Interface ICs
An interface IC is a type of integrated circuit that is designed to facilitate communication between two devices or systems. These devices are commonly used in electronic systems to enable the transfer of data and control signals between different components or subsystems. Some common use cases for interface ICs include connecting microcontrollers to peripherals such as sensors or displays, linking multiple processors together in a network, and enabling communication between devices using different communication protocols. Flux.ai has the world's largest community-driven public library of interface ICs, with footprints, symbols, datasheets, and simulation models. This library is a valuable resource for engineers and designers who need access to accurate and up-to-date information on these important components. Whether you are working on a new design project or simply looking to learn more about interface ICs, Flux.ai is an excellent resource to help you find the information you need.
SMAJ33A-13-F
53.3V Clamp 7.5A Ipp Tvs Diode Surface Mount SMA TVS diode SMA 33V The SMAJ33A-13-F is a surface-mount transient voltage suppression (TVS) diode designed to protect sensitive electronic components from voltage spikes and transient events. It is typically used in circuits exposed to electrostatic discharge, inductive load switching, and other transient voltage conditions. The device operates by clamping excessive voltage to a safe level, thereby preventing damage to downstream components. Its compact surface-mount package enables efficient use of board space while maintaining reliable thermal and electrical performance. Device Overview This component is constructed using silicon avalanche technology, providing fast response time to transient events. It is intended for use in high-reliability applications where overvoltage protection is critical. The unidirectional configuration ensures effective suppression in circuits with a defined polarity. The device is optimized for low leakage current under normal operating conditions and high surge capability during transient events. Electrical Characteristics The diode is designed to operate with a defined stand-off voltage, ensuring it remains non-conductive during normal system operation. Upon exceeding the breakdown threshold, the device transitions into conduction, clamping the voltage to a specified level. It supports high peak pulse power dissipation and is capable of handling repeated transient events without significant degradation. Mechanical and Packaging Information The device is provided in a compact surface-mount package suitable for automated assembly processes. The package is designed for efficient heat dissipation and mechanical robustness, supporting standard reflow soldering techniques. Terminal finishes are compatible with common PCB manufacturing processes and ensure reliable solder joints. Applications Suitable for use in consumer electronics, industrial control systems, telecommunications equipment, and automotive electronics where protection against voltage transients is required. Common use cases include power supply lines, data lines, and interface ports. Environmental and Reliability Considerations The component is designed to meet standard environmental and reliability requirements for electronic components. It is suitable for operation across a wide temperature range and is built to withstand typical handling and assembly stresses. #commonpartslibrary #circuitprotection #tvsdiode
222 Uses0 StarsEFR32ZG23B020F512IM48-B
IC RF TxRx + MCU General ISM < 1GHz Z-Wave® 863MHz ~ 870MHz, 902MHz ~ 928MHz 48-VFQFN Exposed Pad The Silicon Labs EFR32ZG23B020F512IM48-B is a 2.4 GHz–independent (sub-GHz) RF Tx/Rx + MCU SoC optimized for Z-Wave smart home and IoT mesh networks. It integrates computing, RF communication, and security features in a compact 48-pin QFN package. It is part of the EFR32ZG23 Series 2 platform, which focuses on low-power, secure, long-range wireless connectivity for smart home, building automation, and industrial IoT devices. Key Features MCU Core & Memory ARM Cortex-M33 core (up to ~80 MHz) 512 kB Flash memory 64 kB RAM RF / Wireless Z-Wave protocol support (mesh + long-range) Frequency bands: 863–870 MHz (EU) 902–928 MHz (US) Max data rate: up to 100 kbps Output power: up to +20 dBm High sensitivity: around –110 dBm Security Secure Vault™ high-level security subsystem Hardware cryptography support Secure boot and key protection (IoT-grade security) Low Power Performance Ultra-low receive and transmit currents (single-digit mA RX, tens of mA TX) Designed for battery-powered IoT nodes Peripherals & Interfaces GPIO (up to ~31 pins depending on variant) ADC, I2C, SPI, UART, I2S, IrDA Flexible digital/analog peripheral integration Package & Electrical 48-pin QFN (6 × 6 mm) Supply voltage: 1.71 V – 3.8 V Industrial temperature range: –40°C to +125°C #CommonPartsLibrary #IntegratedCircuit #RF-transceiver #EFR32ZG23B020
