Analog Devices

RP2040 chip for Raspberry Pi Pico - ARM® Cortex®-M0+ MCU 32-Bit The RP2040 is a high-performance, low-cost microcontroller built around two ARM Cortex-M0+ cores. It is optimized for flexibility, ease of use, and deterministic real-time performance. Unlike many microcontrollers, it includes a unique programmable I/O subsystem (PIO), allowing custom hardware interfaces without extra components. Key Features Processing Dual-core ARM Cortex-M0+ processors Up to 133 MHz clock speed Efficient integer performance with low power consumption Memory 264 KB on-chip SRAM External QSPI flash support (typically 2 MB–16 MB depending on board) Programmable I/O (PIO) 2 PIO blocks, each with 4 state machines Enables custom protocols (e.g., SPI, I2C, UART, WS2812, VGA, etc.) Offloads timing-critical tasks from CPU 🔗 Connectivity Interfaces 2× UART 2× SPI 2× I2C USB 1.1 controller (device or host support) 16× PWM channels Analog Features 12-bit ADC (up to 5 channels, including internal temperature sensor) Power & Voltage Operating voltage: 1.8V – 3.3V Low-power modes available Package Options QFN-56 (7×7 mm) Development Ecosystem Supports C/C++ SDK MicroPython and CircuitPython support Strong community and documentation Typical Applications Embedded systems and IoT devices Robotics and automation DIY electronics and prototyping USB devices (HID, MIDI, etc.) Custom communication interfaces using PIO #CommonPartsLibrary #IntegratedCircuit #Microcontroller

Linear Voltage Regulator IC Positive Fixed 1 Output 600mA SOT-25 3.3V LDO AP2112K-3.3 The AP2112K-3.3TRG1 is a low dropout (LDO) linear voltage regulator designed to provide a stable 3.3V output from a higher input voltage. It is optimized for low noise, high power supply rejection ratio (PSRR), and low quiescent current, making it suitable for battery-powered and noise-sensitive applications. The device features current limiting and thermal shutdown protection, ensuring reliable operation under fault conditions. It is commonly used in portable electronics, RF modules, microcontroller power supplies, and other low-power systems. Key Features Fixed output voltage: 3.3V Output current: up to 600 mA Low dropout voltage: ~250 mV at 300 mA load High PSRR: up to 70 dB at 1 kHz Low quiescent current: typically 55 µA Stable with low ESR ceramic capacitors Built-in overcurrent protection Thermal shutdown protection Fast transient response Absolute Maximum Ratings Input Voltage (VIN): up to 6.5 V Output Current: Internally limited Operating Junction Temperature: -40°C to +125°C Storage Temperature: -65°C to +150°C Electrical Characteristics (Typical values unless otherwise specified) Output Voltage Accuracy: ±2% Dropout Voltage: 250 mV @ 300 mA 400 mV @ 600 mA Line Regulation: 0.05%/V Load Regulation: 0.2% Quiescent Current: 55 µA Shutdown Current: <1 µA PSRR: 70 dB @ 1 kHz 45 dB @ 10 kHz Pin Configuration (SOT-23-5 / SC-70-5) VIN – Input voltage GND – Ground EN – Enable (active high) NC – No connection VOUT – Regulated output (3.3V) Package Information Package Type: SOT-23-5 (TRG1 suffix indicates tape & reel) Mounting: Surface mount Small footprint suitable for compact PCB layouts Typical Applications Battery-powered devices Wireless modules (Wi-Fi, Bluetooth, RF) Microcontroller and FPGA power supplies Portable consumer electronics Sensor and analog circuits requiring low noise Compliance & Reliability RoHS compliant Lead-free package Designed for high reliability and long operational life #CommonPartsLibrary #IntegratedCircuit #PowerManagement #LinearRegulator #VoltageRegulator

Bluetooth, WiFi 802.11b/g/n/ax, Bluetooth v5.4 Transceiver Module 2.4GHz Integrated, Chip Surface Mount Silicon Labs SiWG917 module is our lowest power Wi-Fi 6 plus Bluetooth LE 5.4, ideal for ultra-low power IoT wireless devices using Wi-Fi®, Bluetooth, Matter, and IP networking for secure cloud connectivity. It is optimal for developing battery operated devices that need long battery life. SiWG917 module includes an ultra-low power Wi-Fi 6 plus Bluetooth Low Energy (LE) 5.4 wireless CPU subsystem, and an integrated micro-controller (MCU) application subsystem, security, peripherals and power management subsystem all in a single 16 x 21.1 x 2.3 mm package. The wireless subsystem consists of a multi-threaded Network Wireless Processor (NWP) running up to 160 MHz, baseband digital signal processing, analog front end, 2.4 GHz RF transceiver and integrated power amplifier. The application subsystem consists of an ARM® Cortex®-M4 running up to 180 MHz, embedded SRAM, flash, ultra-low power sensor hub, and matrix vector processor. The ARM® Cortex®-M4 is dedicated for peripheral and application-related processing, while the NWP runs the wireless and networking stacks on independent threads, thus providing a fully integrated solution that is ready for a wide range of embedded wireless IoT applications. The modules come with modular radio type approvals for various countries, including USA (FCC), Canada (IC/ISED) and Japan (MIC), and are in compliance with the relevant EN standards (including EN 300 328 v2.2.2) for the conformity with the directives and regulations in EU and UK. KEY FEATURES • Wi-Fi 6 Single Band 2.4 GHz 20 MHz 1x1 stream IEEE 802.11 b/g/n/ax • Bluetooth LE 5.4 • Single chip Matter Over Wi-Fi Solution • ARM® Cortex® M4 Processor with FPU subsystem up to 180 MHz with rich set of Digital and Analog Peripherals. • Wi-Fi 6 Benefits: TWT for improved efficiency and longer battery life, MUMIMO/OFDMA for Higher Throughput, network capacity and low latency • Best in Class Device and Wireless Security • WLAN Tx power up to +17.5 dBm with integrated PA • Bluetooth LE Tx power up to +17 dBm with integrated PA • WLAN Rx sensitivity as low as -95.5 dBm • Wi-Fi 4 Standby Associated mode current: 71 μA @ 1-second listen interval • Embedded Flash option up to 8 MB/ optional external Flash up to 16 MB • Embedded PSRAM option up to 2 MB/ optional external PSRAM option up to 16 MB • Ultra-low power sensor hub peripherals • Matrix Vector Processor (MVP) • Embedded Wi-Fi, Bluetooth LE, Matter, and networking stacks supporting wireless coexistence • Three software-configurable MCU application memory options for sharing the RAM between the wireless, system, and application (192/256/320 KB) • Operating temperature: -40 to +85 ºC • Operating supply range: 3.0 to 3.63 V • Supply voltage for GPIOs: 1.71 to 3.63 V #WiFi6 #BluetoothLE54 #IoTModule #WirelessSoC #SiliconLabs #EmbeddedSystems #SmartHome #IndustrialIoT #LowPowerDesign #RFModule #ConnectedDevices #EdgeComputing #MatterReady #PCBDesign #ElectronicsEngineering