Connectors

16 Position Receptacle Connector 0.079" (2.00mm) Surface Mount Gold CLT-108-02-L-D-A is a high-reliability, dual-row surface-mount receptacle connector from the Samtec CLT Series. It features 16 positions arranged in two rows with a 2.00 mm pitch, making it ideal for board-to-board interconnect applications requiring compact size, robust mechanical performance, and reliable signal and power transmission. The connector utilizes Samtec's Tiger Claw™ dual-wipe contact system, providing excellent contact retention and electrical integrity in demanding environments. 16-position dual-row female receptacle 2.00 mm (0.079") pitch and row spacing Surface-mount (SMT) termination Gold-plated mating contacts for enhanced durability and conductivity Tiger Claw™ dual-wipe contact system for reliable mating performance Current rating up to 4.1 A per contact Phosphor bronze contacts with tin-plated tails Liquid Crystal Polymer (LCP) insulator, UL94 V-0 rated Operating temperature range: -55°C to +125°C Integrated board guide for improved alignment during mating Suitable for board-to-board and mezzanine applications #Samtec #CLTSeries #BoardToBoardConnector #SMTConnector #ReceptacleConnector #TigerClaw #ElectronicComponents #InterconnectSolutions #PCBConnector #EmbeddedSystems

# DF40C-100DS-0.4V(51) ## General Description The DF40C-100DS-0.4V(51) is a high-density board-to-board mezzanine connector manufactured by Hirose Electric. It belongs to the DF40 series of ultra-fine pitch connectors designed for compact electronic systems requiring reliable signal transmission and high interconnection density. The connector features a precision contact system, low-profile construction, and surface-mount configuration, making it suitable for embedded systems, industrial electronics, communication equipment, medical devices, portable electronics, computing platforms, and advanced IoT products. Its robust mechanical design ensures secure mating, excellent signal integrity, and dependable long-term performance in applications where board space is limited and connection reliability is critical. ## Key Features ### Connector Architecture * Board-to-board mezzanine connector design * High-density interconnection capability * Fine-pitch contact arrangement * Precision mating structure * Low-profile configuration * Optimized for compact electronic assemblies ### Electrical Characteristics * Reliable signal transmission * Low contact resistance * Stable electrical performance * High signal integrity capability * Suitable for high-speed digital interfaces * Consistent connection reliability ### Mechanical Characteristics * Surface-mount mounting configuration * Precision alignment structure * Secure mating retention mechanism * Compact footprint design * High-density PCB integration support * Automated assembly compatible ### Contact System * High-reliability contact construction * Gold-plated contact surfaces * Corrosion-resistant interface * Enhanced mating durability * Reliable electrical continuity * Stable long-term performance ### Material Construction * High-strength thermoplastic housing * Precision metal contact system * RoHS-compliant materials * Lead-free compatible construction * Industrial-grade manufacturing quality ### Environmental Characteristics * Long operational service life * Suitable for industrial and commercial applications * Reliable performance under continuous operation * Resistant to mechanical stress and vibration * Stable operation across standard environmental conditions ### Application Areas * Embedded Computing Systems * Industrial Automation Equipment * Medical Electronics * Communication Devices * Portable Electronic Products * Human-Machine Interfaces * Consumer Electronics * Data Acquisition Systems * IoT Devices * Wireless Communication Modules * Control Systems * High-Density PCB Assemblies ### Compliance * RoHS Compliant * Lead-Free Compatible * High-Density Interconnect Solution ## Manufacturer Hirose Electric Co., Ltd. ## Product Family DF40 Series Board-to-Board Connectors #DF40C100DS04V51 #Hirose #DF40Series #BoardToBoardConnector #MezzanineConnector #HighDensityConnector #PCBConnector #EmbeddedSystems #IndustrialElectronics #CommunicationEquipment #MedicalElectronics #IoTDevices #ElectronicsEngineering #PCBDesign #SurfaceMountConnector

Connector Header Through Hole, Right Angle 6 position 0.118" (3.00mm) The Molex 0430450623 is a 6-position, dual-row, right-angle through-hole header with a 3.00 mm pitch, part of the Micro-Fit 3.0 (43045 series) connector family. It is commonly used for compact, high-reliability power and signal connections in industrial, automotive, and electronic systems. Key Features Series: Molex Micro-Fit 3.0 (43045) Number of positions: 6 pins (2 rows) Pitch: 3.00 mm (0.118") Mounting type: Through-hole, right-angle PCB mount Contact type: Male pin header Current rating: up to ~8 A (depending on wire gauge) Voltage rating: 600 V Contact material: Brass Contact finish: Gold (mating side), Tin (tail side) Locking mechanism: Latch / ramp for secure mating Operating temperature: -40°C to +105°C Flammability rating: UL94 V-0 housing material Housing material: Glass-filled LCP (Liquid Crystal Polymer) Board retention: PCB lock / press-fit retention feature Typical Applications Automotive electronics Industrial control systems Power distribution modules Consumer appliances Telecommunications equipment Medical devices #CommonPartsLibrary #Connector #Molex #MicroFit3_0 #0430450623 #Connector #RightAngleHeader #3mmPitch #WireToBoard #PowerConnector #PCBHeader

