Interface ICs
An interface IC is a type of integrated circuit that is designed to facilitate communication between two devices or systems. These devices are commonly used in electronic systems to enable the transfer of data and control signals between different components or subsystems. Some common use cases for interface ICs include connecting microcontrollers to peripherals such as sensors or displays, linking multiple processors together in a network, and enabling communication between devices using different communication protocols. Flux.ai has the world's largest community-driven public library of interface ICs, with footprints, symbols, datasheets, and simulation models. This library is a valuable resource for engineers and designers who need access to accurate and up-to-date information on these important components. Whether you are working on a new design project or simply looking to learn more about interface ICs, Flux.ai is an excellent resource to help you find the information you need.
F12-090-C2
Laminated Core 1.1VA Power Transformer 115V Primary Parallel 6.3V, Series 12.6V Secondary Parallel 180mA, Series 90mA Through Hole The F12-090-C2 specification defines the engineering requirements for an electronic connector component intended to provide reliable electrical interconnection between printed circuit boards, cable assemblies, or electronic subsystems. This specification establishes the functional, mechanical, electrical, environmental, and quality requirements necessary to ensure dependable signal transmission, secure mechanical engagement, and long-term operational reliability. The component is intended for use in embedded, industrial, communication, and electronic control systems where compact interconnect solutions and consistent electrical performance are required. The connector is designed to support repeated mating cycles while maintaining low contact resistance, stable mechanical retention, and compatibility with standard electronic assembly processes. Engineering Requirements The connector shall be manufactured using precision-formed conductive contacts and high-strength insulating materials to ensure consistent electrical conductivity, mechanical durability, and long service life. The construction shall support reliable mating and unmating operations without degradation of contact performance. Electrical characteristics shall provide low contact resistance, stable signal integrity, and reliable current-carrying capability within the specified operating conditions. The connector shall maintain electrical continuity under vibration, thermal cycling, and environmental exposure encountered during normal operation. Mechanical construction shall ensure accurate alignment of mating interfaces, secure retention, and resistance to mechanical wear resulting from repeated insertion and removal. The housing and contact system shall withstand normal handling and assembly processes without deformation or structural damage. Workmanship shall be free from defects including contamination, cracks, corrosion, plating irregularities, or mechanical deformation that could adversely affect electrical or mechanical performance. Inspection, validation, and testing shall be conducted using calibrated equipment and controlled quality procedures to verify compliance with engineering requirements. Any deviation from this specification shall require formal engineering evaluation, documented technical justification, and approval through the established engineering change control process prior to implementation. Documentation Supporting documentation shall include engineering drawings, material specifications, electrical performance data, inspection records, qualification reports, and revision-controlled manufacturing documentation. All documentation shall be maintained under formal configuration management and quality assurance systems to ensure complete product traceability. Revision Control Any modification to this specification shall be processed through the formal engineering change management system. All revisions shall undergo technical review, validation, and approval before release to ensure continued compliance with design intent and applicable industry standards. #EngineeringSpecification #Connector #ElectronicInterconnect #SignalIntegrity #EmbeddedSystems #IndustrialElectronics #ElectricalEngineering #Manufacturing #QualityAssurance #EngineeringDocumentation
0 Uses0 StarsMMICT5848-00-012