0 Uses0 StarsFA1-NDRP-PCB-8
SMB, Fakra Connector Plug, Male Pin 50 Ohms Through Hole, Right Angle Solder The FA1-NDRP-PCB-8 is a PCB-mounted connector component typically used for reliable board-to-board or cable-to-board electrical interconnections in electronic systems. It is designed to provide stable mechanical retention and dependable signal or power transfer in compact PCB assemblies. Components in this series are commonly used in industrial equipment, consumer electronics, embedded systems, and communication devices. Key Features PCB-mount connector design for easy integration into electronic assemblies Supports secure electrical and mechanical connection Compact form factor suitable for space-constrained designs Durable housing and contact structure for repeated mating cycles Designed for stable signal and/or power transmission Typically used in control boards, interface modules, and embedded electronics Compatible with automated PCB assembly processes depending on package style Typical Applications Industrial control equipment Consumer electronics Embedded and IoT devices Communication hardware Interface and expansion boards #Connector #RF-connector #Coaxial
22 Uses0 StarsSTM32F407VGT6
ARM Microcontrollers - MCU ARM M4 1024 FLASH 168 Mhz 192kB SRAM 100-LQFP (14x14) Arm® Cortex®-M4 32b MCU+FPU, 210DMIPS, up to 1MB Flash/192+4KB RAM, USB OTG HS/FS, Ethernet, 17 TIMs, 3 ADCs, 15 comm. interfaces & camera • Core: Arm® 32-bit Cortex®-M4 CPU with FPU, Adaptive real-time accelerator (ART Accelerator) allowing 0-wait state execution from Flash memory, frequency up to 168 MHz, memory protection unit, 210 DMIPS/ 1.25 DMIPS/MHz (Dhrystone 2.1), and DSP instructions • Memories – Up to 1 Mbyte of Flash memory – Up to 192+4 Kbytes of SRAM including 64- Kbyte of CCM (core coupled memory) data RAM – 512 bytes of OTP memory – Flexible static memory controller supporting Compact Flash, SRAM, PSRAM, NOR and NAND memories • LCD parallel interface, 8080/6800 modes • Clock, reset and supply management – 1.8 V to 3.6 V application supply and I/Os – POR, PDR, PVD and BOR – 4-to-26 MHz crystal oscillator – Internal 16 MHz factory-trimmed RC (1% accuracy) – 32 kHz oscillator for RTC with calibration – Internal 32 kHz RC with calibration • Low-power operation – Sleep, Stop and Standby modes –VBAT supply for RTC, 20×32 bit backup registers + optional 4 KB backup SRAM • 3×12-bit, 2.4 MSPS A/D converters: up to 24 channels and 7.2 MSPS in triple interleaved mode • 2×12-bit D/A converters • General-purpose DMA: 16-stream DMA controller with FIFOs and burst support • Up to 17 timers: up to twelve 16-bit and two 32- bit timers up to 168 MHz, each with up to 4 IC/OC/PWM or pulse counter and quadrature (incremental) encoder input • Debug mode – Serial wire debug (SWD) & JTAG interfaces – Cortex-M4 Embedded Trace Macrocell™ • Up to 140 I/O ports with interrupt capability – Up to 136 fast I/Os up to 84 MHz – Up to 138 5 V-tolerant I/Os • Up to 15 communication interfaces – Up to 3 × I2C interfaces (SMBus/PMBus) – Up to 4 USARTs/2 UARTs (10.5 Mbit/s, ISO 7816 interface, LIN, IrDA, modem control) – Up to 3 SPIs (42 Mbits/s), 2 with muxed full-duplex I2S to achieve audio class accuracy via internal audio PLL or external clock – 2 × CAN interfaces (2.0B Active) – SDIO interface • Advanced connectivity – USB 2.0 full-speed device/host/OTG controller with on-chip PHY – USB 2.0 high-speed/full-speed device/host/OTG controller with dedicated DMA, on-chip full-speed PHY and ULPI – 10/100 Ethernet MAC with dedicated DMA: supports IEEE 1588v2 hardware, MII/RMII #CommonPartsLibrary #IntegratedCircuit #Microcontroller #STM32F407
46 Uses0 StarsSE868K3-A
Telit SE868K3-A/AL GNSS antenna module, multi-constellation GPS/QZSS/GLONASS receiver with Galileo ready support, integrated 9x9mm patch antenna, SAW filter, LNA, flash memory, RTC and TCXO, 11x11mm SMT PCB package, supports UART/I2C/SPI interfaces, A-GPS ephemeris prediction/injection, SBAS compliant, simultaneous GPS+GLONASS/Galileo tracking, optimized RF path, low power consumption, backward compatible with SE868-A series. SE868K3
