Sensors

Bluetooth, WiFi 802.11b/g/n/ax, Bluetooth v5.4 Transceiver Module 2.4GHz Integrated, Chip Surface Mount Silicon Labs SiWG917 module is our lowest power Wi-Fi 6 plus Bluetooth LE 5.4, ideal for ultra-low power IoT wireless devices using Wi-Fi®, Bluetooth, Matter, and IP networking for secure cloud connectivity. It is optimal for developing battery operated devices that need long battery life. SiWG917 module includes an ultra-low power Wi-Fi 6 plus Bluetooth Low Energy (LE) 5.4 wireless CPU subsystem, and an integrated micro-controller (MCU) application subsystem, security, peripherals and power management subsystem all in a single 16 x 21.1 x 2.3 mm package. The wireless subsystem consists of a multi-threaded Network Wireless Processor (NWP) running up to 160 MHz, baseband digital signal processing, analog front end, 2.4 GHz RF transceiver and integrated power amplifier. The application subsystem consists of an ARM® Cortex®-M4 running up to 180 MHz, embedded SRAM, flash, ultra-low power sensor hub, and matrix vector processor. The ARM® Cortex®-M4 is dedicated for peripheral and application-related processing, while the NWP runs the wireless and networking stacks on independent threads, thus providing a fully integrated solution that is ready for a wide range of embedded wireless IoT applications. The modules come with modular radio type approvals for various countries, including USA (FCC), Canada (IC/ISED) and Japan (MIC), and are in compliance with the relevant EN standards (including EN 300 328 v2.2.2) for the conformity with the directives and regulations in EU and UK. KEY FEATURES • Wi-Fi 6 Single Band 2.4 GHz 20 MHz 1x1 stream IEEE 802.11 b/g/n/ax • Bluetooth LE 5.4 • Single chip Matter Over Wi-Fi Solution • ARM® Cortex® M4 Processor with FPU subsystem up to 180 MHz with rich set of Digital and Analog Peripherals. • Wi-Fi 6 Benefits: TWT for improved efficiency and longer battery life, MUMIMO/OFDMA for Higher Throughput, network capacity and low latency • Best in Class Device and Wireless Security • WLAN Tx power up to +17.5 dBm with integrated PA • Bluetooth LE Tx power up to +17 dBm with integrated PA • WLAN Rx sensitivity as low as -95.5 dBm • Wi-Fi 4 Standby Associated mode current: 71 μA @ 1-second listen interval • Embedded Flash option up to 8 MB/ optional external Flash up to 16 MB • Embedded PSRAM option up to 2 MB/ optional external PSRAM option up to 16 MB • Ultra-low power sensor hub peripherals • Matrix Vector Processor (MVP) • Embedded Wi-Fi, Bluetooth LE, Matter, and networking stacks supporting wireless coexistence • Three software-configurable MCU application memory options for sharing the RAM between the wireless, system, and application (192/256/320 KB) • Operating temperature: -40 to +85 ºC • Operating supply range: 3.0 to 3.63 V • Supply voltage for GPIOs: 1.71 to 3.63 V #WiFi6 #BluetoothLE54 #IoTModule #WirelessSoC #SiliconLabs #EmbeddedSystems #SmartHome #IndustrialIoT #LowPowerDesign #RFModule #ConnectedDevices #EdgeComputing #MatterReady #PCBDesign #ElectronicsEngineering

