Sensors

ARM® Cortex®-M0+ MSPM0 C Microcontroller IC 32-Bit 24MHz 16KB (16K x 8) FLASH 8-DSBGA (0.86x1.6) MSPM0C110x microcontrollers (MCUs) are part of the MSP highly-integrated ultra-low-power 32-bit MCU family based on the enhanced Arm® Cortex®-M0+ core platform operating at up to 24MHz frequency. These costoptimized MCUs offer high-performance analog peripheral integration, support extended temperature ranges from -40°C to 125°C, and operate with supply voltages from 1.62V to 3.6V. The MSPM0C110x devices provide up to 16KB embedded flash program memory with 1KB SRAM. These MCUs incorporate a high-speed on-chip oscillator with an accuracy from -2% to +1.2%, eliminating the need for an external crystal. Additional features include a 1-channel DMA, CRC-16 accelerator, and a variety of highperformance analog peripherals such as one 12-bit 1.5Msps ADC with VDD as the voltage reference, and an on-chip temperature sensor. These devices also offer intelligent digital peripherals such as one 16-bit advanced timer, two 16-bit general purpose timer, one windowed watchdog timer, and a variety of communication peripherals including one UART, one SPI, and one I2C. These communication peripherals offer protocol support for LIN, IrDA, DALI, Manchester, smart card, SMBus, and PMBus. The TI MSPM0 family of low-power MCUs consists of devices with varying degrees of analog and digital integration let customers find the MCU that meets their project needs. The architecture combined with extensive low-power modes is optimized to achieve extended battery life in portable measurement applications. MSPM0C110x MCUs are supported by an extensive hardware and software ecosystem with reference designs and code examples to get the design started quickly. Development kits include a LaunchPad™ kit available for purchase and design files for a target-socket board. TI also provides a free MSP Software Development Kit (SDK), which is available as a component of Code Composer Studio™ IDE desktop and cloud version within the TI Resource Explorer. MSPM0 MCUs are also supported by extensive online collateral, training with MSP Academy, and online support through the TI E2E™ support forums. Features • Core – Arm® 32-bit Cortex®-M0+ CPU, frequency up to 24MHz • Operating characteristics – Extended temperature: –40°C to 125°C – Wide supply voltage range: 1.62V to 3.6V • Memories – Up to 16KB of flash – 1KB of SRAM • High-performance analog peripherals – One analog-to-digital converter (ADC) with up to 10 total external channels, 1.7Msps at 10 bit or 1.5Msps at 12 bit with VDD as the voltage reference – Configurable 1.4V or 2.5V internal ADC voltage reference (VREF) – Integrated temperature sensor – Integrated supply monitor • Optimized low-power modes – RUN: 87µA/MHz – STOP: 609µA at 4MHz, 311µA at 32kHz – STANDBY: 5µA with SRAM retention – SHUTDOWN: 200nA • Intelligent digital peripherals – 1-channel DMA controller dedicated for ADC – Three timers supporting up to 14 PWM channels • One 16-bit advanced timers with deadband support up to 8 PWM channels • One 16-bit general purpose timer with 4 capture/compares • One 16-bit general purpose timer with 2 capture/compares – Windowed watchdog timer – BEEPER generating 1kHz, 2kHz, 4kHz, or 8kHz square wave to drive the external beeper • Enhanced communication interfaces – One UART interface supporting LIN, IrDA, DALI, smart card, Manchester and low-power operation in STANDBY mode – One I2C interface supporting FM+ (1Mbps), SMBus, PMBus, and wakeup from STOP mode – One SPI supporting up to 12Mbps • Clock system – Internal 24MHz oscillator with an accuracy from -2% to +1.2% (SYSOSC) – Internal 32kHz low-frequency oscillator (LFOSC) • Data integrity – Cyclic redundancy checker (CRC-16) • Flexible I/O features – Up to 18 GPIOs – Two 5V-tolerant open-drain IOs • Development support – 2-pin serial wire debug (SWD) • Package options – 20-pin TSSOP (PW) – 20-pin VSSOP (DGS) – 20-pin WQFN (RUK) – 16-pin SOT (DYY) – 8-pin SOT (DDF) – 8-pin WSON (DSG) – 8-pin DSBGA (YCJ) • Family members (also see Device Comparison) – MSPS003F4: 16KB of flash, 1KB of RAM – MSPS003F3: 8KB of flash, 1KB of RAM – MSPM0C1104: 16KB of flash, 1KB of RAM – MSPM0C1103: 8KB of