Microcontrollers
A microcontroller is a small, low-cost computer-on-a-chip that can be used to control electronic devices and systems. It consists of a central processing unit (CPU), memory, input/output (I/O) ports, and other peripherals integrated onto a single chip. Microcontrollers are commonly used in a wide range of applications, including automotive systems, home appliances, industrial automation, and consumer electronics. One of the key benefits of microcontrollers is their ability to interact with their environment through sensors and actuators, making them well-suited for use in embedded systems. These systems are often found in devices that require real-time control or data processing, such as medical equipment, aircraft, and factory automation systems. Flux.ai is home to the world's largest community-driven public library of microcontrollers, with footprints, symbols, datasheets, and simulation models for a wide range of devices. Whether you're a professional engineer looking for a specific microcontroller for your next project, or a hobbyist exploring the possibilities of microcontroller-based systems, Flux.ai has the resources you need to get started.
STM32G0B1CBT6
ARM-MSeries LQFP-48(7x7) Microcontrollers (MCU/MPU/SOC) ROHS ST Microelectronics STM32G0B1CBT6 LQFP-48_L7.0-W7.0-P0.50-LS9.0-BL LCSC Part Number: C2847904 JLCPCB Part Class: Extended Part Manufactured by ST(意法半导体) STMicroelectronics STM32G0B1 series 32-bit Arm Cortex-M0+ microcontroller, up to 64MHz CPU frequency, 1.7V to 3.6V operating voltage, up to 512KB Flash memory and 144KB SRAM, USB 2.0 full-speed device/host support, USB Type-C Power Delivery controller, FDCAN, I2C, USART, SPI, HDMI CEC, 12-bit ADC, 12-bit DACs, timers, RTC, DMA, CRC unit, SWD debug interface, 96-bit unique ID, operating temperature options up to -40°C to +125°C, available in LQFP, UFQFPN, UFBGA and WLCSP packages. Search Keywords: STM32G0B1, STM32G0B1xB, STM32G0B1xC, STM32G0B1xE, STMicroelectronics STM32G0B1, STM32G0B1 MCU, STM32G0B1 microcontroller, Arm Cortex-M0+ microcontroller, STM32G0 64MHz MCU, STM32G0B1 USB Type-C PD, STM32G0B1 USB FS, STM32G0B1 FDCAN, STM32G0B1 512KB Flash, STM32G0B1 144KB SRAM, STM32G0B1 LQFP, STM32G0B1 UFQFPN, STM32G0B1 UFBGA, STM32G0B1 WLCSP, STM32G0B1 datasheet Hashtags: #STM32G0B1 #STM32G0B1xB #STM32G0B1xC #STM32G0B1xE #STMicroelectronics #STM32MCU #STM32G0 #ArmCortexM0Plus #32bitMicrocontroller #64MHzMCU #512KBFlashMCU #144KBSRAM #USBTypeCPD #USBFS #FDCAN #I2CMCU #SPIMCU #USARTMCU #ADCmicrocontroller #DACmicrocontroller #LQFP #UFQFPN #UFBGA #WLCSP
73 Uses0 StarsMLX90640ESF-BAB-000-TU
Thermal Image Sensor 32H x 24V TO-39 # MLX90640ESF-BAB-000-TU Engineering Specifications **General Description** The MLX90640ESF-BAB-000-TU is a contactless infrared thermal imaging sensor manufactured by Melexis. It incorporates a microbolometer array that detects infrared radiation emitted by objects and converts the captured thermal energy into temperature data, enabling the creation of thermal images without physical contact. The device is designed for compact and cost-effective thermal imaging applications, offering high thermal sensitivity and accurate temperature measurement capabilities. It integrates a digital signal-processing engine, calibration data memory, and a digital communication interface, allowing direct connection to microcontrollers, embedded systems, and industrial monitoring equipment. The sensor provides real-time thermal mapping across its field of view and is suitable for applications involving human presence detection, predictive maintenance, industrial automation, smart building systems, medical screening, consumer electronics, robotics, and thermal monitoring solutions. Its factory calibration ensures stable performance throughout its operating life while minimizing external calibration requirements. **Engineering Specifications** **Manufacturer:** Melexis **Manufacturer Part Number:** MLX90640ESF-BAB-000-TU **Component Type:** Infrared thermal imaging sensor **Sensor Technology:** Microbolometer thermal sensor array **Measurement Method:** Non-contact infrared temperature sensing **Output Type:** Digital thermal image data **Communication Interface:** I²C-compatible serial interface **Temperature Measurement Capability:** Object temperature monitoring and thermal imaging **Thermal Imaging Function:** Real-time thermal map generation **Integrated Processing:** On-chip signal processing and calibration management **Calibration:** Factory calibrated with stored calibration parameters **Power Supply Configuration:** Single-supply