Connectors

Board to Board & Mezzanine Connectors .050\" SEARAY High-Speed High-Density Open-Pin-Field Array Terminal 400 Position Connector High Density Array, Male Surface Mount, Right Angle Gold SEAM-40-01-L-10-2-RA-K-TR is a high-speed, high-density board-to-board mezzanine connector from the Samtec SEARAY™ series. It features a right-angle, surface-mount design with 400 positions arranged in a 10-row open-pin-field array on a 1.27 mm (0.050") pitch. The connector utilizes Samtec's Edge Rate® contact system, providing excellent signal integrity, durability, and support for high-speed differential pair routing in demanding communication, networking, and embedded computing applications. Key Features High-density 400-position open-pin-field array connector 1.27 mm (0.050") contact pitch for compact board-to-board interconnects Right-angle, surface-mount termination Rugged Edge Rate® contact system for reliable high-speed performance Supports high-speed serial protocols and differential pair routing Suitable for power, ground, and signal connections within the same connector Gold-plated contacts for enhanced reliability and corrosion resistance Board-guide feature for improved mating alignment Current rating up to 1.9 A per contact Voltage rating up to 240 VAC / 339 VDC Tape-and-reel packaging for automated assembly processes RoHS compliant and designed for high-reliability applications #Samtec #SEARAY #SEAM4001L102RAKTR #BoardToBoardConnector #MezzanineConnector #HighSpeedConnector #HighDensityInterconnect #EdgeRate #SurfaceMount #RightAngleConnector #EmbeddedSystems #TelecomEquipment #NetworkingHardware #IndustrialElectronics #PCBDesign

# DF40C-100DS-0.4V(51) ## General Description The DF40C-100DS-0.4V(51) is a high-density board-to-board mezzanine connector manufactured by Hirose Electric. It belongs to the DF40 series of ultra-fine pitch connectors designed for compact electronic systems requiring reliable signal transmission and high interconnection density. The connector features a precision contact system, low-profile construction, and surface-mount configuration, making it suitable for embedded systems, industrial electronics, communication equipment, medical devices, portable electronics, computing platforms, and advanced IoT products. Its robust mechanical design ensures secure mating, excellent signal integrity, and dependable long-term performance in applications where board space is limited and connection reliability is critical. ## Key Features ### Connector Architecture * Board-to-board mezzanine connector design * High-density interconnection capability * Fine-pitch contact arrangement * Precision mating structure * Low-profile configuration * Optimized for compact electronic assemblies ### Electrical Characteristics * Reliable signal transmission * Low contact resistance * Stable electrical performance * High signal integrity capability * Suitable for high-speed digital interfaces * Consistent connection reliability ### Mechanical Characteristics * Surface-mount mounting configuration * Precision alignment structure * Secure mating retention mechanism * Compact footprint design * High-density PCB integration support * Automated assembly compatible ### Contact System * High-reliability contact construction * Gold-plated contact surfaces * Corrosion-resistant interface * Enhanced mating durability * Reliable electrical continuity * Stable long-term performance ### Material Construction * High-strength thermoplastic housing * Precision metal contact system * RoHS-compliant materials * Lead-free compatible construction * Industrial-grade manufacturing quality ### Environmental Characteristics * Long operational service life * Suitable for industrial and commercial applications * Reliable performance under continuous operation * Resistant to mechanical stress and vibration * Stable operation across standard environmental conditions ### Application Areas * Embedded Computing Systems * Industrial Automation Equipment * Medical Electronics * Communication Devices * Portable Electronic Products * Human-Machine Interfaces * Consumer Electronics * Data Acquisition Systems * IoT Devices * Wireless Communication Modules * Control Systems * High-Density PCB Assemblies ### Compliance * RoHS Compliant * Lead-Free Compatible * High-Density Interconnect Solution ## Manufacturer Hirose Electric Co., Ltd. ## Product Family DF40 Series Board-to-Board Connectors #DF40C100DS04V51 #Hirose #DF40Series #BoardToBoardConnector #MezzanineConnector #HighDensityConnector #PCBConnector #EmbeddedSystems #IndustrialElectronics #CommunicationEquipment #MedicalElectronics #IoTDevices #ElectronicsEngineering #PCBDesign #SurfaceMountConnector

