Inductors

10 µH Shielded Drum Core, Wirewound Inductor 7.5 A 30mOhm Max Nonstandard # Engineering Specification ## Product Name SRP1038A-100M ## General Description SRP1038A-100M is a shielded surface mount power inductor designed for use in high-efficiency DC-DC conversion and power management applications. The device is intended to support energy storage and current smoothing functions in switching regulator circuits, where stable inductance performance and low power loss are critical. The inductor utilizes a ferrite core construction with a shielded magnetic structure to minimize electromagnetic interference and reduce magnetic flux leakage. This enables improved circuit density and reduced noise coupling in compact electronic assemblies. The design is optimized for use in high current power conversion systems, including buck converters, point-of-load regulators, and distributed power architectures. The component is widely used in industrial, automotive, telecommunications, and embedded systems where reliable energy transfer, thermal stability, and efficient power delivery are required. Its surface mount form factor supports automated PCB assembly and compact system integration while maintaining mechanical robustness under thermal and electrical stress. The design emphasizes low direct current resistance, high current handling capability, and stable inductance behavior under load conditions. It is suitable for applications requiring efficient power conversion with minimal energy loss and stable electromagnetic performance. ## Functional Requirements ### Energy Storage The device shall store energy in a magnetic field during switching operation in power conversion circuits. ### Current Filtering The device shall smooth current ripple in switching regulator applications to maintain stable output conditions. ### Electromagnetic Shielding The device shall reduce electromagnetic interference through a shielded magnetic structure. ### Power Conversion Support The component shall support efficient operation in DC-DC conversion systems. ## Electrical Requirements ### Inductive Performance The device shall provide stable inductance characteristics suitable for power conversion and filtering applications. ### Low Loss Operation The inductor shall minimize resistive and core losses to improve overall system efficiency. ### High Current Capability The device shall support operation under elevated current conditions typical of switching power supplies. ### Thermal Stability The inductor shall maintain performance consistency under thermal loading and temperature variation. ## Mechanical Requirements ### Surface Mount Package The device shall be supplied in a surface mount configuration suitable for automated PCB assembly processes. ### Structural Integrity The component shall withstand mechanical stress during assembly, operation, and thermal cycling. ### PCB Integration The design shall support compact layout integration in multilayer printed circuit board systems. ## Environmental Requirements ### Operating Conditions The device shall operate reliably under conditions typical of industrial and embedded electronic systems. ### Thermal Performance The component shall maintain stable operation under continuous power cycling and heat generation. ### Storage and Handling The device shall retain structural and electrical integrity during storage, transportation, and handling. ## Quality Requirements ### Reliability The inductor shall provide consistent long-term performance under continuous electrical and thermal stress. ### Verification Electrical and thermal characteristics shall be validated through appropriate qualification and testing procedures. ### Compliance The product shall conform to applicable standards for magnetic components used in power electronics applications. ## Documentation Requirements Technical documentation shall include application guidance, layout recommendations for switching power designs, thermal considerations, electrical characteristics, and integration practices for DC-DC converter systems. ## Classification Tags #SRP1038A100M #PowerInductor #ShieldedInductor #SMDInductor #MagneticComponent #EnergyStorageInductor #DCDCConverter #BuckConverter #PowerElectronics #SMPSDesign #ElectromagneticCompatibility #EMIShielding #PCBDesign #ElectricalEngineering #EmbeddedPower #IndustrialElectronics #AutomotiveElectronics #CommonPartsLibrary #ComponentLibrary #EngineeringSpecification #PowerManagement #CircuitDesign #HighCurrentInductor