operation **Power Consumption:** Optimized for low-power embedded applications **Refresh Rate:** Programmable thermal frame refresh operation **Thermal Sensitivity:** High-sensitivity infrared detection **Field of View Variant:** Wide-angle thermal imaging configuration **Accuracy Characteristics:** High-precision temperature measurement with integrated compensation algorithms **Memory Features:** Internal EEPROM for calibration coefficients **Operating Mode:** Continuous and programmable thermal acquisition **Data Output Format:** Digital temperature and thermal pixel information **Environmental Stability:** Designed for reliable operation across varying ambient conditions **Electromagnetic Compatibility:** Suitable for embedded and industrial electronic systems **Package Type:** Surface-mount package with infrared-transparent window **Mounting Style:** Surface mount technology **Package Construction:** Reflow-solderable assembly **Lead Finish:** Lead-free finish **Environmental Compliance:** RoHS compliant and halogen-free **Reliability Features:** Factory-tested and production-calibrated thermal imaging device **Typical Applications** Thermal cameras Human presence detection systems Occupancy monitoring Industrial predictive maintenance Electrical equipment inspection Smart building automation HVAC monitoring systems Medical screening devices Consumer electronics Robotics and autonomous systems Fire detection and prevention systems Industrial process monitoring Energy management systems Automotive thermal sensing applications Security and surveillance equipment #MLX90640 #MLX90640ESF #Melexis #ThermalSensor #InfraredSensor #ThermalImaging #Microbolometer #TemperatureSensor #IndustrialAutomation #EmbeddedSystems #IoT #PredictiveMaintenance #SmartBuilding #ThermalCamera #ElectronicComponents #EngineeringSpecifications
7 Uses0 StarsTPS3808G33DRVT
Monitors & Reset Circuits TPS3808G33DRVT WSON-6_L2.0-W2.0-P0.65-TL-EP LCSC Part Number: C702176 JLCPCB Part Class: undefined Manufactured by TI(德州仪器) Texas Instruments TPS3808 low-quiescent-current voltage supervisor and reset generator, supply voltage monitoring from 0.4V to 5V, 0.5% threshold accuracy, adjustable reset delay from 1.25ms to 10s using external capacitor, open-drain RESET output, manual reset (MR) input, ultra-low 2.4µA typical quiescent current, suitable for microcontrollers, DSPs, FPGAs, ASICs, battery-powered and portable devices, operating temperature range -40°C to +125°C, available in SOT-23-6 and WSON-6 packages. Search Keywords: TPS3808, TPS3808G, Texas Instruments TPS3808, TI TPS3808, voltage supervisor, reset supervisor, reset generator, watchdog reset, power-on reset, POR supervisor, brownout detector, voltage monitor IC, microcontroller supervisor, open drain reset, adjustable reset delay, manual reset supervisor, low power supervisor, battery powered reset IC, TPS3808 datasheet, TPS3808 SOT-23-6, TPS3808 WSON-6 Hashtags: #TPS3808 #TexasInstrumentsTPS3808 #TIVoltageSupervisor #VoltageSupervisor #ResetSupervisor #ResetGenerator #PowerOnReset #BrownoutDetector #VoltageMonitorIC #MicrocontrollerSupervisor #OpenDrainReset #ManualReset #LowPowerSupervisor #BatteryPoweredDesign #SOT236 #WSON6
40 Uses0 StarsW25Q16JVUXIQ
SPI Flash Serial Flash Memory with Dual/Quad SPI The W25Q16JVUXIQ is a 16-Mbit (2-MByte) Serial NOR Flash memory device from Winbond. It is designed for embedded systems that require non-volatile code and data storage with minimal pin count, low power consumption, and high-speed access. The device supports standard SPI, Dual SPI, and Quad SPI interfaces, making it suitable for firmware storage, boot memory, IoT devices, microcontrollers, consumer electronics, and execute-in-place (XIP) applications. Key Features 16-Mbit (2-MByte) Flash Memory Capacity Operating Voltage: 2.7 V to 3.6 V Standard SPI, Dual SPI, and Quad SPI Interface Support Maximum SPI Clock Frequency: 133 MHz Equivalent Data Transfer Rates: 266 MHz (Dual SPI) 532 MHz (Quad SPI) Continuous Read and XIP (Execute-In-Place) Capability 4 KB Sector Erase, 32 KB Block Erase, 64 KB Block Erase, and Chip Erase 256-Byte Programmable Page Size Minimum 100,000 Program/Erase Cycles per Sector More Than 20 Years Data Retention Ultra-Low Power Consumption Typical power-down current below 1 µA 64-Bit Unique Serial Number Three 256-Byte Security Registers with OTP Protection JEDEC ID and SFDP Support Software and Hardware Write Protection Operating Temperature Options up to +85°C and +105°C Compact 8-Pad USON Package (2 mm × 3 mm) suitable for space-constrained designs #CommonPartsLibrary #IntegratedCircuit #Memory
