Interface ICs
An interface IC is a type of integrated circuit that is designed to facilitate communication between two devices or systems. These devices are commonly used in electronic systems to enable the transfer of data and control signals between different components or subsystems. Some common use cases for interface ICs include connecting microcontrollers to peripherals such as sensors or displays, linking multiple processors together in a network, and enabling communication between devices using different communication protocols. Flux.ai has the world's largest community-driven public library of interface ICs, with footprints, symbols, datasheets, and simulation models. This library is a valuable resource for engineers and designers who need access to accurate and up-to-date information on these important components. Whether you are working on a new design project or simply looking to learn more about interface ICs, Flux.ai is an excellent resource to help you find the information you need.
2961299
REL-MR- 12DC/21-21AU - Plug-in miniature power relay, with multi-layer gold contact, 2 changeover contacts, input voltage 12 V DC General Purpose Relay DPDT (2 Form C) 12VDC Coil Through Hole The Phoenix Contact 2961299 (REL-MR-12DC/21-21AU) is a plug-in miniature power relay designed for reliable switching in industrial automation, control panels, and interface applications. It features a 12 VDC monostable coil, 2 changeover (DPDT) contacts, and hard gold-plated AgNi contacts, making it suitable for switching low-level signals with high reliability. The relay is RT III sealed (wash-proof), ensuring protection against contaminants during PCB cleaning and harsh industrial environments. It is intended for use with compatible Phoenix Contact relay bases and accessories. Key Features 12 VDC monostable coil operation 2 changeover (DPDT) contacts Hard gold-plated AgNi contacts for reliable low-level signal switching RT III sealed (wash-proof) construction Mechanical life: up to 30 million operations 5 kV coil-to-contact isolation Fast operate and release times (typ. 7 ms / 3 ms) Designed for industrial control, PLC interfaces, automation, and switching applications Compatible with Phoenix Contact relay sockets and interface modules #PhoenixContact #Relay #PowerRelay #DPDTRelay #IndustrialAutomation #ControlPanel #PLC #InterfaceRelay #12VDC #ElectromechanicalRelay
4 Uses0 StarsUSB4960-00-C
USB-C (USB TYPE-C) USB 2.0 Receptacle Connector 24 (16+8 Dummy) Position Surface Mount, Through Hole The USB4960-00-C is a vertical USB Type-C® USB 2.0 receptacle connector manufactured by GCT (Global Connector Technology). It is designed for compact embedded systems, consumer electronics, industrial equipment, and IoT devices requiring a reliable USB Type-C interface for USB 2.0 data transfer and power delivery. The connector features a hybrid Surface Mount Technology (SMT) and Through-Hole (TH) shell stake design, providing excellent PCB retention and mechanical durability. It supports up to 240 W (48 V DC) power capability and is rated for 10,000 mating cycles, making it suitable for demanding applications. Key Features USB Type-C® USB 2.0 vertical receptacle 16 active contacts with 8 dummy contacts (24-position mechanical interface) Hybrid SMT signal pins with through-hole shell stakes for enhanced mechanical strength Supports up to 48 V DC and 240 W power capability Rated for 10,000 mating cycles Gold-plated copper alloy contacts for reliable electrical performance Shielded metal shell for improved EMI protection Operating temperature: -25°C to +85°C Features locating pegs, board guide, pick-and-place cap, and solder retention for automated assembly Ideal for embedded systems, industrial electronics, consumer devices, and USB charging applications. #USBTypeC #USB20 #ReceptacleConnector #VerticalConnector #SMT #ThroughHole #GCT #PowerConnector #DataConnector #PCBConnector #EmbeddedSystems #IndustrialElectronics
12 Uses0 StarsCH9101N
USB to Serial Port Chip CH9101 CH9101N is a high-speed USB-to-UART bridge IC developed by WCH (Qinheng Electronics). It converts a USB 2.0 Full-Speed interface into a standard asynchronous UART serial interface, enabling seamless communication between a computer and microcontrollers, embedded systems, industrial equipment, and other UART-based devices. The device features an integrated clock oscillator and power-on reset circuitry, minimizing external components and simplifying PCB design. Housed in a compact SOP-8 package, the CH9101N supports UART logic voltages from 1.8 V to 5 V, making it suitable for a wide range of low-power and mixed-voltage applications. It is commonly used for USB debugging, firmware downloading, serial communication, and IoT development. Key Features USB 2.0 Full-Speed compliant device interface USB-to-UART bridge with baud rates up to 3 Mbps Supports 1.8 V, 2.5 V, 3.3 V, and 5 V UART I/O levels Integrated clock oscillator (no external crystal required) Built-in power-on reset circuitry Full-duplex UART communication Supports hardware flow control (RTS/CTS) Compatible with standard virtual COM port (VCP) drivers Compact SOP-8 package with minimal external components Suitable for MCU programming, debugging, and serial communication applications #CH9101N #WCH #USBtoUART #USBBridge #UART #USB20 #SerialCommunication #EmbeddedSystems #Microcontroller #IoT #IndustrialAutomation #Debugging #FirmwareDownload #SOP8 #InterfaceIC
