Sensors
A sensor is a device that detects and measures a physical property or phenomenon, such as temperature, pressure, or motion. Sensors are used in a wide range of applications, including industrial automation, environmental monitoring, healthcare, and transportation. Flux.ai is the world's largest community-driven public library of sensors, with footprints, symbols, datasheets, and simulation models. Our extensive collection of sensors covers a variety of use cases and industries, making it easy to find the perfect sensor for your application. Whether you need a temperature sensor for HVAC systems, a pressure sensor for automotive applications, or a motion sensor for security systems, Flux.ai has you covered. Our comprehensive library of sensors is constantly updated with the latest and most innovative technologies, ensuring that you have access to the best sensors available. So, if you need a sensor for your next project, be sure to check out Flux.ai and take advantage of our extensive collection and expert support.
ESP32-C3
Bluetooth, WiFi 802.11b/g/n, Bluetooth v5.0 Transceiver Module 2.402GHz ~ 2.48GHz Antenna Not Included Surface Mount The ESP32-C3 is a low-power, highly integrated 32-bit microcontroller (MCU) from Espressif Systems that combines 2.4 GHz Wi-Fi and Bluetooth® 5 Low Energy (BLE) connectivity in a single chip. Built around a single-core RISC-V processor running at up to 160 MHz, it is designed for secure, cost-effective IoT and embedded applications. The ESP32-C3 offers excellent wireless performance, low power consumption, robust security features, and a rich set of peripherals, making it ideal for smart home devices, industrial automation, wearable electronics, wireless sensors, and consumer IoT products. Key Features 32-bit RISC-V single-core CPU running up to 160 MHz Integrated 2.4 GHz Wi-Fi (802.11 b/g/n) and Bluetooth® 5 LE Low-power architecture with multiple sleep modes for battery-powered devices Advanced security features including Secure Boot, Flash Encryption, AES, SHA, RSA, HMAC, and hardware random number generator (RNG) Rich peripheral set including GPIO, UART, SPI, I²C, I²S, PWM, ADC, TWAI (CAN), USB Serial/JTAG, and timers Supports external QSPI flash memory and OTA (Over-the-Air) firmware updates Compact package options suitable for space-constrained embedded designs Fully supported by the ESP-IDF, Arduino, and MicroPython development ecosystems #ESP32C3 #Espressif #RISCV #WiFi #BluetoothLE #IoT #EmbeddedSystems #Microcontroller #WirelessMCU #LowPower #SmartHome #IndustrialIoT #SecureMCU #EdgeComputing #FirmwareDevelopment
12 Uses0 StarsE22-900M22S
868/915MHz SPI SMD LoRa Module E22-900M22S is a compact, industrial-grade LoRa® wireless transceiver module developed by Ebyte, based on the Semtech SX1262 RF chipset. Operating in the 868/915 MHz ISM band, it communicates through an SPI interface and is designed for long-range, low-power wireless data transmission. The module offers excellent receiver sensitivity, strong anti-interference performance, and supports both LoRa and FSK modulation, making it suitable for smart metering, industrial automation, IoT sensor networks, remote monitoring, and wireless control applications. Key Features Based on the Semtech SX1262 LoRa transceiver Operates in the 850–930 MHz frequency range (optimized for 868/915 MHz ISM bands) SPI interface with data rates up to 10 Mbps Maximum transmit power of +22 dBm (160 mW) Receiver sensitivity up to −147 dBm (LoRa mode) Supports LoRa and FSK modulation Programmable air data rate up to 62.5 kbps (LoRa) and 300 kbps (FSK) Long communication range of up to 7 km under ideal line-of-sight conditions Wide operating voltage: 1.8 V to 3.7 V (3.3 V recommended) Ultra-low receive current (~6.8 mA) and low sleep current Industrial operating temperature: −40°C to +85°C Compact 20 × 14 × 2.8 mm SMD package with castellated pads/IPEX antenna options Suitable for IoT, AMI, smart home, industrial sensors, wireless alarms, and remote control systems. #Ebyte #E22Series #E22900M22S #SX1262 #LoRa #WirelessModule #SubGHz #SPI #IoT #IndustrialAutomation #SmartMetering #RemoteMonitoring #EmbeddedSystems #RFModule
118 Uses0 StarsLP2985IM5X-3.3
