufactured in OSHPARK. It has the via min/max and trace width constraints already baked as global rules. #project-template #template #manufacturer-design-rules OSHpark 4-layer stackup specs: Top overlay or silkscreen: 1 mil thick Top solder mask or solder resist: 1 mil thick Top copper: 1.7 mil thick on 1 oz copper Dielectric: 7.96 mil thick FR408HG 2113 Mid layer 1: 0.68 mil thick on 0.5 oz copper Dielectric core: 39 mil thick FR408HR Mid layer 2: 0.68 mil thick on 0.5 oz copper Dielectric: 7.96 mil thick FR408HG 2113 Bottom copper: 1.7 mil thick on 1 oz copper Bottom solder mask or solder resist: 1 mil thick Bottom overlay or silkscreen: 1 mil thick
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![[4-layer] OSHPARK Constraints](https://img-cdn.flux.ai/eyJidWNrZXQiOiJncmF2aXRvbi1lbGVjdHJpYy1zeW1ib2xzIiwia2V5IjoiZG9jdW1lbnRfYXNzZXRzL29zaHBhcmstNGwtMmRkYzI4YzYtOWE0NC00NDM2LTg0ODItOTRlZTVlM2MyMDNjLnBuZyIsImVkaXRzIjp7InJlc2l6ZSI6eyJ3aWR0aCI6MTI0LCJoZWlnaHQiOjEyNCwiZml0IjoiY29udGFpbiIsImJhY2tncm91bmQiOnsiciI6MCwiZyI6MCwiYiI6MCwiYWxwaGEiOjB9fX0sIm91dHB1dEZvcm1hdCI6IndlYnAifQ==)