24 Position Connector Header, Center Strip Contacts Surface Mount Gold The AXT424124 is a Panasonic P4S series 0.4 mm pitch board-to-board / board-to-FPC connector, specifically a 24-position surface-mount header designed for compact, high-density electronic assemblies. It is commonly used in mobile devices and industrial equipment where space saving and reliable fine-pitch interconnection are required. This connector belongs to Panasonic’s P4S narrow-pitch interconnect family, optimized for very small pitch stacking (0.4 mm) and low-profile designs. It supports mating with a corresponding socket connector to form a mezzanine-style board connection. Key Features Ultra-fine pitch: 0.4 mm for high-density PCB layouts 24-pin dual-row header configuration Board-to-board / board-to-FPC compatibility Low profile design with ~1.5 mm mating height option Space-saving construction for compact electronics High reliability “TOUGH CONTACT” design for stable electrical connection Gold-plated contacts for improved conductivity and corrosion resistance Current rating: ~0.3 A per pin (total limited) Dielectric strength: 150 V AC Insulation resistance: ≥ 1000 MΩ Insertion life: ~50 mating cycles Surface-mount (SMD) termination for automated PCB assembly Typical Applications Smartphones and portable consumer electronics Industrial control modules Compact embedded systems Wearable devices and space-constrained PCBs #Panasonic #AXT424124 #P4SSeries #BoardToBoardConnector #FPCConnector #0.4mmPitch #SMDConnector #MezzanineConnector #HighDensityPCB #ElectronicComponents

8km UART Through Hole RF Transceiver Modules and Modems RoHS,3.3V~5.2V,-40 ~ 80C The E32-433T30D is based on the Semtech SX1278 LoRa chipset and uses LoRa spread-spectrum modulation to achieve long-distance, highly reliable wireless communication even in noisy environments. It communicates with a microcontroller via UART (serial interface), making it easy to integrate with Arduino, ESP32, STM32, and similar systems. It is commonly used for IoT telemetry, remote control systems, sensor networks, and industrial monitoring, especially where GSM/Wi-Fi is unavailable or impractical. Key Features Frequency range: 410–441 MHz (433 MHz default) RF output power: 21–30 dBm (up to 1 W high-power version) LoRa modulation: High sensitivity and strong anti-interference Communication distance: up to ~8 km (open area, ideal conditions) Interface: UART TTL serial (3.3 V logic level) Sensitivity: around -147 dBm for long-range reception Low data rate support: ~0.3 kbps to 19.2 kbps Half-duplex communication (TX/RX not simultaneous) Configurable modes: normal / wake-up / power-saving / sleep via M0 & M1 pins Compact module size with SMA antenna connector Wide operating temperature: -40 °C to +85 °C Important Notes Requires external microcontroller (MCU) for operation (not standalone). Must not leave M0 and M1 pins floating (must be defined HIGH/LOW or GND). Works best with proper 433 MHz antenna (2–5 dBi recommended). Power supply must be stable (typically 5V with sufficient current capability). For maximum range, line-of-sight + correct antenna height matters more than raw power. Applications Smart agriculture monitoring Remote sensor networks Utility meter reading (water/gas) Industrial telemetry systems Drone/robot communication links Remote control & automation systems #E32_433T30D #Ebyte #LoRa #SX1278 #WirelessModule #IoT #Telemetry #LongRangeCommunication #UART #433MHzLoRa #EmbeddedSystems