Linear Voltage Regulator IC Positive Fixed 1 Output 150mA SOT-23-5 The LP2985IM5X-3.3 specification defines the engineering requirements for a low-dropout linear voltage regulator integrated circuit designed to provide a regulated 3.3 V output for precision analog and digital electronic systems. This specification establishes the functional, electrical, mechanical, thermal, environmental, and quality requirements necessary to ensure stable voltage regulation, low output noise, and long-term operational reliability. The device is intended for use in embedded systems, industrial automation, portable electronics, instrumentation, communication equipment, and battery-powered applications requiring a low-noise and highly stable power supply. Its low dropout voltage, high power supply rejection, and integrated protection features make it suitable for powering microcontrollers, sensors, analog circuitry, and other sensitive electronic devices. Engineering Requirements The low-dropout voltage regulator shall be manufactured using qualified semiconductor fabrication processes and high-quality materials to ensure consistent electrical performance, low quiescent current, and dependable long-term reliability. The device shall maintain stable operation under specified input voltage, output load, temperature, and environmental operating conditions. Electrical characteristics shall provide accurate output voltage regulation, low dropout voltage, excellent line and load regulation, high power supply rejection, and low output noise. The regulator shall maintain stable output performance during startup, shutdown, transient load changes, and supply voltage variations without compromising system operation. The integrated control architecture shall support reliable voltage regulation while incorporating protection mechanisms such as current limiting and thermal shutdown to safeguard both the device and the powered system during abnormal operating conditions. The regulator shall maintain stable performance throughout continuous operation and dynamic load transitions. Thermal performance shall support continuous operation within the specified junction temperature range while maintaining electrical integrity and long-term reliability. The package shall be suitable for automated surface-mount assembly and compatible with standard solder reflow manufacturing processes. Mechanical construction shall withstand thermal cycling, vibration, mechanical handling, and environmental exposure without degradation of electrical or mechanical performance. Workmanship shall be free from defects including contamination, package cracking, bond failures, lead deformation, plating irregularities, or structural inconsistencies that could adversely affect functionality or reliability. Inspection, validation, and testing shall be performed using calibrated equipment and controlled quality procedures to verify compliance with engineering and manufacturing requirements. Any deviation from this specification shall require formal engineering evaluation, documented technical justification, and approval through the established engineering change control process before implementation. Documentation Supporting documentation shall include engineering drawings, electrical performance specifications, thermal characterization reports, application guidelines, qualification records, inspection reports, reliability data, material declarations, and revision-controlled manufacturing documentation. All documentation shall be maintained under formal configuration management and quality assurance systems to ensure complete product traceability. Revision Control Any modification to this specification shall be managed through the formal engineering change management process. All revisions shall undergo technical review, validation, and approval before release to ensure continued compliance with design intent and applicable engineering standards. #EngineeringSpecification #LowDropoutRegulator #LDO #VoltageRegulator #PowerManagement #EmbeddedSystems #IndustrialElectronics #Semiconductor #QualityAssurance #EngineeringDocumentation
0 Uses0 StarsMCP3204-CI/SL
12 Bit Analog to Digital Converter 2, 4 Input 1 SAR 14-SOIC The MCP3204-CI/SL specification defines the engineering requirements for a multi-channel analog-to-digital converter integrated circuit designed to provide high-accuracy conversion of analog signals into digital data for embedded electronic systems. This specification establishes the functional, electrical, mechanical, thermal, environmental, and quality requirements necessary to ensure precise signal acquisition, reliable data conversion, and long-term operational stability. The device is intended for use in embedded control systems, industrial automation, instrumentation, data acquisition equipment, sensor interfaces, medical electronics, and portable devices requiring accurate analog signal measurement. It supports multiple analog input channels and serial digital communication, enabling efficient integration with microcontrollers and digital processing systems. Engineering Requirements The analog-to-digital converter shall be manufactured using qualified semiconductor fabrication processes and high-quality materials to ensure consistent conversion accuracy, low power consumption, and dependable long-term reliability. The device shall maintain stable operation under specified