0 Uses0 StarsE22-900M22S
868/915MHz SPI SMD LoRa Module E22-900M22S is a compact, industrial-grade LoRa® wireless transceiver module developed by Ebyte, based on the Semtech SX1262 RF chipset. Operating in the 868/915 MHz ISM band, it communicates through an SPI interface and is designed for long-range, low-power wireless data transmission. The module offers excellent receiver sensitivity, strong anti-interference performance, and supports both LoRa and FSK modulation, making it suitable for smart metering, industrial automation, IoT sensor networks, remote monitoring, and wireless control applications. Key Features Based on the Semtech SX1262 LoRa transceiver Operates in the 850–930 MHz frequency range (optimized for 868/915 MHz ISM bands) SPI interface with data rates up to 10 Mbps Maximum transmit power of +22 dBm (160 mW) Receiver sensitivity up to −147 dBm (LoRa mode) Supports LoRa and FSK modulation Programmable air data rate up to 62.5 kbps (LoRa) and 300 kbps (FSK) Long communication range of up to 7 km under ideal line-of-sight conditions Wide operating voltage: 1.8 V to 3.7 V (3.3 V recommended) Ultra-low receive current (~6.8 mA) and low sleep current Industrial operating temperature: −40°C to +85°C Compact 20 × 14 × 2.8 mm SMD package with castellated pads/IPEX antenna options Suitable for IoT, AMI, smart home, industrial sensors, wireless alarms, and remote control systems. #Ebyte #E22Series #E22900M22S #SX1262 #LoRa #WirelessModule #SubGHz #SPI #IoT #IndustrialAutomation #SmartMetering #RemoteMonitoring #EmbeddedSystems #RFModule
70 Uses0 StarsPESD5V0L4UG,115
13V Clamp 2.5A (8/20µs) Ipp Tvs Diode Surface Mount 5-TSSOP The PESD5V0L4UG,115 is a low-capacitance, unidirectional quad-channel Electrostatic Discharge (ESD) protection diode array from Nexperia. It is designed to protect up to four high-speed signal or data lines from ESD events and other transient voltage spikes while maintaining excellent signal integrity due to its low junction capacitance. Packaged in a compact SOT-353 (SC-88A/5-TSSOP) surface-mount package, it is well suited for space-constrained electronic designs, including communication equipment, portable devices, computers, and consumer electronics. Key Features Quad-channel unidirectional ESD protection for up to 4 signal lines 5 V reverse standoff voltage (VRWM) suitable for 5 V interfaces Low junction capacitance (~16 pF typ.) to minimize signal distortion Low clamping voltage (13 V max.) for effective transient suppression Peak pulse power of 30 W IEC 61000-4-2 Level 4 ESD protection (up to ±20 kV) Ultra-low leakage current (typically 5 nA) Compact SOT-353 (SC-88A) surface-mount package Qualified to AEC-Q100 for automotive applications Ideal for protecting USB, communication interfaces, SIM card lines, audio/video ports, and other sensitive I/O circuits. #PESD5V0L4UG115 #Nexperia #ESDProtection #TVSDiode #TransientProtection #CircuitProtection #QuadChannel #LowCapacitance #AutomotiveGrade #SOT353 #SignalIntegrity #ElectronicsDesign
67 Uses0 StarsCMX973Q5
RF Demodulator IC 20MHz ~ 300MHz 32-VFQFN Exposed Pad The CMX973Q5 specification defines the engineering requirements for a radio frequency quadrature modulator integrated circuit designed for digital and analog wireless communication systems. This specification establishes the functional, electrical, mechanical, thermal, environmental, and quality requirements necessary to ensure accurate signal modulation, high RF performance, and long-term operational reliability. The device is intended for use in wireless communication equipment, telemetry systems, software-defined radio platforms, digital data transmission equipment, industrial RF systems, and embedded communication applications requiring high-performance I/Q modulation. It provides precise conversion of baseband in-phase and quadrature signals into modulated RF output while maintaining excellent signal integrity, low distortion, and stable operation over a wide range of operating conditions. Engineering Requirements The RF modulator shall be manufactured using qualified semiconductor fabrication processes and high-quality materials to ensure consistent electrical characteristics, reliable modulation accuracy, and dependable long-term performance. The device shall maintain stable operation under specified supply voltage, temperature, and environmental operating conditions. Electrical characteristics shall provide accurate in-phase and quadrature signal processing, low phase imbalance, high linearity, low noise, and excellent carrier suppression. The device shall maintain stable RF output characteristics and predictable modulation performance throughout continuous operation while minimizing harmonic distortion and unwanted spurious emissions. The integrated RF architecture shall support efficient signal conversion and reliable interface with external oscillators, filters, and