flash, 1KB of RAM • Development kits and software (also see Tools and Software) – LP-MSPM0C1104 LaunchPad™ development kit – MSP Software Development Kit (SDK) 2 Applications • Battery charging and management • Power supplies and power delivery • Personal electronics • Building security and fire safety • Connected peripherals and printers • Grid infrastructure • Smart metering • Communication modules • Medical and healthcare • Lighting #MSPM0C1104S8YCJR #MSPM0C1104 #TexasInstruments #CortexM0Plus #Microcontroller #EmbeddedSystems #LowPowerMCU #IoT #WearableDevices #IndustrialControl #ConsumerElectronics #ADC #UART #SPI #I2C #PWM #TI #ElectronicsDesign #PCBDesign #EmbeddedDevelopment

Bluetooth, WiFi 802.11b/g/n/ax, Bluetooth v5.4 Transceiver Module 2.4GHz Integrated, Chip Surface Mount Silicon Labs SiWG917 module is our lowest power Wi-Fi 6 plus Bluetooth LE 5.4, ideal for ultra-low power IoT wireless devices using Wi-Fi®, Bluetooth, Matter, and IP networking for secure cloud connectivity. It is optimal for developing battery operated devices that need long battery life. SiWG917 module includes an ultra-low power Wi-Fi 6 plus Bluetooth Low Energy (LE) 5.4 wireless CPU subsystem, and an integrated micro-controller (MCU) application subsystem, security, peripherals and power management subsystem all in a single 16 x 21.1 x 2.3 mm package. The wireless subsystem consists of a multi-threaded Network Wireless Processor (NWP) running up to 160 MHz, baseband digital signal processing, analog front end, 2.4 GHz RF transceiver and integrated power amplifier. The application subsystem consists of an ARM® Cortex®-M4 running up to 180 MHz, embedded SRAM, flash, ultra-low power sensor hub, and matrix vector processor. The ARM® Cortex®-M4 is dedicated for peripheral and application-related processing, while the NWP runs the wireless and networking stacks on independent threads, thus providing a fully integrated solution that is ready for a wide range of embedded wireless IoT applications. The modules come with modular radio type approvals for various countries, including USA (FCC), Canada (IC/ISED) and Japan (MIC), and are in compliance with the relevant EN standards (including EN 300 328 v2.2.2) for the conformity with the directives and regulations in EU and UK. KEY FEATURES • Wi-Fi 6 Single Band 2.4 GHz 20 MHz 1x1 stream IEEE 802.11 b/g/n/ax • Bluetooth LE 5.4 • Single chip Matter Over Wi-Fi Solution • ARM® Cortex® M4 Processor with FPU subsystem up to 180 MHz with rich set of Digital and Analog Peripherals. • Wi-Fi 6 Benefits: TWT for improved efficiency and longer battery life, MUMIMO/OFDMA for Higher Throughput, network capacity and low latency • Best in Class Device and Wireless Security • WLAN Tx power up to +17.5 dBm with integrated PA • Bluetooth LE Tx power up to +17 dBm with integrated PA • WLAN Rx sensitivity as low as -95.5 dBm • Wi-Fi 4 Standby Associated mode current: 71 μA @ 1-second listen interval • Embedded Flash option up to 8 MB/ optional external Flash up to 16 MB • Embedded PSRAM option up to 2 MB/ optional external PSRAM option up to 16 MB • Ultra-low power sensor hub peripherals • Matrix Vector Processor (MVP) • Embedded Wi-Fi, Bluetooth LE, Matter, and networking stacks supporting wireless coexistence • Three software-configurable MCU application memory options for sharing the RAM between the wireless, system, and application (192/256/320 KB) • Operating temperature: -40 to +85 ºC • Operating supply range: 3.0 to 3.63 V • Supply voltage for GPIOs: 1.71 to 3.63 V #WiFi6 #BluetoothLE54 #IoTModule #WirelessSoC #SiliconLabs #EmbeddedSystems #SmartHome #IndustrialIoT #LowPowerDesign #RFModule #ConnectedDevices #EdgeComputing #MatterReady #PCBDesign #ElectronicsEngineering