voltage, temperature, and environmental conditions. Electrical characteristics shall provide accurate analog-to-digital conversion with low noise, excellent linearity, and stable reference performance. The converter shall maintain repeatable sampling characteristics and consistent digital output while supporting reliable serial communication with compatible host controllers. The conversion architecture shall provide predictable sampling behavior, low conversion error, and reliable channel selection while maintaining signal integrity throughout the specified operating range. The device shall support continuous and intermittent data acquisition without degradation of conversion performance. Thermal performance shall support continuous operation within the specified junction temperature range while maintaining electrical characteristics and long-term reliability. The package shall be suitable for automated surface-mount assembly and compatible with standard solder reflow manufacturing processes. Mechanical construction shall withstand thermal cycling, vibration, mechanical handling, and environmental exposure without degradation of functionality. Workmanship shall be free from defects including contamination, package cracking, bond failures, lead deformation, or structural inconsistencies that could adversely affect electrical or mechanical performance. Inspection, validation, and testing shall be performed using calibrated equipment and controlled quality procedures to verify compliance with engineering and manufacturing requirements. Any deviation from this specification shall require formal engineering evaluation, documented technical justification, and approval through the established engineering change control process before implementation. Documentation Supporting documentation shall include engineering drawings, electrical performance specifications, timing diagrams, application guidelines, qualification reports, inspection records, reliability data, material declarations, and revision-controlled manufacturing documentation. All documentation shall be maintained under formal configuration management and quality assurance systems to ensure complete product traceability. Revision Control Any modification to this specification shall be managed through the formal engineering change management process. All revisions shall undergo technical review, validation, and approval before release to ensure continued compliance with design intent and applicable engineering standards. #EngineeringSpecification #AnalogToDigitalConverter #ADC #DataAcquisition #SignalConditioning #EmbeddedSystems #IndustrialElectronics #Semiconductor #QualityAssurance #EngineeringDocumentation
4 Uses0 StarsTGS2611-C00
The TGS2611-C00 specification defines the engineering requirements for a semiconductor gas sensor designed for the detection of combustible gases in industrial, commercial, and embedded monitoring systems. This specification establishes the functional, electrical, mechanical, environmental, and quality requirements necessary to ensure accurate gas detection, stable sensing characteristics, and long-term operational reliability. The sensor is intended for use in gas leak detection equipment, safety monitoring systems, residential and commercial appliances, industrial automation, and environmental monitoring applications. It utilizes semiconductor sensing technology to detect target combustible gases with high sensitivity and repeatable performance, enabling reliable monitoring and early warning in safety-critical environments. Engineering Requirements The gas sensor shall be manufactured using qualified semiconductor sensing materials and controlled production processes to ensure consistent sensitivity, repeatability, and long-term stability. The sensing element shall maintain reliable performance under specified operating voltage, temperature, humidity, and environmental conditions. Electrical characteristics shall provide stable output response, repeatable detection performance, and predictable recovery behavior following gas exposure. The sensor shall maintain reliable operation during continuous monitoring while minimizing drift and preserving measurement consistency throughout its service life. The sensing element shall provide dependable detection of the intended combustible gases while maintaining resistance to environmental influences and normal operational contaminants. The sensor shall exhibit stable response characteristics suitable for integration with embedded control systems and gas monitoring electronics. Mechanical construction shall provide adequate protection for the sensing element while allowing sufficient exposure to the surrounding atmosphere for effective gas diffusion. The package shall withstand handling, vibration, thermal