Interface ICs
An interface IC is a type of integrated circuit that is designed to facilitate communication between two devices or systems. These devices are commonly used in electronic systems to enable the transfer of data and control signals between different components or subsystems. Some common use cases for interface ICs include connecting microcontrollers to peripherals such as sensors or displays, linking multiple processors together in a network, and enabling communication between devices using different communication protocols. Flux.ai has the world's largest community-driven public library of interface ICs, with footprints, symbols, datasheets, and simulation models. This library is a valuable resource for engineers and designers who need access to accurate and up-to-date information on these important components. Whether you are working on a new design project or simply looking to learn more about interface ICs, Flux.ai is an excellent resource to help you find the information you need.
CMX973Q5
RF Demodulator IC 20MHz ~ 300MHz 32-VFQFN Exposed Pad The CMX973Q5 specification defines the engineering requirements for a radio frequency quadrature modulator integrated circuit designed for digital and analog wireless communication systems. This specification establishes the functional, electrical, mechanical, thermal, environmental, and quality requirements necessary to ensure accurate signal modulation, high RF performance, and long-term operational reliability. The device is intended for use in wireless communication equipment, telemetry systems, software-defined radio platforms, digital data transmission equipment, industrial RF systems, and embedded communication applications requiring high-performance I/Q modulation. It provides precise conversion of baseband in-phase and quadrature signals into modulated RF output while maintaining excellent signal integrity, low distortion, and stable operation over a wide range of operating conditions. Engineering Requirements The RF modulator shall be manufactured using qualified semiconductor fabrication processes and high-quality materials to ensure consistent electrical characteristics, reliable modulation accuracy, and dependable long-term performance. The device shall maintain stable operation under specified supply voltage, temperature, and environmental operating conditions. Electrical characteristics shall provide accurate in-phase and quadrature signal processing, low phase imbalance, high linearity, low noise, and excellent carrier suppression. The device shall maintain stable RF output characteristics and predictable modulation performance throughout continuous operation while minimizing harmonic distortion and unwanted spurious emissions. The integrated RF architecture shall support efficient signal conversion and reliable interface with external oscillators, filters, and communication circuitry. The device shall preserve signal integrity across the specified operating frequency range while supporting high-quality modulation for digital and analog communication protocols. Thermal performance shall support continuous operation within the specified junction temperature range while maintaining electrical integrity and long-term reliability. The package shall be suitable for automated surface-mount assembly and compatible with standard solder reflow manufacturing processes. Mechanical construction shall withstand thermal cycling, vibration, mechanical handling, and environmental exposure without degradation of electrical or mechanical performance. Workmanship shall be free from defects including contamination, package cracking, bond failures, lead deformation, plating irregularities, or structural inconsistencies that could adversely affect RF performance or reliability. Inspection, validation, and testing shall be performed using calibrated RF measurement equipment and controlled quality procedures to verify compliance with engineering and manufacturing requirements. Any deviation from this specification shall require formal engineering evaluation, documented technical justification, and approval through the established engineering change control process before implementation. Documentation Supporting documentation shall include engineering drawings, RF performance specifications, modulation characteristics, application guidelines, qualification reports, inspection records, reliability data, material declarations, and revision-controlled manufacturing documentation. All documentation shall be maintained under formal configuration management and quality assurance systems to ensure complete product traceability. Revision Control Any modification to this specification shall be managed through the formal engineering change management process. All revisions shall undergo technical review, validation, and approval before release to ensure continued compliance with design intent and applicable engineering standards. #EngineeringSpecification #RFModulator #QuadratureModulator #WirelessCommunication #RFIC #SignalModulation #EmbeddedSystems #Telecommunications #QualityAssurance #EngineeringDocumentation
0 Uses0 StarsTXU0202DTTR
Voltage Level Translator Unidirectional 1 Circuit 2 Channel 200Mbps 8-X1SON (1.95x1) The TXU0202DTTR specification defines the engineering requirements for a dual-bit voltage level translator integrated circuit designed for bidirectional logic-level conversion between digital interfaces operating at different supply voltages. This specification establishes the functional, electrical, mechanical, thermal, environmental, and quality requirements necessary to ensure reliable signal translation, high-speed communication, and long-term operational stability in embedded electronic systems. The device is intended for use in embedded controllers, microprocessor and microcontroller systems, communication interfaces, industrial automation equipment, consumer electronics, and portable devices requiring voltage compatibility between digital subsystems. It enables seamless signal transfer while preserving logic integrity, minimizing propagation delay, and supporting