5.6 nH Unshielded Wirewound Inductor 700 mA 75mOhm Max 0603 (1608 Metric) ## Engineering Specification ## General Description The **0603CS-5N6XJRW** is a Coilcraft **0603CS series ceramic-core chip inductor** designed for RF, microwave, and high-frequency electronic circuit applications. It provides low-value inductance in a compact surface-mount package and is suitable for impedance matching, RF filtering, tuning networks, resonant circuits, oscillators, and general high-frequency signal-path designs. The component is commonly used in wireless modules, communication equipment, RF front-end circuits, test hardware, and compact printed circuit board assemblies requiring stable inductive performance at high frequencies. ## Device Identification Manufacturer Part Number: **0603CS-5N6XJRW** Manufacturer: **Coilcraft** Product Series: **0603CS** Device Category: **Passive Electronic Component** Device Type: **Fixed Inductor** Inductor Type: **RF Chip Inductor** Construction Type: **Unshielded Wirewound Ceramic-Core Inductor** Mounting Type: **Surface Mount** ## Functional Description The device functions as a fixed-value RF inductor used to provide frequency-dependent impedance, energy storage, resonance control, and impedance transformation in electronic circuits. It is designed for high-frequency operation where compact size, low inductance value, and stable RF behavior are required. The component is suitable for use in matching networks, filters, resonant circuits, oscillators, and RF signal conditioning stages. ## Electrical Description The inductor has a nominal inductance of **five point six nanohenries** with **five percent tolerance**. It is rated for **seven hundred milliamps** current and has a maximum DC resistance of **seventy-five milliohms**. The device is intended for RF applications requiring low resistance, high self-resonant frequency, and predictable inductive behavior. It should be operated within the manufacturer’s specified electrical, thermal, and current limits. ## Mechanical Description The component is supplied in an **0603 surface-mount package**, also known as **1608 metric size**. Its compact chip construction supports dense PCB layouts and automated pick-and-place assembly. The unshielded construction is suitable for RF signal applications where board layout, component spacing, and parasitic effects are properly controlled. ## Material and Construction Description The device uses a ceramic-core wirewound construction to support stable high-frequency inductance characteristics. The termination system is designed for standard surface-mount soldering processes and is suitable for compact RF circuit board assemblies. ## Mounting and Assembly Description The **0603CS-5N6XJRW** is intended for surface-mount PCB assembly using standard reflow soldering processes. Proper land pattern design, solder paste control, placement accuracy, and reflow profile should follow Coilcraft recommendations. RF layout practices should be applied, including short trace lengths, controlled impedance routing, minimized parasitic capacitance, and appropriate spacing from nearby conductive or magnetic structures. ## Application Suitability The device is suitable for RF matching networks, antenna tuning, wireless communication circuits, RF filters, resonant circuits, oscillators, broadband RF designs, cellular modules, Wi-Fi and Bluetooth hardware, test equipment, and compact high-frequency embedded electronics. ## Design Considerations The design should account for inductance tolerance, Q factor, self-resonant frequency, DC resistance, current rating, operating temperature, PCB layout parasitics, solder joint reliability, and interaction with nearby components. For RF applications, final performance should be validated in the actual PCB layout because trace geometry, grounding, and component placement can affect impedance and resonance behavior. ## Hashtags #commonpartslibrary #inductor #rfinductor #chipinductor #coilcraft #coilcraftinductor #0603cs #0603component #smdinductor #surfacemount #wirewoundinductor #ceramiccoreinductor #passivecomponent #rfdesign #highfrequency #impedancematching #rffilter #antennatuning #wirelesshardware #communicationequipment #pcbdesign #hardwaredesign #electronicscomponents #electronicparts #componentlibrary #engineeringparts #electronicsengineering

3.9 nH Unshielded Wirewound Inductor 700 mA 80mOhm Max 0603 (1608 Metric) ## Engineering Specification ## General Description The **0603CS-3N9XJRW** is a Coilcraft **0603CS series ceramic-core chip inductor** designed for RF, microwave, and high-frequency circuit applications. It provides low-value inductance in a compact surface-mount package and is suitable for impedance matching, RF filtering, tuning networks, resonant circuits, and general high-frequency signal-path designs. The component is commonly used in wireless modules, RF front-end circuits, communication equipment, test hardware, and compact printed circuit board assemblies requiring stable high-frequency inductive performance. ## Device Identification Manufacturer Part Number: **0603CS-3N9XJRW** Manufacturer: **Coilcraft** Product Series: **0603CS** Device Category: **Passive Electronic Component** Device Type: **Fixed Inductor** Inductor Type: **RF Chip Inductor** Construction Type: **Unshielded Wirewound Ceramic-Core Inductor** Mounting Type: **Surface Mount** ## Functional Description The device functions as a fixed-value RF inductor used to store magnetic energy and provide frequency-dependent impedance in electronic circuits. It is designed for high-frequency performance where low inductance value, compact size, and predictable RF behavior are required. The component can be used in matching networks, RF filters, oscillators, resonant circuits, and signal conditioning paths. ## Electrical Description The inductor has a nominal inductance of **three point nine nanohenries** with **five percent tolerance**. It is rated for **seven hundred milliamps** current and has a maximum DC resistance of **eighty milliohms**. The part provides a minimum self-resonant frequency of **six point nine gigahertz** and a minimum Q value suitable for RF circuit applications. It should be operated within the manufacturer’s specified current, temperature, and electrical limits. ## Mechanical Description The component is supplied in an **0603 surface-mount package**, also known as **1608 metric size**. It is designed for compact PCB layouts and automated pick-and-place assembly. The unshielded chip construction is suitable for high-frequency signal applications where board layout and nearby component placement are carefully controlled. ## Material and Construction Description The device uses a ceramic-core wirewound construction, which supports stable high-frequency inductance characteristics. The specified configuration includes RoHS-compliant matte tin over nickel over silver-platinum-glass frit termination, suitable for standard surface-mount soldering processes. ## Mounting and Assembly Description The **0603CS-3N9XJRW** is intended for surface-mount PCB assembly. Proper land pattern design, solder paste control, placement accuracy, and reflow soldering profile should follow Coilcraft recommendations. RF layout practices should be observed, including short trace lengths, controlled impedance routing, proper grounding, and minimized parasitic capacitance. ## Application Suitability The device is suitable for RF matching networks, wireless communication circuits, antenna tuning, filters, oscillators, resonant circuits, broadband RF designs, cellular modules, Wi-Fi and Bluetooth hardware, test equipment, and high-frequency embedded electronics. ## Design Considerations The design should account for inductance tolerance, Q factor, self-resonant frequency, DC resistance, current rating, operating temperature, layout parasitics, solder joint reliability, and interaction with nearby magnetic or conductive structures. For RF applications, the final performance should be validated in the actual PCB layout because trace geometry and component placement can affect impedance and resonance behavior. ## Hashtags #commonpartslibrary #inductor #rfinductor #chipinductor #coilcraft #coilcraftinductor #0603cs #0603component #smdinductor #surfacemount #wirewoundinductor #ceramiccoreinductor #passivecomponent #rfdesign #highfrequency #impedancematching #rffilter #wirelesshardware #communicationequipment #pcbdesign #hardwaredesign #electronicscomponents #electronicparts #componentlibrary #engineeringparts #electronicsengineering

