Crystals
A crystal is a solid material in which the atoms, molecules, or ions are arranged in an orderly repeating pattern extending in all three spatial dimensions. Crystalline materials are known for their beauty and symmetry, and they have a wide range of practical uses in fields such as electronics, jewelry, and construction. One of the key uses of crystals is in electronic devices, where they are used as semiconductors to control the flow of electricity. Crystalline materials are also used in the production of jewelry, as they can be cut and polished to create stunning gemstones. In construction, crystalline materials such as quartz and granite are often used as decorative building materials due to their durability and attractive appearance. If you are looking for high-quality crystals for your next project, flux.ai has the world's largest community-driven public library of them, with footprints, symbols, datasheets, and simulation models. Our library is constantly expanding and is a valuable resource for anyone working with crystalline materials. So, if you want to find the perfect crystal for your needs, be sure to check out flux.ai's extensive collection.
NX3225GD-8MHZ-STD-CRA-3
CRYSTAL 8MHz 8pF SMD The NX3225GD-8MHZ-STD-CRA-3 is an automotive-grade surface-mount quartz crystal unit from NDK designed to provide a stable 8 MHz clock reference for microcontrollers, automotive ECUs, and embedded systems. It belongs to the NX3225GD series and is optimized for high reliability under harsh environmental conditions. Key Features 8 MHz fundamental-mode crystal Compact 3.2 mm × 2.5 mm × 1.0 mm SMD package 8 pF load capacitance ±50 ppm frequency tolerance ±150 ppm frequency stability over temperature Automotive-qualified with AEC-Q200 compliance Wide operating temperature range: −40°C to +150°C Excellent resistance to heat, vibration, shock, and solder cracking Stable startup characteristics in severe environments RoHS compliant Typical Applications Automotive engine control units (ECUs) MCU and CPU clock generation Industrial embedded systems Communication equipment Consumer electronics and IoT devices #CommonPartsLibrary #crystal oscillator #resonator
265 Uses0 Stars2125281000
Micro-Fit+ Right-Angle Header, 3.00mm Pitch, Dual Row, 10 Circuits, UL 94V-0, Glow-Wire Capable Connector Header Through Hole, Right Angle 10 position 0.118" (3.00mm) The 2125281000 is a Molex Micro-Fit+ right-angle PCB header connector designed for compact and reliable wire-to-board power connections in industrial, embedded, and automotive-adjacent applications. It features a 3.00 mm pitch, dual-row 10-circuit configuration (2x5), and through-hole mounting for strong mechanical retention. The connector supports high-current applications while maintaining a compact footprint. Key Features Manufacturer: Molex Series: Micro-Fit+ MPN: 2125281000 Connector Type: Right-angle PCB header Mounting Type: Through-hole Orientation: Right-angle / side-entry Pitch: 3.00 mm Positions: 10 circuits (2x5) Current Rating: Up to 12.5 A per contact Voltage Rating: 600V AC/DC Contact Plating: Matte tin Housing Material: Glass-filled Liquid Crystal Polymer (LCP) Operating Temperature: -40°C to +105°C Shrouded Design: 4-wall shrouding for secure mating Locking Feature: Locking ramp and board lock for vibration resistance Flammability Rating: UL94 V-0 Glow-Wire Capable: Suitable for safety-focused designs Application: Power and wire-to-board connections Typical Applications Power distribution boards Embedded systems Industrial control equipment Robotics Battery-powered devices Automotive support electronics High-current peripheral connections #CommonPartsLibrary #Connector
59 Uses0 StarsESP32-S3-PICO-1-N8R8
The ESP32-S3-PICO-1-N8R8 is a highly integrated System-in-Package (SiP) module from Espressif based on the ESP32-S3 SoC. It is designed for compact, low-power IoT applications requiring strong wireless performance, rich peripherals, and minimal external components. This variant (N8R8) integrates 8 MB of SPI flash and 8 MB of PSRAM, making it suitable for memory-intensive applications such as AIoT, voice processing, and graphical user interfaces. The module integrates RF circuitry, crystal oscillator, power management, and memory into a single package, significantly reducing PCB size and BOM cost while improving reliability. ⚡ Key Features Processor & Performance Dual-core Xtensa LX7 microprocessor Up to 240 MHz clock speed Hardware acceleration for AI/ML and vector operations Memory 8 MB SPI Flash 8 MB PSRAM Internal SRAM for fast access tasks Wireless Connectivity 2.4 GHz Wi-Fi 802.11 b/g/n Bluetooth 5 (LE) support Integrated RF front-end Peripherals GPIO, SPI, I2C, UART, ADC, PWM USB 1.1 OTG support RMT, I2S, SD/MMC interface Touch sensor support Power & Efficiency Low-power sleep modes for battery-powered devices Integrated power management circuitry (SiP-level integration) Wide operating voltage: 3.0V – 3.6V Integration Advantages Built-in crystal oscillator Integrated RF matching components Reduced external component count (SiP design) Compact footprint for space-constrained designs 📌 Typical Applications Smart home devices IoT sensors and controllers Voice-enabled AI devices Wearables HMI (Human Machine Interface) Industrial monitoring systems
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