171 Uses0 StarsAMS1117-3.3RG
The AMS1117-3.3RG is a fixed-output, low-dropout (LDO) linear voltage regulator that provides a regulated 3.3 V output from a higher input voltage. It is capable of delivering up to 1 A output current and is commonly used in microcontroller, communication, and embedded-system power supplies where a stable 3.3 V rail is required. The device includes built-in protection features such as current limiting and thermal shutdown for improved reliability. Key Features Fixed 3.3 V output voltage Supports up to 1 A output current Low dropout voltage, typically around 1.2 V and up to 1.3 V at 1 A load Input voltage capability up to 12 V (some manufacturer variants specify higher absolute maximum ratings) Good line and load regulation Built-in current limiting protection Built-in thermal shutdown protection Available in SOT-223 surface-mount package Suitable for post-regulation of switching power supplies and general 3.3 V power conversion applications Typical Applications ESP32, STM32, and other microcontroller-based systems Embedded and IoT devices Communication modules LCD monitors and display circuits Battery-powered equipment Post-regulation for DC/DC converters Motherboards and expansion cards #CommonPartsLibrary #IntegratedCircuit #PowerManagement #LDO
139 Uses0 StarsLAN8720A-CP-TR-ABC
Small Footprint RMII 10/100 Ethernet Transceiver with HP Auto-MDIX Support LAN8720A-CP-TR-ABC is a low-power, single-port 10BASE-T/100BASE-TX Ethernet Physical Layer (PHY) transceiver from Microchip Technology. It is designed to connect a microcontroller, processor, or Ethernet MAC to a standard Ethernet network through an RMII (Reduced Media Independent Interface). The device is widely used in embedded networking applications such as industrial controllers, IoT gateways, IP cameras, networked printers, routers, and ESP32-based Ethernet designs. Key Features Single-chip 10/100 Mbps Ethernet PHY Supports both 10BASE-T and 100BASE-TX Ethernet operation. RMII Interface Reduced pin-count interface for easy connection to Ethernet MACs and microcontrollers. IEEE 802.3 / 802.3u Compliant Fully compliant with Fast Ethernet standards. HP Auto-MDIX Support Automatically detects and configures straight-through or crossover Ethernet cables. Auto-Negotiation Automatically selects the best available speed and duplex mode. Flexible I/O Voltage Supports LVCMOS I/O voltages from 1.6 V to 3.6 V, simplifying interfacing with different processors. Integrated 1.2 V Regulator Allows operation from a single 3.3 V supply, reducing external components. Low-Power Architecture Features multiple power-saving modes through Microchip's flexPWR® technology. Built-in Diagnostics and Reliability Features Loopback modes, automatic polarity correction, link-status monitoring, and wake-up detection. Compact Package Available in a 24-pin SQFN/QFN (4 mm × 4 mm) package for space-constrained designs #CommonPartsLibrary #IntegratedCircuit
92 Uses0 Stars2.54-2*4P立贴针
CONN HEADER 8POS 2.54mm DUAL ROW SMD The 2.54-2×4P is a generic 8-pin dual-row connector/header with a 2.54 mm (0.1 inch) pitch, commonly used for board-to-board, wire-to-board, and programming/debug interfaces in electronic circuits. The designation 2×4P indicates two rows of four pins, providing a total of eight electrical connections in a compact arrangement. This type of connector is widely used in embedded systems, development boards, industrial control equipment, consumer electronics, and prototyping applications due to its standard pitch and broad compatibility with jumper wires, IDC cables, and mating sockets. Key Features 2.54 mm standard pitch (0.1 inch industry standard) 2×4 pin configuration (8 total contacts) Available in through-hole (THT) and sometimes surface-mount (SMT) versions Supports board-to-board and wire-to-board connections Compatible with standard jumper wires and ribbon cable connectors Compact dual-row design for higher pin density Typically constructed with gold-plated or tin-plated contacts for reliable electrical performance Suitable for signal, control, and low-power applications Commonly used for programming, debugging, communication interfaces, and expansion headers Available in straight (vertical) or right-angle orientations depending on manufacturer Typical Applications Microcontroller and development boards ISP/JTAG/SWD programming headers Sensor and peripheral connections Industrial control systems Prototyping and breadboard-compatible designs Communication interfaces and expansion ports #CommonPartsLibrary #Connector
72 Uses0 Stars