low-power operation in compact electronic designs. Engineering Requirements The voltage level translator shall be manufactured using qualified semiconductor fabrication processes and high-quality materials to ensure consistent electrical performance, low power consumption, and dependable long-term reliability. The device shall maintain stable operation under specified voltage, temperature, and environmental operating conditions. Electrical characteristics shall provide accurate bidirectional logic-level translation with low propagation delay, high noise immunity, and reliable input and output switching performance. The device shall maintain signal integrity during continuous operation, power sequencing, and dynamic switching conditions without introducing excessive distortion or timing errors. The integrated translation architecture shall support independent voltage domains while ensuring reliable communication between connected digital devices. The device shall maintain stable performance across varying supply voltages and logic frequencies while minimizing leakage current and preserving overall system efficiency. Thermal performance shall support continuous operation within the specified junction temperature range while maintaining electrical integrity and long-term reliability. The package shall be suitable for automated surface-mount assembly and compatible with standard solder reflow manufacturing processes. Mechanical construction shall withstand thermal cycling, vibration, mechanical handling, and environmental exposure without degradation of electrical or mechanical performance. Workmanship shall be free from defects including contamination, package cracking, bond failures, lead deformation, or structural inconsistencies that could adversely affect functionality or reliability. Inspection, validation, and testing shall be performed using calibrated equipment and controlled quality procedures to verify compliance with engineering and manufacturing requirements. Any deviation from this specification shall require formal engineering evaluation, documented technical justification, and approval through the established engineering change control process before implementation. Documentation Supporting documentation shall include engineering drawings, electrical performance specifications, timing diagrams, application guidelines, qualification reports, inspection records, reliability data, material declarations, and revision-controlled manufacturing documentation. All documentation shall be maintained under formal configuration management and quality assurance systems to ensure complete product traceability. Revision Control Any modification to this specification shall be managed through the formal engineering change management process. All revisions shall undergo technical review, validation, and approval before release to ensure continued compliance with design intent and applicable engineering standards. #EngineeringSpecification #VoltageLevelTranslator #LogicLevelShifter #DigitalInterface #EmbeddedSystems #Semiconductor #SignalIntegrity #IndustrialElectronics #QualityAssurance #EngineeringDocumentation
6 Uses0 StarsTS3USB221DRCR
USB Switch IC 2 Channel 10-VSON (3x3) The TS3USB221DRCR specification defines the engineering requirements for a high-speed USB analog switch integrated circuit designed for signal routing and interface switching in embedded electronic systems. This specification establishes the functional, electrical, mechanical, thermal, environmental, and quality requirements necessary to ensure reliable high-speed signal transmission, low insertion loss, and long-term operational stability. The device is intended for use in USB interface switching, portable electronics, embedded controllers, communication equipment, docking stations, and multimedia systems requiring high-speed differential signal routing. It enables seamless switching between USB data paths while maintaining signal integrity, minimizing propagation delay, and supporting reliable operation in compact, high-performance electronic designs. Engineering Requirements The analog switch shall be manufactured using qualified semiconductor fabrication processes and high-quality materials to ensure consistent switching performance, low power consumption, and dependable long-term reliability. The device shall maintain stable operation under specified voltage, temperature, and environmental conditions. Electrical characteristics shall provide low on-resistance, low capacitance, minimal insertion loss, and excellent channel-to-channel matching to preserve high-speed USB signal integrity. The device shall support reliable differential signal switching with minimal distortion, low propagation delay, and low crosstalk during continuous operation. The switching architecture shall provide dependable channel selection, high isolation between signal paths, and predictable switching behavior during power-up, power-down, and dynamic operating conditions. The device shall maintain stable electrical performance while minimizing electromagnetic interference and signal degradation. Thermal performance shall support continuous operation within the specified junction temperature range while maintaining electrical integrity and reliability. The package shall be suitable for automated surface-mount assembly and compatible with standard solder reflow manufacturing processes. Mechanical construction shall withstand vibration, thermal cycling, mechanical handling, and environmental exposure without degradation of performance. Workmanship shall be free from defects including contamination, package cracking, bond failures, lead deformation, or structural inconsistencies that could adversely affect electrical or mechanical reliability. Inspection, validation, and testing shall be performed using calibrated equipment and controlled quality procedures to verify compliance with engineering and manufacturing requirements. Any deviation from this specification shall require formal engineering evaluation, documented technical justification, and approval through the established