27 Hz ~ 18 kHz Digital, I2S Microphone MEMS (Silicon) 1.62 V ~ 1.98 V Omnidirectional (-37dB ±1dB @ 94dB SPL) Solder Pads TDK InvenSense T5848 TDK T5848 is a low-noise digital MEMS microphone with a bottom-port acoustic interface and industry-standard I²S digital audio output. The device integrates a MEMS microphone element, impedance converter, ADC, decimation filtering, anti-aliasing filtering, power management, and a 24-bit digital audio interface in a compact 3.5 mm × 2.65 mm × 0.98 mm package. The T5848 supports multiple operating modes including High Quality, Low Power, Sleep, and Always-On Voice (AOV) modes, making it ideal for battery-powered and voice-activated applications. With up to 68 dBA SNR, 133 dB SPL acoustic overload point, and extended frequency response from 27 Hz to 18 kHz, the T5848 is optimized for wearables, IoT devices, smart TVs, gaming systems, teleconferencing equipment, voice assistants, and always-listening audio applications. Search Keywords: T5848, TDK T5848, MEMS Microphone, Digital MEMS Microphone, I2S Microphone, Bottom Port Microphone, Always On Voice Microphone, AOV Microphone, Low Power MEMS Microphone, Wearable Microphone, IoT Audio Sensor, Voice Recognition Microphone, Digital Audio Input, 24-bit I2S Microphone, DSP Microphone, Smart Speaker Microphone, Voice Assistant Microphone, TDK InvenSense Microphone, Teleconference Audio Microphone, Embedded Audio Sensor Hashtags: #T5848 #TDK #InvenSense #MEMSMicrophone #DigitalMicrophone #I2SMicrophone #AudioSensor #AlwaysOnVoice #VoiceRecognition #WearableElectronics #IoTDevices #EmbeddedAudio #VoiceAssistant #SmartDevices #DSP #ElectronicsDesign #PCBDesign #EmbeddedSystems #HardwareEngineering #AudioElectronics
9 Uses0 StarsSK6812MINIRGBW-NW-P6
3.5x3.7×1.9 mm, 0.25 W intelligent externally controlled surface-mount device (SMD) type LED SK6812MINIRGBW-NW-P6 is a smart, addressable RGBW LED that integrates red, green, blue, and neutral white (NW) LEDs with a built-in control IC in a compact SMD package. Each LED acts as an individually addressable pixel, allowing precise color and brightness control through a single-wire digital interface. It is commonly used in RGBW lighting effects, backlighting, gaming peripherals, custom keyboards, LED displays, wearables, and decorative lighting applications. Key Features Individually addressable RGB + Neutral White (RGBW) LED Built-in intelligent control IC and constant-current driver Single-wire serial communication interface 32-bit color data (RGBW control) Cascadable design for long LED chains Integrated signal reshaping for reliable data transmission Operating voltage: 3.5V to 5.5V Typical data transmission rate: 800 kbps 256-level grayscale PWM dimming per channel Compact 3.7 mm × 3.5 mm SMD-6 package Built-in power-on reset circuit Wide operating temperature range: -40°C to +85°C Suitable for animations, indicators, displays, and smart lighting applications. #SK6812MINIRGBW #SK6812 #RGBWLED #AddressableLED #SmartLED #NeutralWhiteLED #DigitalLED #PixelLED #LEDLighting #EmbeddedSystems #PCBDesign #IoT #Electronics #LEDDisplay #LightingControl
9 Uses0 StarsE04-400M16S
Transceiver 433MHz IPEX interface -100dBm 1km SPI SMD,20x14mm RF Transceiver Modules and Modems RoHS The E04-400M16S is based on STMicroelectronics' S2-LPQTR chip as the core, it is an ultra-small size chip wireless transceiver RF module independently developed by Ebyte, working in the 433M/470M frequency band, with a maximum transmission power of 16dBm. Since this module is a SPI pure hardware radio frequency transceiver module, it needs to be driven by MCU. Features Ultra-small size, only 14x20mm; The communication distance can reach 1km under ideal conditions; The maximum transmit power is 16dBm; The receiving current (RX) is as low as 7mA, and the transmitting current (TX) is as low as 10mA@10dBm; Low power consumption, suitable for battery-powered applications; Support 433M/470M frequency band; Support multiple debugging modes of 2(G)FSK, 4(G)FSK, OOK, ASK; Support 2.5V～3.6V power supply, power supply greater than 3.3V can guarantee the best performance; Industrial-grade standard design, supporting long-term use at -40～85℃; IPEX interface and stamp hole are optional, which is convenient for users to develop and integrate. Application Smart meeting Wireless alarm system Smart door lock Building automation Industrial acquisition and control Intelligent lighting system #E04_400M16S #EBYTE #S2LP #RFModule #WirelessTransceiver #433MHz #470MHz #IoT #IndustrialAutomation #SmartHome #LongRangeWireless #SPI #LowPowerRF #EmbeddedSystems #WirelessCommunication
0 Uses0 StarsMTCH2120-V/REB