communication circuitry. The device shall preserve signal integrity across the specified operating frequency range while supporting high-quality modulation for digital and analog communication protocols. Thermal performance shall support continuous operation within the specified junction temperature range while maintaining electrical integrity and long-term reliability. The package shall be suitable for automated surface-mount assembly and compatible with standard solder reflow manufacturing processes. Mechanical construction shall withstand thermal cycling, vibration, mechanical handling, and environmental exposure without degradation of electrical or mechanical performance. Workmanship shall be free from defects including contamination, package cracking, bond failures, lead deformation, plating irregularities, or structural inconsistencies that could adversely affect RF performance or reliability. Inspection, validation, and testing shall be performed using calibrated RF measurement equipment and controlled quality procedures to verify compliance with engineering and manufacturing requirements. Any deviation from this specification shall require formal engineering evaluation, documented technical justification, and approval through the established engineering change control process before implementation. Documentation Supporting documentation shall include engineering drawings, RF performance specifications, modulation characteristics, application guidelines, qualification reports, inspection records, reliability data, material declarations, and revision-controlled manufacturing documentation. All documentation shall be maintained under formal configuration management and quality assurance systems to ensure complete product traceability. Revision Control Any modification to this specification shall be managed through the formal engineering change management process. All revisions shall undergo technical review, validation, and approval before release to ensure continued compliance with design intent and applicable engineering standards. #EngineeringSpecification #RFModulator #QuadratureModulator #WirelessCommunication #RFIC #SignalModulation #EmbeddedSystems #Telecommunications #QualityAssurance #EngineeringDocumentation
0 Uses0 StarsTXU0202DTTR
Voltage Level Translator Unidirectional 1 Circuit 2 Channel 200Mbps 8-X1SON (1.95x1) The TXU0202DTTR specification defines the engineering requirements for a dual-bit voltage level translator integrated circuit designed for bidirectional logic-level conversion between digital interfaces operating at different supply voltages. This specification establishes the functional, electrical, mechanical, thermal, environmental, and quality requirements necessary to ensure reliable signal translation, high-speed communication, and long-term operational stability in embedded electronic systems. The device is intended for use in embedded controllers, microprocessor and microcontroller systems, communication interfaces, industrial automation equipment, consumer electronics, and portable devices requiring voltage compatibility between digital subsystems. It enables seamless signal transfer while preserving logic integrity, minimizing propagation delay, and supporting low-power operation in compact electronic designs. Engineering Requirements The voltage level translator shall be manufactured using qualified semiconductor fabrication processes and high-quality materials to ensure consistent electrical performance, low power consumption, and dependable long-term reliability. The device shall maintain stable operation under specified voltage, temperature, and environmental operating conditions. Electrical characteristics shall provide accurate bidirectional logic-level translation with low propagation delay, high noise immunity, and reliable input and output switching performance. The device shall maintain signal integrity during continuous operation, power sequencing, and dynamic switching conditions without introducing excessive distortion or timing errors. The integrated translation architecture shall support independent voltage domains while ensuring reliable communication between connected digital devices. The device shall maintain stable performance across varying supply voltages and logic frequencies while minimizing leakage current and preserving overall system efficiency. Thermal performance shall support continuous operation within the specified junction temperature range while maintaining electrical integrity and long-term reliability. The package shall be suitable for automated surface-mount assembly and compatible with standard solder reflow manufacturing processes. Mechanical construction shall withstand thermal cycling, vibration, mechanical handling, and environmental exposure without degradation of electrical or mechanical performance. Workmanship shall be free from defects including contamination, package cracking, bond failures, lead deformation, or structural inconsistencies that could adversely affect functionality or reliability. Inspection, validation, and testing shall be performed using calibrated equipment and controlled quality procedures