engineering change control process before implementation. Documentation Supporting documentation shall include engineering drawings, electrical performance specifications, application guidelines, qualification reports, inspection records, reliability data, material declarations, and revision-controlled manufacturing documentation. All documentation shall be maintained under formal configuration management and quality assurance systems to ensure complete product traceability. Revision Control Any modification to this specification shall be managed through the formal engineering change management process. All revisions shall undergo technical review, validation, and approval before release to ensure continued compliance with design intent and applicable engineering standards. #EngineeringSpecification #USBAnalogSwitch #HighSpeedSwitch #USBInterface #SignalIntegrity #EmbeddedSystems #Semiconductor #ElectronicDesign #QualityAssurance #EngineeringDocumentation
13 Uses0 StarsTAA3020IRTER
Audio 16 b, 20 b, 24 b, 32 b 768k I2C, I2S, TDM 20-WQFN (3x3) The TAA3020IRTER is a high-performance 2-channel audio analog-to-digital converter (ADC) from Texas Instruments, designed for professional and embedded audio applications. It supports up to two analog microphone/line inputs or four digital PDM microphone channels with simultaneous sampling. The device delivers excellent audio quality with a 104 dB dynamic range, supports sample rates up to 768 kHz, and integrates advanced audio processing features such as programmable gain, digital filters, automatic gain control (AGC), voice activity detection (VAD), and an integrated PLL. It communicates through an I²C control interface and supports I²S, TDM, and Left-Justified (LJ) digital audio formats, making it ideal for smart speakers, conferencing systems, IP cameras, and other high-performance audio acquisition systems. Key Features High-performance 2-channel audio ADC Supports 2 analog microphone/line inputs or 4 digital PDM microphone inputs 104 dB dynamic range (DR) and –95 dB THD+N Sampling rates from 8 kHz to 768 kHz Programmable microphone gain from 0 dB to 42 dB Digital volume control from –100 dB to +27 dB Integrated programmable HPF, biquad filters, and low-latency filter modes Built-in Automatic Gain Control (AGC) and Voice Activity Detection (VAD) Integrated audio PLL and programmable microphone bias supply Supports I²S, TDM, and Left-Justified (LJ) audio interfaces Configurable for 1.8 V or 3.3 V supply operation Available in a compact 20-pin WQFN (RTE) package Operating temperature range: –40°C to +105°C #AudioADC #TexasInstruments #TAA3020 #HighPerformanceADC #I2S #TDM #PDMMicrophone #AudioProcessing #AGC #VAD #EmbeddedAudio #ProfessionalAudio
0 Uses0 StarsDRV8262QDDWRQ1
Bipolar Motor Driver NMOS On/Off, PWM 44-HTSSOP The DRV8262QDDWRQ1 is an automotive-qualified, high-power H-bridge motor driver from Texas Instruments designed for 24 V and 48 V automotive systems. It integrates two H-bridges capable of driving one or two brushed DC motors, a bipolar stepper motor, or thermoelectric coolers (TECs). The device features integrated high-side current sensing, programmable current regulation, and comprehensive protection functions, eliminating the need for external current-sense resistors while reducing PCB area and system cost. It supports wide supply voltages from 4.5 V to 60 V, making it suitable for demanding automotive body electronics and industrial motor control applications. Key Features Automotive AEC-Q100 Grade 1 qualified (-40°C to +125°C) Wide 4.5 V to 60 V operating supply voltage Dual H-bridge or single high-current H-bridge operation Drives: One or two brushed DC motors One bipolar stepper motor One or two thermoelectric coolers (TECs) Up to 8 A peak (dual H-bridge mode) Up to 16 A peak (single H-bridge mode) Low MOSFET on-resistance: 100 mΩ (dual H-bridge) 50 mΩ (single H-bridge) Integrated high-side current sensing with ±4% accuracy Programmable current regulation and current limiting Supports 1.8 V, 3.3 V, and 5 V logic interfaces Configurable PWM control modes (PH/EN or IN/IN) Ultra-low 3 µA sleep current Integrated protection features: Undervoltage Lockout (UVLO) Charge Pump Undervoltage (CPUV) Overcurrent Protection (OCP) Thermal Shutdown (OTSD) Fault output (nFAULT) Functional safety-capable with supporting documentation for automotive system design. #DRV8262QDDWRQ1 #MotorDriver #HBridge #AutomotiveElectronics #BrushedDCMotor #StepperMotor #CurrentSense #AECQ100 #TexasInstruments #EmbeddedSystems #PowerManagement #PCBDesign
52 Uses0 StarsMS580314BA01-00
Pressure Sensor 203.05PSI (1400kPa) Absolute 24 b 8-SMD Module The MS580314BA01-00 is a high-resolution digital absolute pressure sensor module from TE Connectivity Measurement Specialties. It integrates a precision MEMS pressure sensing element, a 24-bit ΔΣ ADC, and factory-calibrated coefficients to provide highly accurate digital pressure and temperature measurements. The sensor supports both I²C and SPI communication interfaces, making it easy to interface with a wide range of microcontrollers while requiring minimal external components. It is designed for low-power, high-accuracy applications such as altimeters, depth measurement systems, weather monitoring, industrial pressure sensing, and portable instrumentation. Key Features Digital absolute pressure sensor with integrated MEMS sensing element High-resolution 24-bit ΔΣ ADC with factory calibration Supports I²C and SPI digital interfaces Pressure range up to 14 bar (1400 kPa / 203 psi) Supply voltage: 1.8 V to 3.6 V Integrated temperature measurement for compensation and monitoring Low power consumption, suitable for battery-powered devices Operating temperature range: −40°C to +85°C Excellent long-term stability with low hysteresis Compact 8-SMD module for surface-mount PCB assembly Requires few or no external components for operation #PressureSensor #MEMS #AbsolutePressure #DigitalSensor #24BitADC #I2C #SPI #LowPower #IndustrialElectronics #Altimeter #DepthMeasurement #WeatherMonitoring #TEConnectivity #SurfaceMount #EmbeddedSystems
9 Uses0 Stars