Touchscreen Controller 2 Wire Capacitive I2C Interface 20-VQFN (3x3) The MTCH2120-V/REB specification defines the engineering requirements for a capacitive touch sensing controller integrated circuit designed for human-machine interface applications in embedded electronic systems. This specification establishes the functional, electrical, mechanical, environmental, and quality requirements necessary to ensure accurate touch detection, stable system performance, and reliable operation across consumer, industrial, and embedded environments. The device is intended for use in applications requiring touch-based user input such as control panels, interface buttons, and capacitive sensing surfaces. It provides robust sensing performance with immunity to noise and environmental variation, enabling reliable detection of touch events in compact and low-power electronic designs. Engineering Requirements The integrated circuit shall be manufactured using qualified semiconductor fabrication processes to ensure consistent sensing performance, low power consumption, and long-term operational stability. The device shall support reliable capacitive touch detection under defined electrical and environmental conditions without degradation of sensitivity or accuracy. The sensing architecture shall provide stable touch event detection with immunity to electrical noise, environmental interference, and parasitic capacitance variations. The system shall maintain consistent performance across intended operating conditions including temperature variation and supply voltage fluctuation. Electrical characteristics shall ensure stable digital communication, accurate sensing response, and reliable operation during startup, normal operation, and power transitions. The device shall maintain functional integrity during dynamic system conditions without false triggering or loss of sensitivity. Mechanical and package construction shall be suitable for surface-mount assembly and shall ensure robustness during soldering, handling, and long-term operation. Workmanship shall be free from defects such as contamination, cracks, bonding issues, or structural inconsistencies that could impact electrical or mechanical reliability. Inspection, validation, and testing shall be performed using controlled procedures and calibrated equipment to ensure compliance with all applicable engineering and quality requirements. Any deviation from this specification shall require formal engineering review, documented justification, and approval through established change control processes. Documentation Supporting documentation shall include official datasheets, reference design materials, electrical characterization reports, qualification data, inspection records, and revision-controlled manufacturing documentation. All documentation shall be maintained under formal configuration management and quality assurance systems to ensure traceability and consistency. Revision Control All modifications to this specification shall be managed through formal engineering change control procedures. Each revision shall undergo technical evaluation, validation, and approval prior to implementation to ensure continued compliance with design intent and applicable standards. #EngineeringSpecification #CapacitiveTouch #HMI #MicrochipTechnology #EmbeddedSystems #UserInterface #SensorIC #LowPowerDesign #ElectronicsDesign #QualityAssurance #EngineeringDocumentation
1 Uses0 Stars2479774-2
USB-C (USB TYPE-C) Receptacle Connector 24 (6+18 Dummy) - Power Only 6 Pin Position Surface Mount, Right Angle; Through Hole The 2479774-2 specification defines the engineering requirements for a high-density electronic connector assembly intended for board-to-cable or board-to-board interconnection in advanced electronic systems. This specification establishes the functional, mechanical, electrical, environmental, and quality requirements necessary to ensure reliable signal transmission, stable mechanical engagement, and long-term durability in demanding electronic applications. The component is intended for use in systems requiring compact interconnect solutions with high signal integrity and robust mechanical retention. It is suitable for applications such as industrial electronics, communication systems, embedded control units, and high-performance electronic assemblies where reliable connectivity and repeatable mating performance are required. Engineering Requirements The connector assembly shall be manufactured using precision-formed conductive materials and high-strength insulating housing materials to ensure stable electrical performance and mechanical reliability. The design shall support secure mating engagement and consistent signal continuity across repeated connection cycles. Electrical characteristics shall ensure low contact resistance, stable signal integrity, and reliable conductivity under defined operating conditions. The connector shall maintain performance under mechanical vibration, thermal variation, and environmental stress conditions typical of industrial and embedded system applications. Mechanical construction shall ensure accurate alignment between mating interfaces, secure locking engagement, and resistance to accidental disconnection. The design