cycling, and standard assembly processes without degradation of sensing performance or structural integrity. Workmanship shall be free from defects including contamination, mechanical damage, corrosion, package deformation, or structural inconsistencies that could adversely affect sensing accuracy or reliability. Inspection, validation, and testing shall be performed using calibrated equipment and controlled quality procedures to verify compliance with engineering and manufacturing requirements. Any deviation from this specification shall require formal engineering evaluation, documented technical justification, and approval through the established engineering change control process before implementation. Documentation Supporting documentation shall include engineering drawings, electrical specifications, gas sensitivity characteristics, qualification reports, inspection records, reliability data, material declarations, and revision-controlled manufacturing documentation. All documentation shall be maintained under formal configuration management and quality assurance systems to ensure complete product traceability. Revision Control Any modification to this specification shall be managed through the formal engineering change management process. All revisions shall undergo technical review, validation, and approval before release to ensure continued compliance with design intent and applicable engineering standards. #EngineeringSpecification #GasSensor #CombustibleGasSensor #SemiconductorSensor #GasDetection #IndustrialSafety #EmbeddedSystems #EnvironmentalMonitoring #QualityAssurance #EngineeringDocumentation
0 Uses0 StarsDLVR-L10D-E1BD-C-NI3N
Pressure Sensor ±0.36PSI (±2.49kPa) Differential Male - 0.09" (2.24mm) Tube, Dual 14 b 8-DIP (0.620", 15.75mm), Dual Ports, Same Side The DLVR-L10D-E1BD-C-NI3N is a low-voltage, digital differential pressure sensor from Amphenol All Sensors' DLVR Series. It is designed to deliver highly accurate and temperature-compensated pressure measurements using proprietary CoBeam²™ sensing technology, which enhances long-term stability while minimizing package stress effects. The sensor features a 14-bit digital I²C output, operates from a 3.3 V supply, and measures differential pressures in the ±10 inH₂O range. Its compact through-hole DIP package with dual barbed ports makes it well suited for medical, HVAC, environmental monitoring, industrial control, and portable instrumentation applications. Key Features Differential pressure measurement: ±10 inH₂O 14-bit digital I²C interface 3.3 V low-voltage operation Proprietary CoBeam²™ MEMS technology for improved long-term stability Factory calibrated and temperature compensated Typical accuracy better than ±1% over temperature Dual barbed pressure ports (same-side orientation) Through-hole 8-pin DIP package Low-power operation suitable for battery-powered systems Designed for non-corrosive, non-ionic gases such as air and dry gases Ideal for medical breathing devices, HVAC, environmental monitoring, industrial automation, and portable equipment. #PressureSensor #DifferentialPressure #DigitalSensor #I2C #MEMS #AmphenolAllSensors #DLVRSeries #MedicalElectronics #HVAC #IndustrialAutomation #EnvironmentalMonitoring #EmbeddedSystems
2 Uses0 StarsMS580314BA01-00
Pressure Sensor 203.05PSI (1400kPa) Absolute 24 b 8-SMD Module The MS580314BA01-00 is a high-resolution digital absolute pressure sensor module from TE Connectivity Measurement Specialties. It integrates a precision MEMS pressure sensing element, a 24-bit ΔΣ ADC, and factory-calibrated coefficients to provide highly accurate digital pressure and temperature measurements. The sensor supports both I²C and SPI communication interfaces, making it easy to interface with a wide range of microcontrollers while requiring minimal external components. It is designed for low-power, high-accuracy applications such as altimeters, depth measurement systems, weather monitoring, industrial pressure sensing, and portable instrumentation. Key Features Digital absolute pressure sensor with integrated MEMS sensing element High-resolution 24-bit ΔΣ ADC with factory calibration Supports I²C and SPI digital interfaces Pressure range up to 14 bar (1400 kPa / 203 psi) Supply voltage: 1.8 V to 3.6 V Integrated temperature measurement for compensation and monitoring Low power consumption, suitable for battery-powered devices Operating temperature range: −40°C to +85°C Excellent long-term stability with low hysteresis Compact 8-SMD module for surface-mount PCB assembly Requires few or no external components for operation #PressureSensor #MEMS #AbsolutePressure #DigitalSensor #24BitADC #I2C #SPI #LowPower #IndustrialElectronics #Altimeter #DepthMeasurement #WeatherMonitoring #TEConnectivity #SurfaceMount #EmbeddedSystems
11 Uses0 Stars