Fully calibrated temperature and humidity sensor with digital output and I²C interface The AHT30 is a high-precision digital temperature and humidity sensor developed by AOSONG Electronics. It integrates a capacitive humidity sensing element, a temperature sensor, and a dedicated ASIC in a compact DFN package. The device provides fully calibrated digital output through an I²C interface, offering low power consumption, excellent long-term stability, and reliable performance in demanding environmental conditions. It is widely used in smart home devices, HVAC systems, industrial controls, weather monitoring equipment, IoT devices, and consumer electronics. Key Features Fully calibrated digital temperature and humidity sensor I²C digital communication interface Relative humidity measurement range: 0% to 100% RH Temperature measurement range: -40°C to +85°C High accuracy: up to ±2% RH and ±0.3°C (typical) Wide operating voltage: 2.2 V to 5.5 V Low power consumption Fast response time Excellent long-term stability Strong anti-interference capability Compact DFN package suitable for reflow soldering Optimized ASIC with improved MEMS sensing technology Applications Smart home and IoT devices HVAC and air quality monitoring Weather stations Consumer electronics Medical equipment Industrial monitoring and control systems Refrigerators, dehumidifiers, and air conditioners Hashtags #AHT30 #AOSONG #TemperatureSensor #HumiditySensor #EnvironmentalSensor #I2C #MEMS #SmartHome #IoT #HVAC #IndustrialAutomation #WeatherMonitoring #EmbeddedSystems #ElectronicsDesign #PCBDesign

ESP32-WROOM32 ESP32 802.11 b/g/n (WiFi/WLAN/Wi-Fi 4), Bluetooth® Smart 4.x Low Energy (BLE) Transceiver 2.4GHz Evaluation Board ESP32-POE is an ESP32-based IoT development board that combines Wi-Fi, Bluetooth, Ethernet connectivity, and Power over Ethernet (PoE) in a single platform. It is designed for industrial automation, smart home systems, remote monitoring, and other network-connected embedded applications where both power and data can be delivered through a single Ethernet cable. The board supports the ESP32 dual-core processor and provides expansion interfaces for sensors, storage, and peripherals. FEATURES • ESP32-WROOM-32 WiFi/BLE module • Ethernet 100Mb interface with IEEE 802.3 PoE support • LiPo battery charger • LiPo battery connector • UEXT connector • User button • Reset button • Micro USB with programmer for ESP32 programming • MicroSD card • Two extension connectors 0.1" step spaced at 1" • PCB dimensions: (75 x 28)mm ~ (3 x 1)" #ESP32 #ESP32POE #IoT #Ethernet #PoE #WiFi #Bluetooth #EmbeddedSystems #IndustrialIoT #SmartHome #OpenSourceHardware #Microcontroller #EdgeComputing #Automation #MakerProjects

Optical Sensor Through-Beam 0.197" (5mm) PCB Mount The EE-SX4081 specification defines the engineering requirements for a slot-type photomicrosensor designed for non-contact object detection and position sensing in electronic and electromechanical systems. This specification establishes the functional, electrical, mechanical, environmental, and quality requirements necessary to ensure accurate optical sensing, reliable switching performance, and long-term operational stability. The component is intended for use in industrial automation, office equipment, consumer electronics, and embedded control systems requiring precise detection of object presence, motion, or position. The integrated infrared emitter and phototransistor receiver provide dependable sensing through interruption of the optical path, enabling high-speed, contactless detection in compact system designs. Engineering Requirements The photomicrosensor shall be manufactured using qualified optoelectronic components and controlled production processes to ensure consistent sensing performance, mechanical integrity, and long service life. The optical assembly shall maintain accurate alignment between the emitter and receiver to provide stable detection characteristics throughout the specified operating conditions. Electrical characteristics shall provide reliable switching response, stable output behavior, and low power consumption while maintaining consistent sensitivity across the intended operating voltage and temperature ranges. The sensor shall exhibit reliable performance under normal ambient light conditions and shall maintain signal integrity during continuous operation. Mechanical construction shall ensure precise slot dimensions, secure mounting capability, and resistance to vibration, mechanical shock, and thermal cycling encountered during normal operation. The package shall be suitable for printed circuit board assembly and shall withstand standard soldering and handling