14 Uses0 Stars0533981271
Connector Header Surface Mount 12 position 0.049" (1.25mm) 53398-1271 The 0533981271 is a board-to-wire connector assembly component designed to provide a reliable electrical and mechanical interface between a printed circuit board and discrete wire harnesses. It belongs to a compact connector system intended for applications requiring secure mating, efficient signal transmission, and ease of assembly. The component is engineered to support consistent electrical contact performance while maintaining a small footprint suitable for space-constrained designs. Its construction ensures dependable connectivity under typical operating conditions encountered in consumer electronics, industrial equipment, and embedded systems. Functional Description This connector component serves as part of a modular interconnect system, enabling termination of wires and subsequent mating to a corresponding board-mounted header. It provides stable retention and alignment during mating and unmating operations, ensuring consistent electrical continuity. The design supports straightforward integration into automated or manual assembly processes, facilitating efficient production workflows. Contact geometry and housing features are optimized to maintain reliable engagement and minimize the risk of intermittent connections. Electrical Characteristics The component is designed to support low-voltage signal and power transmission in compact electronic systems. It provides low contact resistance to ensure efficient current flow and stable signal integrity. Insulation materials are selected to maintain dielectric performance and prevent leakage under normal operating conditions. The connector system is suitable for typical electronic applications where consistent and reliable electrical performance is required. Mechanical Characteristics The connector features a durable housing constructed from engineered thermoplastic material, providing mechanical strength and resistance to environmental stress. Contact elements are formed from conductive alloys and finished to enhance conductivity and corrosion resistance. The design includes features that promote secure mating retention and proper alignment, reducing wear and ensuring longevity over repeated use. Its compact form factor supports high-density layouts on printed circuit boards. Environmental Characteristics The component is designed to operate reliably within standard environmental conditions encountered in electronic equipment. Materials used in the housing and contacts are selected for thermal stability and resistance to common environmental factors such as humidity and mechanical vibration. The connector system maintains performance over typical temperature ranges associated with consumer and industrial applications. Applications This connector is intended for use in electronic systems requiring compact and reliable wire-to-board interconnection. Common applications include consumer devices, industrial control systems, embedded modules, and communication equipment where dependable signal or power connectivity is essential. Summary The 0533981271 from Molex is a compact and reliable connector solution for board-to-wire applications. It offers consistent electrical performance, robust mechanical design, and ease of integration, making it well suited for modern electronic assemblies requiring dependable interconnect solutions. #commonpartslibrary #connector #header
1 Uses0 StarsFUSB340TMX
USB Switch USB 3.1 USB Interface 18-TMLP (2x2.8) The FUSB340 is a 2:1 data switch for USB SuperSpeed Gen1 and Gen2, 5 Gbps and 10 Gbps data. It is targeted at the mobile device market and for use in Type−C applications where a reversible cable requires a switch. The FUSB340 data switch offers superior performance various high speed data transmission protocols: • USB 3.1 SuperSpeed (Gen 2), 10 Gbps • PCI Express, Gen 3 • SATA • Fibre Channel • Display Port 1.3 Features • 10 GHz Typical Bandwidth • USB 3.1 SuperSpeed 5 Gbps and10 Gbps Switch • −1.0 dB Typical Insertion Loss at 2.5 GHz • Low Active Power of 12 A Typical • Low Shutdown Power of < 1 A Max. • 2 kV HBM ESD Protection • Small Packaging, 18 Lead TMLP • Wide VDD Operating Range, 1.5 V−5.0 V • This is a Pb−Free Device #CommonPartsLibrary #IntegratedCircuit #Controller #FUSB340
15 Uses0 Stars