to verify compliance with engineering and manufacturing requirements. Any deviation from this specification shall require formal engineering evaluation, documented technical justification, and approval through the established engineering change control process before implementation. Documentation Supporting documentation shall include engineering drawings, electrical performance specifications, timing diagrams, application guidelines, qualification reports, inspection records, reliability data, material declarations, and revision-controlled manufacturing documentation. All documentation shall be maintained under formal configuration management and quality assurance systems to ensure complete product traceability. Revision Control Any modification to this specification shall be managed through the formal engineering change management process. All revisions shall undergo technical review, validation, and approval before release to ensure continued compliance with design intent and applicable engineering standards. #EngineeringSpecification #VoltageLevelTranslator #LogicLevelShifter #DigitalInterface #EmbeddedSystems #Semiconductor #SignalIntegrity #IndustrialElectronics #QualityAssurance #EngineeringDocumentation
6 Uses0 StarsTS3USB221DRCR
USB Switch IC 2 Channel 10-VSON (3x3) The TS3USB221DRCR specification defines the engineering requirements for a high-speed USB analog switch integrated circuit designed for signal routing and interface switching in embedded electronic systems. This specification establishes the functional, electrical, mechanical, thermal, environmental, and quality requirements necessary to ensure reliable high-speed signal transmission, low insertion loss, and long-term operational stability. The device is intended for use in USB interface switching, portable electronics, embedded controllers, communication equipment, docking stations, and multimedia systems requiring high-speed differential signal routing. It enables seamless switching between USB data paths while maintaining signal integrity, minimizing propagation delay, and supporting reliable operation in compact, high-performance electronic designs. Engineering Requirements The analog switch shall be manufactured using qualified semiconductor fabrication processes and high-quality materials to ensure consistent switching performance, low power consumption, and dependable long-term reliability. The device shall maintain stable operation under specified voltage, temperature, and environmental conditions. Electrical characteristics shall provide low on-resistance, low capacitance, minimal insertion loss, and excellent channel-to-channel matching to preserve high-speed USB signal integrity. The device shall support reliable differential signal switching with minimal distortion, low propagation delay, and low crosstalk during continuous operation. The switching architecture shall provide dependable channel selection, high isolation between signal paths, and predictable switching behavior during power-up, power-down, and dynamic operating conditions. The device shall maintain stable electrical performance while minimizing electromagnetic interference and signal degradation. Thermal performance shall support continuous operation within the specified junction temperature range while maintaining electrical integrity and reliability. The package shall be suitable for automated surface-mount assembly and compatible with standard solder reflow manufacturing processes. Mechanical construction shall withstand vibration, thermal cycling, mechanical handling, and environmental exposure without degradation of performance. Workmanship shall be free from defects including contamination, package cracking, bond failures, lead deformation, or structural inconsistencies that could adversely affect electrical or mechanical reliability. Inspection, validation, and testing shall be performed using calibrated equipment and controlled quality procedures to verify compliance with engineering and manufacturing requirements. Any deviation from this specification shall require formal engineering evaluation, documented technical justification, and approval through the established engineering change control process before implementation. Documentation Supporting documentation shall include engineering drawings, electrical performance specifications, application guidelines, qualification reports, inspection records, reliability data, material declarations, and revision-controlled manufacturing documentation. All documentation shall be maintained under formal configuration management and quality assurance systems to ensure complete product traceability. Revision Control Any modification to this specification shall be managed through the formal engineering change management process. All revisions shall undergo technical review, validation, and approval before release to ensure continued compliance with design intent and applicable engineering standards. #EngineeringSpecification #USBAnalogSwitch #HighSpeedSwitch #USBInterface #SignalIntegrity #EmbeddedSystems #Semiconductor #ElectronicDesign #QualityAssurance #EngineeringDocumentation
13 Uses0 Stars