processes without degradation. Workmanship shall be free from defects including contamination, optical misalignment, package damage, corrosion, or structural irregularities that could affect sensing accuracy or reliability. Inspection, validation, and testing shall be performed using calibrated equipment and controlled quality procedures to verify compliance with engineering requirements. Any deviation from this specification shall require formal engineering evaluation, documented technical justification, and approval through the established engineering change control process before implementation. Documentation Supporting documentation shall include engineering drawings, electrical specifications, optical performance data, qualification reports, inspection records, and revision-controlled manufacturing documentation. All documentation shall be maintained under formal configuration management and quality assurance systems to ensure complete traceability throughout the product lifecycle. Revision Control Any modification to this specification shall be processed through the formal engineering change management system. All revisions shall undergo technical review, validation, and approval before release to ensure continued compliance with design intent and applicable engineering standards. #EngineeringSpecification #Photomicrosensor #OpticalSensor #SlotSensor #IndustrialAutomation #EmbeddedSystems #Optoelectronics #QualityAssurance #EngineeringDocumentation #ElectronicComponents

27 Hz ~ 18 kHz Digital, I2S Microphone MEMS (Silicon) 1.62 V ~ 1.98 V Omnidirectional (-37dB ±1dB @ 94dB SPL) Solder Pads TDK InvenSense T5848 TDK T5848 is a low-noise digital MEMS microphone with a bottom-port acoustic interface and industry-standard I²S digital audio output. The device integrates a MEMS microphone element, impedance converter, ADC, decimation filtering, anti-aliasing filtering, power management, and a 24-bit digital audio interface in a compact 3.5 mm × 2.65 mm × 0.98 mm package. The T5848 supports multiple operating modes including High Quality, Low Power, Sleep, and Always-On Voice (AOV) modes, making it ideal for battery-powered and voice-activated applications. With up to 68 dBA SNR, 133 dB SPL acoustic overload point, and extended frequency response from 27 Hz to 18 kHz, the T5848 is optimized for wearables, IoT devices, smart TVs, gaming systems, teleconferencing equipment, voice assistants, and always-listening audio applications. Search Keywords: T5848, TDK T5848, MEMS Microphone, Digital MEMS Microphone, I2S Microphone, Bottom Port Microphone, Always On Voice Microphone, AOV Microphone, Low Power MEMS Microphone, Wearable Microphone, IoT Audio Sensor, Voice Recognition Microphone, Digital Audio Input, 24-bit I2S Microphone, DSP Microphone, Smart Speaker Microphone, Voice Assistant Microphone, TDK InvenSense Microphone, Teleconference Audio Microphone, Embedded Audio Sensor Hashtags: #T5848 #TDK #InvenSense #MEMSMicrophone #DigitalMicrophone #I2SMicrophone #AudioSensor #AlwaysOnVoice #VoiceRecognition #WearableElectronics #IoTDevices #EmbeddedAudio #VoiceAssistant #SmartDevices #DSP #ElectronicsDesign #PCBDesign #EmbeddedSystems #HardwareEngineering #AudioElectronics

Battery Battery Protection IC Lithium Ion/Polymer SOT-23-6 S-8261ABJMD-G3JT2G is a high-accuracy lithium-ion/lithium-polymer battery protection IC designed for single-cell battery packs. It integrates voltage detection and timing circuits to protect rechargeable batteries against overcharge, overdischarge, overcurrent, and short-circuit conditions, helping improve battery safety, reliability, and lifespan. The device is commonly used in portable electronics, battery packs, IoT devices, and handheld equipment. It is housed in a compact SOT-23-6 package suitable for space-constrained designs. Key Features Single-cell Li-ion / Li-polymer battery protection IC High-accuracy overcharge detection High-accuracy overdischarge detection Overcurrent and short-circuit protection Built-in delay circuits to prevent false triggering Low current consumption (typical operating current in the µA range) Wide operating voltage range Support for 0 V battery charging function Compact SOT-23-6 package RoHS compliant and lead-free version available Typical Applications Li-ion battery packs Li-polymer battery packs Portable consumer electronics Wireless sensors and IoT devices Handheld instruments Rechargeable battery-powered equipment #BatteryProtectionIC #LiIonBattery #LiPoBattery #PowerManagement #BatteryPackProtection #OverchargeProtection #OverdischargeProtection #ShortCircuitProtection #SOT23 #ABLIC #SeikoInstruments #PortableElectronics #RechargeableBattery #PMIC #SingleCellBattery