BergStak 0.40mm, 100 position, Receptacle, 4mm stack height 100 Position Connector Receptacle, Center Strip Contacts Surface Mount Gold 10164227-1004A1RLF is a high-density board-to-board mezzanine connector from Amphenol ICC (FCI), part of the BergStak® 0.40 mm series. It is designed for compact electronic systems that require reliable high-speed signal interconnection between stacked PCBs. This component is a 100-position, surface-mount receptacle connector with center strip contacts. It uses a 0.40 mm pitch to support very high pin density in a small footprint. It is commonly used in applications like smartphones, industrial modules, embedded computing, and other space-constrained electronic assemblies. Key Features 100 positions for high-density signal routing 0.40 mm fine pitch for compact PCB designs Board-to-board mezzanine (receptacle type) Surface-mount (SMT) mounting for automated assembly Center strip contact design for stable mating Gold-plated contacts for improved conductivity and corrosion resistance Mated stacking height around 4 mm Low-profile design suitable for thin electronic devices Typical Applications Smartphones and mobile devices Wearable electronics Industrial control modules Embedded computing boards Communication and networking equipment #AmphenolICC #FCI #BergStak #BoardToBoardConnector #MezzanineConnector #0_40mmPitch #SurfaceMount #HighDensityConnector #100PositionConnector #ElectronicsComponents

Micro-Fit 3.0 Vertical Header, 3.00mm Pitch, Dual Row, 4 Circuits, with PCB Press-fit Metal Retention Clip Connector Header Through Hole 4 position 0.118" (3.00mm) The Molex 0430450426 is a 4-position vertical PCB header belonging to the Micro-Fit 3.0 series, designed for compact and reliable power and signal wire-to-board connections. It features a 3.00 mm pitch, through-hole mounting, and a shrouded design for secure mating with compatible receptacles. This connector is commonly used in applications requiring medium-current power delivery in a compact footprint, such as industrial equipment, automotive electronics, consumer devices, and telecommunications systems. It supports a robust locking mechanism to prevent accidental disengagement and ensures stable electrical performance in vibration-prone environments. Key Features 4-position vertical PCB header 3.00 mm pitch (Micro-Fit 3.0 family) Through-hole solder termination Shrouded, polarized housing for correct mating Locking ramp / retention feature for secure connection Rated for medium-power applications (varies by wire gauge, up to industrial-level current use cases) Operating temperature range: -40°C to +105°C High-voltage capability (up to ~600 V rating depending on configuration) Suitable for automotive, industrial, medical, and telecom systems Typical Applications Industrial control systems Automotive electronics modules Power supply interconnects Communication equipment Embedded systems and PCB power distribution #CommonPartsLibrary #Connector #Molex #MicroFit3 #0430450426 #PCBHeader #WireToBoardConnector #PowerConnector #3mmPitch #ElectronicComponents #ConnectorHeader #AutomotiveElectronics #IndustrialConnector

2 Position Header, Male Blades Connector Solder 0.295" (7.50mm) Through Hole, Right Angle 46007-1102 0460071102 is a 2-position right-angle PCB header from the Molex Sabre power connector family, designed for high-current wire-to-board power applications. It features a 7.50 mm pitch, through-hole mounting, and a shrouded housing for secure mating and enhanced safety. The connector is commonly used in power supplies, industrial equipment, appliances, and other systems requiring reliable high-power connections. It is glow-wire capable and complies with UL1977 finger-proof access requirements. Key Features 2-circuit male header from the Molex Sabre series 7.50 mm pitch power connector Right-angle through-hole PCB mounting Shrouded and polarized design for secure mating Locking ramp retention feature Tin-plated brass contacts Nylon housing with UL94V-0 flammability rating Glow-wire capable for appliance applications Operating temperature range: -40°C to +105°C Supports wire-to-board power connections Complies with UL1977 finger-proof safety requirements #CommonPartsLibrary #Connector #Molex #SabreConnector #PowerConnector #WireToBoard #PCBHeader #RightAngleConnector #ThroughHole #IndustrialElectronics #PowerDistribution #HighCurrentConnector

Board Mount Header, Right Angle, AT, 3 Pin, Snap Fit, Tin plate ATF13-3P-BM03 is a 3-position right-angle board-mount connector from the Amphenol AT Series, designed for rugged automotive, industrial, and off-road applications. It features a PCB-mounted male header with BoardLock™ snap-fit retention, providing a secure connection and reliable performance in harsh environments. When mated with a compatible AT Series plug, the connector achieves an IP67 environmental sealing rating, making it suitable for dust- and water-resistant applications. Key Features 3-position right-angle PCB-mount male header BoardLock™ snap-fit retention for secure PCB installation IP67-rated sealing when mated with compatible connector Rated current: 13 A Rated voltage: 250 VDC Operating temperature range: −55°C to +125°C #16 contact system with copper-alloy contacts Tin-plated contacts with nickel underplate Thermoplastic housing for durability Suitable for automotive, industrial, and harsh-environment applications Through-hole solder termination 4.30 mm contact pitch #CommonPartsLibrary #Connector #Amphenol #ATSeries #BoardMountConnector #AutomotiveConnector #IndustrialConnector #IP67 #RightAngleConnector #PCBConnector #BoardLock #HarshEnvironment #Interconnects