Fully calibrated temperature and humidity sensor with digital output and I²C interface The AHT30 is a high-precision digital temperature and humidity sensor developed by AOSONG Electronics. It integrates a capacitive humidity sensing element, a temperature sensor, and a dedicated ASIC in a compact DFN package. The device provides fully calibrated digital output through an I²C interface, offering low power consumption, excellent long-term stability, and reliable performance in demanding environmental conditions. It is widely used in smart home devices, HVAC systems, industrial controls, weather monitoring equipment, IoT devices, and consumer electronics. Key Features Fully calibrated digital temperature and humidity sensor I²C digital communication interface Relative humidity measurement range: 0% to 100% RH Temperature measurement range: -40°C to +85°C High accuracy: up to ±2% RH and ±0.3°C (typical) Wide operating voltage: 2.2 V to 5.5 V Low power consumption Fast response time Excellent long-term stability Strong anti-interference capability Compact DFN package suitable for reflow soldering Optimized ASIC with improved MEMS sensing technology Applications Smart home and IoT devices HVAC and air quality monitoring Weather stations Consumer electronics Medical equipment Industrial monitoring and control systems Refrigerators, dehumidifiers, and air conditioners Hashtags #AHT30 #AOSONG #TemperatureSensor #HumiditySensor #EnvironmentalSensor #I2C #MEMS #SmartHome #IoT #HVAC #IndustrialAutomation #WeatherMonitoring #EmbeddedSystems #ElectronicsDesign #PCBDesign

Optical Sensor Through-Beam 0.197" (5mm) PCB Mount The EE-SX4081 specification defines the engineering requirements for a slot-type photomicrosensor designed for non-contact object detection and position sensing in electronic and electromechanical systems. This specification establishes the functional, electrical, mechanical, environmental, and quality requirements necessary to ensure accurate optical sensing, reliable switching performance, and long-term operational stability. The component is intended for use in industrial automation, office equipment, consumer electronics, and embedded control systems requiring precise detection of object presence, motion, or position. The integrated infrared emitter and phototransistor receiver provide dependable sensing through interruption of the optical path, enabling high-speed, contactless detection in compact system designs. Engineering Requirements The photomicrosensor shall be manufactured using qualified optoelectronic components and controlled production processes to ensure consistent sensing performance, mechanical integrity, and long service life. The optical assembly shall maintain accurate alignment between the emitter and receiver to provide stable detection characteristics throughout the specified operating conditions. Electrical characteristics shall provide reliable switching response, stable output behavior, and low power consumption while maintaining consistent sensitivity across the intended operating voltage and temperature ranges. The sensor shall exhibit reliable performance under normal ambient light conditions and shall maintain signal integrity during continuous operation. Mechanical construction shall ensure precise slot dimensions, secure mounting capability, and resistance to vibration, mechanical shock, and thermal cycling encountered during normal operation. The package shall be suitable for printed circuit board assembly and shall withstand standard soldering and handling processes without degradation. Workmanship shall be free from defects including contamination, optical misalignment, package damage, corrosion, or structural irregularities that could affect sensing accuracy or reliability. Inspection, validation, and testing shall be performed using calibrated equipment and controlled quality procedures to verify compliance with engineering requirements. Any deviation from this specification shall require formal engineering evaluation, documented technical justification, and approval through the established engineering change control process before implementation. Documentation Supporting documentation shall include engineering drawings, electrical specifications, optical performance data, qualification reports, inspection records, and revision-controlled manufacturing documentation. All documentation shall be maintained under formal configuration management and quality assurance systems to ensure complete traceability throughout the product lifecycle. Revision Control Any modification to this specification shall be processed through the formal engineering change management system. All revisions shall undergo technical review, validation, and approval before release to ensure continued compliance with design intent and applicable engineering standards. #EngineeringSpecification #Photomicrosensor #OpticalSensor #SlotSensor #IndustrialAutomation #EmbeddedSystems #Optoelectronics #QualityAssurance #EngineeringDocumentation #ElectronicComponents