Mini 2.45 GHz Antenna The 2450AT18A100E is a high-frequency ceramic SMT antenna featuring a small 3.2 mm × 1.6 mm × 1.3 mm package, optimized for space-constrained RF designs. It operates from 2400 MHz to 2500 MHz with a 50 Ω impedance and provides a compact alternative to traditional PCB trace antennas while maintaining reliable RF performance. Key Features Operating Frequency: 2400 MHz – 2500 MHz (2.4 GHz ISM Band) Center Frequency: 2450 MHz Antenna Type: Mini Ceramic Chip Antenna / SMT RF Antenna Package Size: 3.2 mm × 1.6 mm × 1.3 mm Impedance: 50 Ω Peak Gain: Approximately +0.5 dBi (typical) Average Radiation Efficiency: Approximately 76% (based on Johanson evaluation board) Maximum Input Power: 2 W continuous wave (CW) Operating Temperature Range: -40 °C to +125 °C Mounting Type: Surface Mount Technology (SMT) Applications: Bluetooth / BLE devices Wi-Fi 2.4 GHz modules Zigbee / IEEE 802.15.4 systems IoT sensors and embedded wireless products #2450AT18A100E #JohansonTechnology #ChipAntenna #SMTAntenna #RFDesign #2GHzAntenna #Bluetooth #WiFi #Zigbee #IoT #WirelessCommunication #EmbeddedSystems #PCBDesign #RFAntenna #Antena #Chip #SurfaceMount

Touchscreen Controller 2 Wire Capacitive I2C Interface 20-VQFN (3x3) The MTCH2120-V/REB specification defines the engineering requirements for a capacitive touch sensing controller integrated circuit designed for human-machine interface applications in embedded electronic systems. This specification establishes the functional, electrical, mechanical, environmental, and quality requirements necessary to ensure accurate touch detection, stable system performance, and reliable operation across consumer, industrial, and embedded environments. The device is intended for use in applications requiring touch-based user input such as control panels, interface buttons, and capacitive sensing surfaces. It provides robust sensing performance with immunity to noise and environmental variation, enabling reliable detection of touch events in compact and low-power electronic designs. Engineering Requirements The integrated circuit shall be manufactured using qualified semiconductor fabrication processes to ensure consistent sensing performance, low power consumption, and long-term operational stability. The device shall support reliable capacitive touch detection under defined electrical and environmental conditions without degradation of sensitivity or accuracy. The sensing architecture shall provide stable touch event detection with immunity to electrical noise, environmental interference, and parasitic capacitance variations. The system shall maintain consistent performance across intended operating conditions including temperature variation and supply voltage fluctuation. Electrical characteristics shall ensure stable digital communication, accurate sensing response, and reliable operation during startup, normal operation, and power transitions. The device shall maintain functional integrity during dynamic system conditions without false triggering or loss of sensitivity. Mechanical and package construction shall be suitable for surface-mount assembly and shall ensure robustness during soldering, handling, and long-term operation. Workmanship shall be free from defects such as contamination, cracks, bonding issues, or structural inconsistencies that could impact electrical or mechanical reliability. Inspection, validation, and testing shall be performed using controlled procedures and calibrated equipment to ensure compliance with all applicable engineering and quality requirements. Any deviation from this specification shall require formal engineering review, documented justification, and approval through established change control