shall support repeated mating cycles without degradation of electrical or mechanical performance. Workmanship shall be free from defects such as contamination, deformation, plating irregularities, or structural inconsistencies that could impact reliability or functionality. Manufacturing and inspection shall be conducted under controlled quality systems using calibrated equipment to ensure compliance with engineering requirements. Any deviation from this specification shall require formal engineering review, documented justification, and approval through established engineering change control procedures prior to implementation. Documentation Supporting documentation shall include engineering drawings, connector datasheets, material declarations, inspection records, qualification test reports, and revision-controlled manufacturing documentation. All documentation shall be maintained under formal configuration management and quality assurance systems. Revision Control All changes to this specification shall be managed through formal engineering change control procedures. Each revision shall undergo technical evaluation, validation, and approval prior to release to ensure continued compliance with design intent and applicable standards. #EngineeringSpecification #Connector #HighDensityInterconnect #ElectronicComponents #SignalIntegrity #EmbeddedSystems #IndustrialElectronics #Manufacturing #QualityAssurance #EngineeringDocumentation
4 Uses0 StarsBT151-600R
The BT151-600R specification defines the engineering requirements for a high-power silicon controlled rectifier designed for phase control and switching applications in electronic power systems. This specification establishes the functional, electrical, mechanical, environmental, and quality requirements necessary to ensure reliable switching performance, controlled power regulation, and long-term operational stability. The device is intended for use in applications requiring efficient control of AC power or high-current DC switching, such as motor speed control, light dimming, power regulation circuits, and industrial control systems. It provides controlled conduction behavior triggered by gate activation and remains in conduction until current falls below the holding condition. Engineering Requirements The semiconductor device shall be manufactured using controlled silicon processing techniques to ensure stable thyristor operation, consistent triggering characteristics, and reliable current handling capability. The device shall maintain predictable switching behavior under defined electrical, thermal, and environmental operating conditions. Electrical characteristics shall ensure reliable gate triggering sensitivity, stable on-state conduction, and controlled turn-off behavior under appropriate circuit conditions. The device shall maintain performance integrity under surge conditions and repetitive switching operation within its design limits. Thermal performance shall support efficient heat dissipation through the package structure and mounting interface. The device shall be suitable for attachment to appropriate heat sinking systems to maintain safe operating junction conditions during continuous or high-load operation. Mechanical and package construction shall be suitable for surface-mount or power PCB assembly and shall ensure robust mechanical stability during soldering, handling, and thermal cycling. Workmanship shall be free from defects such as contamination, cracks, bond wire issues, or structural inconsistencies that could impact performance or reliability. Inspection, validation, and testing shall be performed using controlled procedures and calibrated equipment to ensure compliance with all applicable engineering and quality requirements. Any deviation from this specification shall require formal engineering review, documented justification, and approval through established change control processes. Documentation Supporting documentation shall include official datasheets, electrical characterization reports, thermal performance data, qualification test records, inspection reports, and revision-controlled manufacturing documentation. All documentation shall be maintained under formal configuration management and quality assurance systems to ensure traceability and consistency. Revision Control Any modification to this specification shall be managed through formal engineering change control procedures. All revisions shall undergo technical review, validation, and approval prior to implementation to ensure continued compliance with design intent and applicable standards. #EngineeringSpecification #SCR #Thyristor #PowerElectronics #PhaseControl #IndustrialControl #Semiconductor #PowerSwitching #QualityAssurance #EngineeringDocumentation
1 Uses0 Stars