22 Position Receptacle Connector 0.059" (1.50mm) Surface Mount Tin 503154-2290 5031542290 is a 22-position surface-mount receptacle connector from the Molex CLIK-Mate series, designed for compact wire-to-board applications requiring secure locking and reliable electrical performance. Featuring a 1.50 mm pitch, dual-row configuration, and latch holder mechanism, it is ideal for use in industrial, automotive, medical, lighting, and general-purpose electronic equipment. The connector offers robust mechanical retention, pick-and-place compatibility, and operation over a wide temperature range. Key Features 22-position dual-row receptacle connector 1.50 mm pitch (CLIK-Mate series) Surface-mount (SMT) termination Secure latch holder locking mechanism Tin-plated copper alloy contacts Pick-and-place compatible for automated assembly Solder retention feature for improved manufacturing reliability Operating temperature range: -40°C to +105°C UL94 V-0 flame-retardant housing Suitable for automotive, industrial, medical, and lighting applications #CommonPartsLibrary #Connector #Molex #CLIKMate #WireToBoard #SMTConnector #BoardToWire #ElectronicConnector #IndustrialElectronics #AutomotiveElectronics #MedicalDevices #PCBDesign #InterconnectSolutions #5031542290

Connector Header Through Hole 18 position 0.100" (2.54mm) # TSW-118-07-G-S ## General Description The TSW-118-07-G-S is a through-hole board-to-board and wire-to-board interconnect header manufactured by Samtec. It belongs to the TSW series of standard terminal strip headers designed for reliable signal transmission in electronic assemblies, embedded systems, industrial controls, telecommunications equipment, instrumentation, and general-purpose printed circuit board applications. The component features precision-machined contacts, robust mechanical construction, and compatibility with a wide range of mating connectors. Its design supports secure electrical connections while maintaining excellent durability during repeated mating cycles and long-term operation in demanding environments. ## Key Features ### Mechanical Characteristics * Through-hole mounting configuration * Single-row terminal strip header design * Straight vertical orientation * Precision-machined contact system * High-reliability board-level interconnection ### Contact System * Gold-plated contact surface * Enhanced conductivity and signal integrity * Corrosion-resistant contact finish * Suitable for repeated insertion and removal cycles ### Electrical Characteristics * Low contact resistance * Reliable signal transmission * Suitable for low-power and signal-level applications * Stable electrical performance across operating conditions ### Material Construction * High-temperature thermoplastic insulator * Durable metallic contact structure * RoHS-compliant materials * Lead-free manufacturing compatibility ### Environmental Characteristics * Industrial-grade operating capability * Resistant to mechanical wear during mating cycles * Suitable for automated and manual assembly processes ### Application Areas * Embedded Systems * Microcontroller Development Boards * Industrial Automation Equipment * Telecommunications Hardware * Test and Measurement Instruments * Medical Electronics * Data Acquisition Systems * Prototyping Platforms * Consumer Electronic Devices * PCB Interconnection Applications ### Compliance * RoHS Compliant * Lead-Free Compatible * Industry-standard connector footprint ## Manufacturer Samtec Inc. ## Product Family TSW Series Terminal Strip Headers #Samtec #TSW11807GS #TerminalStripHeader #PCBConnector #BoardToBoardConnector #WireToBoardConnector #ElectronicsComponents #EmbeddedSystems #IndustrialElectronics #InterconnectSolutions #ThroughHoleConnector #ElectronicDesign #HardwareEngineering #PCBAssembly #CommonPartsLibrary #Connector #Header #TSW pin header 1x18 2.54mm