processes. Documentation Supporting documentation shall include official datasheets, reference design materials, electrical characterization reports, qualification data, inspection records, and revision-controlled manufacturing documentation. All documentation shall be maintained under formal configuration management and quality assurance systems to ensure traceability and consistency. Revision Control All modifications to this specification shall be managed through formal engineering change control procedures. Each revision shall undergo technical evaluation, validation, and approval prior to implementation to ensure continued compliance with design intent and applicable standards. #EngineeringSpecification #CapacitiveTouch #HMI #MicrochipTechnology #EmbeddedSystems #UserInterface #SensorIC #LowPowerDesign #ElectronicsDesign #QualityAssurance #EngineeringDocumentation

100 kOhms 0.5W, 1/2W PC Pins Through Hole Trimmer Potentiometer Cermet 25.0 Turn Top Adjustment The 3299W-1-104LF specification defines the engineering requirements for a precision multi-turn trimmer potentiometer intended for accurate calibration and adjustment in electronic circuits. This specification establishes the functional, mechanical, electrical, environmental, and quality requirements necessary to ensure stable resistance adjustment, long-term reliability, and consistent performance in industrial and electronic systems. The component is intended for use in applications requiring fine-tuned analog adjustment such as calibration circuits, offset trimming, gain control, and sensor conditioning. It provides stable mechanical adjustment characteristics and precise resistance variation suitable for repeated fine adjustment in controlled electronic designs. Engineering Requirements The trimmer potentiometer shall be manufactured using precision cermet resistive elements and high-reliability mechanical construction to ensure stable electrical performance and long operational life. The device shall maintain consistent resistance behavior across its adjustment range without degradation under normal operating conditions. The mechanical design shall support smooth multi-turn adjustment with controlled torque and stable wiper contact performance. The adjustment mechanism shall provide repeatable positioning without backlash or mechanical instability during operation. Electrical characteristics shall ensure stable resistance output, low noise behavior, and reliable contact performance under varying environmental conditions. The device shall maintain functional integrity under temperature variation, mechanical vibration, and normal electrical loading conditions. Mechanical and package construction shall be suitable for through-hole PCB assembly and shall ensure robust mounting stability during soldering and long-term operation. Workmanship shall be free from defects such as contamination, misalignment, cracking, or plating irregularities that may affect electrical or mechanical reliability. Inspection, validation, and testing shall be performed using controlled procedures and calibrated equipment to ensure compliance with all applicable engineering and quality requirements. Any deviation from this specification shall require formal engineering review, documented justification, and approval through established change control processes. Documentation Supporting documentation shall include official datasheets, electrical characterization data, mechanical drawings, inspection records, qualification reports, and revision-controlled manufacturing documentation. All records shall be maintained under formal configuration management and quality assurance systems to ensure traceability and consistency. Revision Control Any modification to this specification shall be managed through the formal engineering change control system. All revisions shall undergo technical review, validation, and approval prior to implementation to ensure continued compliance with design intent and applicable standards. #EngineeringSpecification #TrimmerPotentiometer #PrecisionAdjustment #CermetResistor #AnalogCalibration #ElectronicsDesign #IndustrialElectronics #QualityAssurance #Manufacturing #EngineeringDocumentation