Hot Swap Controller 1 Channel General Purpose 32-LQFN (5x5) The NCP81428MNTXG is a high-performance multi-phase synchronous buck controller designed for CPU, GPU, FPGA, ASIC, and high-current core power applications requiring accurate voltage regulation, fast transient response, and high efficiency. The device supports multi-phase operation with integrated gate drivers and advanced control architecture optimized for modern low-voltage, high-current power rails. It is intended for applications requiring dynamic voltage scaling, precise load-line regulation, and reliable system power management in computing, networking, telecommunications, and industrial platforms. The controller operates with external MOSFET stages and supports flexible power stage configuration for optimized thermal and efficiency performance. It incorporates differential voltage sensing, programmable protection features, current balancing between phases, and high-speed transient compensation to maintain stable operation under rapidly changing load conditions. Engineering Specification Manufacturer onsemi Manufacturer Part Number NCP81428MNTXG Device Type Multi-Phase Synchronous Buck Controller with Integrated Gate Drivers Control Topology Voltage Mode Multi-Phase PWM Control Phase Configuration Dual-Phase Controller Architecture Application Focus CPU Core Power GPU Core Regulation FPGA Power Rails ASIC Core Supplies High-Current DC-DC Regulation Input Supply Range Supports Low-Voltage Bias Supply Operation for Digital Power Systems Output Voltage Regulation Programmable Low-Voltage Output Regulation with Differential Remote Sense Capability Switching Frequency Programmable PWM Switching Frequency with Multi-Phase Interleaving Gate Driver Integration Integrated High-Side and Low-Side MOSFET Gate Drivers Current Sensing Supports Inductor DCR Sensing and Sense Resistor Current Monitoring Load-Line Support Programmable Load-Line Regulation and Droop Compensation Voltage Positioning Adaptive Voltage Positioning for Improved Transient Performance Protection Features Overcurrent Protection Overvoltage Protection Undervoltage Protection Thermal Protection Short-Circuit Protection Power-Good Monitoring Power Management Features Soft-Start Control Enable Functionality Phase Balancing Fault Monitoring Sequencing Support Compensation External Compensation Network Support for Loop Stability Optimization Efficiency Features Synchronous Rectification Support Multi-Phase Interleaving for Reduced Ripple Current Optimized Gate Drive Timing Package Type QFN Surface-Mount Package Mounting Type Surface Mount Technology Temperature Range Industrial Operating Temperature Range Target Applications Server Motherboards High-Performance Embedded Computing Networking Equipment Telecommunications Infrastructure Industrial Processing Systems Graphics and Accelerator Platforms #commonpartslibrary #integratedcircuit #powermanagement #hotswapcontrollers

15 µH Shielded Drum Core, Wirewound Inductor 3.5 A 92mOhm Max Nonstandard The SRP7050TA-150M is a high-performance photovoltaic module designed for utility-scale and large commercial solar power applications. The module utilizes advanced monocrystalline cell technology to deliver high energy conversion efficiency, reliable power generation, and long-term operational stability under varying environmental conditions. Its robust mechanical construction and optimized electrical characteristics provide dependable performance in demanding outdoor installations, including regions exposed to high wind loads, elevated temperatures, and extended solar irradiance. The module is engineered to support high system voltage configurations while maintaining low degradation rates and enhanced energy yield over its service life. The design incorporates reinforced framing, tempered high-transmission glass, and weather-resistant encapsulation materials to ensure durability against moisture ingress, ultraviolet exposure, and mechanical stress. The product is suitable for fixed-tilt and tracker-based mounting systems and is compatible with standard industry installation practices. Electrical performance is optimized for maximum power output with improved temperature behavior and reduced resistive losses. The module supports efficient integration into modern photovoltaic systems requiring high-density energy production and reliable long-term operation. Safety and quality compliance are aligned with internationally recognized photovoltaic module standards for performance, durability, and environmental resilience. The SRP7050TA-150M is intended for grid-connected solar energy systems where high efficiency, operational reliability, and reduced balance-of-system costs are critical project requirements. #commonpartslibrary #inductor