27 Hz ~ 18 kHz Digital, I2S Microphone MEMS (Silicon) 1.62 V ~ 1.98 V Omnidirectional (-37dB ±1dB @ 94dB SPL) Solder Pads TDK InvenSense T5848 TDK T5848 is a low-noise digital MEMS microphone with a bottom-port acoustic interface and industry-standard I²S digital audio output. The device integrates a MEMS microphone element, impedance converter, ADC, decimation filtering, anti-aliasing filtering, power management, and a 24-bit digital audio interface in a compact 3.5 mm × 2.65 mm × 0.98 mm package. The T5848 supports multiple operating modes including High Quality, Low Power, Sleep, and Always-On Voice (AOV) modes, making it ideal for battery-powered and voice-activated applications. With up to 68 dBA SNR, 133 dB SPL acoustic overload point, and extended frequency response from 27 Hz to 18 kHz, the T5848 is optimized for wearables, IoT devices, smart TVs, gaming systems, teleconferencing equipment, voice assistants, and always-listening audio applications. Search Keywords: T5848, TDK T5848, MEMS Microphone, Digital MEMS Microphone, I2S Microphone, Bottom Port Microphone, Always On Voice Microphone, AOV Microphone, Low Power MEMS Microphone, Wearable Microphone, IoT Audio Sensor, Voice Recognition Microphone, Digital Audio Input, 24-bit I2S Microphone, DSP Microphone, Smart Speaker Microphone, Voice Assistant Microphone, TDK InvenSense Microphone, Teleconference Audio Microphone, Embedded Audio Sensor Hashtags: #T5848 #TDK #InvenSense #MEMSMicrophone #DigitalMicrophone #I2SMicrophone #AudioSensor #AlwaysOnVoice #VoiceRecognition #WearableElectronics #IoTDevices #EmbeddedAudio #VoiceAssistant #SmartDevices #DSP #ElectronicsDesign #PCBDesign #EmbeddedSystems #HardwareEngineering #AudioElectronics

Battery Battery Protection IC Lithium Ion/Polymer SOT-23-6 S-8261ABJMD-G3JT2G is a high-accuracy lithium-ion/lithium-polymer battery protection IC designed for single-cell battery packs. It integrates voltage detection and timing circuits to protect rechargeable batteries against overcharge, overdischarge, overcurrent, and short-circuit conditions, helping improve battery safety, reliability, and lifespan. The device is commonly used in portable electronics, battery packs, IoT devices, and handheld equipment. It is housed in a compact SOT-23-6 package suitable for space-constrained designs. Key Features Single-cell Li-ion / Li-polymer battery protection IC High-accuracy overcharge detection High-accuracy overdischarge detection Overcurrent and short-circuit protection Built-in delay circuits to prevent false triggering Low current consumption (typical operating current in the µA range) Wide operating voltage range Support for 0 V battery charging function Compact SOT-23-6 package RoHS compliant and lead-free version available Typical Applications Li-ion battery packs Li-polymer battery packs Portable consumer electronics Wireless sensors and IoT devices Handheld instruments Rechargeable battery-powered equipment #BatteryProtectionIC #LiIonBattery #LiPoBattery #PowerManagement #BatteryPackProtection #OverchargeProtection #OverdischargeProtection #ShortCircuitProtection #SOT23 #ABLIC #SeikoInstruments #PortableElectronics #RechargeableBattery #PMIC #SingleCellBattery

Mini 2.45 GHz Antenna The 2450AT18A100E is a high-frequency ceramic SMT antenna featuring a small 3.2 mm × 1.6 mm × 1.3 mm package, optimized for space-constrained RF designs. It operates from 2400 MHz to 2500 MHz with a 50 Ω impedance and provides a compact alternative to traditional PCB trace antennas while maintaining reliable RF performance. Key Features Operating Frequency: 2400 MHz – 2500 MHz (2.4 GHz ISM Band) Center Frequency: 2450 MHz Antenna Type: Mini Ceramic Chip Antenna / SMT RF Antenna Package Size: 3.2 mm × 1.6 mm × 1.3 mm Impedance: 50 Ω Peak Gain: Approximately +0.5 dBi (typical) Average Radiation Efficiency: Approximately 76% (based on Johanson evaluation board) Maximum Input Power: 2 W continuous wave (CW) Operating Temperature Range: -40 °C to +125 °C Mounting Type: Surface Mount Technology (SMT) Applications: Bluetooth / BLE devices Wi-Fi 2.4 GHz modules Zigbee / IEEE 802.15.4 systems IoT sensors and embedded wireless products #2450AT18A100E #JohansonTechnology #ChipAntenna #SMTAntenna #RFDesign #2GHzAntenna #Bluetooth #WiFi #Zigbee #IoT #WirelessCommunication #EmbeddedSystems #PCBDesign #RFAntenna #Antena #Chip #SurfaceMount