24 Position Connector Header, Center Strip Contacts Surface Mount Gold The AXT424124 is a Panasonic P4S series 0.4 mm pitch board-to-board / board-to-FPC connector, specifically a 24-position surface-mount header designed for compact, high-density electronic assemblies. It is commonly used in mobile devices and industrial equipment where space saving and reliable fine-pitch interconnection are required. This connector belongs to Panasonic’s P4S narrow-pitch interconnect family, optimized for very small pitch stacking (0.4 mm) and low-profile designs. It supports mating with a corresponding socket connector to form a mezzanine-style board connection. Key Features Ultra-fine pitch: 0.4 mm for high-density PCB layouts 24-pin dual-row header configuration Board-to-board / board-to-FPC compatibility Low profile design with ~1.5 mm mating height option Space-saving construction for compact electronics High reliability “TOUGH CONTACT” design for stable electrical connection Gold-plated contacts for improved conductivity and corrosion resistance Current rating: ~0.3 A per pin (total limited) Dielectric strength: 150 V AC Insulation resistance: ≥ 1000 MΩ Insertion life: ~50 mating cycles Surface-mount (SMD) termination for automated PCB assembly Typical Applications Smartphones and portable consumer electronics Industrial control modules Compact embedded systems Wearable devices and space-constrained PCBs #Panasonic #AXT424124 #P4SSeries #BoardToBoardConnector #FPCConnector #0.4mmPitch #SMDConnector #MezzanineConnector #HighDensityPCB #ElectronicComponents

8km UART Through Hole RF Transceiver Modules and Modems RoHS,3.3V~5.2V,-40 ~ 80C The E32-433T30D is based on the Semtech SX1278 LoRa chipset and uses LoRa spread-spectrum modulation to achieve long-distance, highly reliable wireless communication even in noisy environments. It communicates with a microcontroller via UART (serial interface), making it easy to integrate with Arduino, ESP32, STM32, and similar systems. It is commonly used for IoT telemetry, remote control systems, sensor networks, and industrial monitoring, especially where GSM/Wi-Fi is unavailable or impractical. Key Features Frequency range: 410–441 MHz (433 MHz default) RF output power: 21–30 dBm (up to 1 W high-power version) LoRa modulation: High sensitivity and strong anti-interference Communication distance: up to ~8 km (open area, ideal conditions) Interface: UART TTL serial (3.3 V logic level) Sensitivity: around -147 dBm for long-range reception Low data rate support: ~0.3 kbps to 19.2 kbps Half-duplex communication (TX/RX not simultaneous) Configurable modes: normal / wake-up / power-saving / sleep via M0 & M1 pins Compact module size with SMA antenna connector Wide operating temperature: -40 °C to +85 °C Important Notes Requires external microcontroller (MCU) for operation (not standalone). Must not leave M0 and M1 pins floating (must be defined HIGH/LOW or GND). Works best with proper 433 MHz antenna (2–5 dBi recommended). Power supply must be stable (typically 5V with sufficient current capability). For maximum range, line-of-sight + correct antenna height matters more than raw power. Applications Smart agriculture monitoring Remote sensor networks Utility meter reading (water/gas) Industrial telemetry systems Drone/robot communication links Remote control & automation systems #E32_433T30D #Ebyte #LoRa #SX1278 #WirelessModule #IoT #Telemetry #LongRangeCommunication #UART #433MHzLoRa #EmbeddedSystems

BergStak 0.40mm, 100 position, Receptacle, 4mm stack height 100 Position Connector Receptacle, Center Strip Contacts Surface Mount Gold 10164227-1004A1RLF is a high-density board-to-board mezzanine connector from Amphenol ICC (FCI), part of the BergStak® 0.40 mm series. It is designed for compact electronic systems that require reliable high-speed signal interconnection between stacked PCBs. This component is a 100-position, surface-mount receptacle connector with center strip contacts. It uses a 0.40 mm pitch to support very high pin density in a small footprint. It is commonly used in applications like smartphones, industrial modules, embedded computing, and other space-constrained electronic assemblies. Key Features 100 positions for high-density signal routing 0.40 mm fine pitch for compact PCB designs Board-to-board mezzanine (receptacle type) Surface-mount (SMT) mounting for automated assembly Center strip contact design for stable mating Gold-plated contacts for improved conductivity and corrosion resistance Mated stacking height around 4 mm Low-profile design suitable for thin electronic devices Typical Applications Smartphones and mobile devices Wearable electronics Industrial control modules Embedded computing boards Communication and networking equipment #AmphenolICC #FCI #BergStak #BoardToBoardConnector #MezzanineConnector #0_40mmPitch #SurfaceMount #HighDensityConnector #100PositionConnector #ElectronicsComponents

Micro-Fit 3.0 Vertical Header, 3.00mm Pitch, Dual Row, 4 Circuits, with PCB Press-fit Metal Retention Clip Connector Header Through Hole 4 position 0.118" (3.00mm) The Molex 0430450426 is a 4-position vertical PCB header belonging to the Micro-Fit 3.0 series, designed for compact and reliable power and signal wire-to-board connections. It features a 3.00 mm pitch, through-hole mounting, and a shrouded design for secure mating with compatible receptacles. This connector is commonly used in applications requiring medium-current power delivery in a compact footprint, such as industrial equipment, automotive electronics, consumer devices, and telecommunications systems. It supports a robust locking mechanism to prevent accidental disengagement and ensures stable electrical performance in vibration-prone environments. Key Features 4-position vertical PCB header 3.00 mm pitch (Micro-Fit 3.0 family) Through-hole solder termination Shrouded, polarized housing for correct mating Locking ramp / retention feature for secure connection Rated for medium-power applications (varies by wire gauge, up to industrial-level current use cases) Operating temperature range: -40°C to +105°C High-voltage capability (up to ~600 V rating depending on configuration) Suitable for automotive, industrial, medical, and telecom systems Typical Applications Industrial control systems Automotive electronics modules Power supply interconnects Communication equipment Embedded systems and PCB power distribution #CommonPartsLibrary #Connector #Molex #MicroFit3 #0430450426 #PCBHeader #WireToBoardConnector #PowerConnector #3mmPitch #ElectronicComponents #ConnectorHeader #AutomotiveElectronics #IndustrialConnector