Interface ICs

Telit SE868K3-A/AL GNSS antenna module, multi-constellation GPS/QZSS/GLONASS receiver with Galileo ready support, integrated 9x9mm patch antenna, SAW filter, LNA, flash memory, RTC and TCXO, 11x11mm SMT PCB package, supports UART/I2C/SPI interfaces, A-GPS ephemeris prediction/injection, SBAS compliant, simultaneous GPS+GLONASS/Galileo tracking, optimized RF path, low power consumption, backward compatible with SE868-A series. SE868K3

Connector Header Surface Mount 12 position 0.049" (1.25mm) 53398-1271 The 0533981271 is a board-to-wire connector assembly component designed to provide a reliable electrical and mechanical interface between a printed circuit board and discrete wire harnesses. It belongs to a compact connector system intended for applications requiring secure mating, efficient signal transmission, and ease of assembly. The component is engineered to support consistent electrical contact performance while maintaining a small footprint suitable for space-constrained designs. Its construction ensures dependable connectivity under typical operating conditions encountered in consumer electronics, industrial equipment, and embedded systems. Functional Description This connector component serves as part of a modular interconnect system, enabling termination of wires and subsequent mating to a corresponding board-mounted header. It provides stable retention and alignment during mating and unmating operations, ensuring consistent electrical continuity. The design supports straightforward integration into automated or manual assembly processes, facilitating efficient production workflows. Contact geometry and housing features are optimized to maintain reliable engagement and minimize the risk of intermittent connections. Electrical Characteristics The component is designed to support low-voltage signal and power transmission in compact electronic systems. It provides low contact resistance to ensure efficient current flow and stable signal integrity. Insulation materials are selected to maintain dielectric performance and prevent leakage under normal operating conditions. The connector system is suitable for typical electronic applications where consistent and reliable electrical performance is required. Mechanical Characteristics The connector features a durable housing constructed from engineered thermoplastic material, providing mechanical strength and resistance to environmental stress. Contact elements are formed from conductive alloys and finished to enhance conductivity and corrosion resistance. The design includes features that promote secure mating retention and proper alignment, reducing wear and ensuring longevity over repeated use. Its compact form factor supports high-density layouts on printed circuit boards. Environmental Characteristics The component is designed to operate reliably within standard environmental conditions encountered in electronic equipment. Materials used in the housing and contacts are selected for thermal stability and resistance to common environmental factors such as humidity and mechanical vibration. The connector system maintains performance over typical temperature ranges associated with consumer and industrial applications. Applications This connector is intended for use in electronic systems requiring compact and reliable wire-to-board interconnection. Common applications include consumer devices, industrial control systems, embedded modules, and communication equipment where dependable signal or power connectivity is essential. Summary The 0533981271 from Molex is a compact and reliable connector solution for board-to-wire applications. It offers consistent electrical performance, robust mechanical design, and ease of integration, making it well suited for modern electronic assemblies requiring dependable interconnect solutions. #commonpartslibrary #connector #header

USB Switch USB 3.1 USB Interface 18-TMLP (2x2.8) The FUSB340 is a 2:1 data switch for USB SuperSpeed Gen1 and Gen2, 5 Gbps and 10 Gbps data. It is targeted at the mobile device market and for use in Type−C applications where a reversible cable requires a switch. The FUSB340 data switch offers superior performance various high speed data transmission protocols: • USB 3.1 SuperSpeed (Gen 2), 10 Gbps • PCI Express, Gen 3 • SATA • Fibre Channel • Display Port 1.3 Features • 10 GHz Typical Bandwidth • USB 3.1 SuperSpeed 5 Gbps and10 Gbps Switch • −1.0 dB Typical Insertion Loss at 2.5 GHz • Low Active Power of 12 A Typical • Low Shutdown Power of < 1 A Max. • 2 kV HBM ESD Protection • Small Packaging, 18 Lead TMLP • Wide VDD Operating Range, 1.5 V−5.0 V • This is a Pb−Free Device #CommonPartsLibrary #IntegratedCircuit #Controller #FUSB340

The RFFM6901 is a single-chip RF front-end module (FEM) designed for 868 MHz to 928 MHz ISM-band wireless communication applications. It integrates a high-power power amplifier (PA), low-noise amplifier (LNA), antenna diversity switch, and matching circuitry into a compact package, helping reduce external components, PCB space, and overall system cost. It is commonly used in smart energy systems, wireless metering, industrial monitoring, alarm systems, and other Sub-1 GHz wireless devices. Key Features Operating frequency range: 868 MHz to 928 MHz Integrated 1 W power amplifier Up to +30 dBm transmit output power Integrated low-noise amplifier with bypass mode Dual-port antenna diversity switch Separate 50 Ω transmit and receive interfaces Compact 32-pin LGA package (6 mm × 6 mm) Supply voltage range: 2.8 V to 4.2 V Typical LNA gain: 17 dB Low receiver noise figure: 1.5 dB Designed for portable and battery-powered wireless systems RoHS compliant Typical Applications Smart energy and smart metering Wireless alarm and security systems ISM-band communication devices Industrial wireless sensors Portable RF equipment IoT Sub-1 GHz wireless systems Search across more sources

Rotary Encoder Incremental 24 Quadrature (Incremental) User Selectable 10 mA @ 5 VDC,-10 C to +70 C The PEC11J-9015F-S0024 is a compact surface-mount incremental rotary encoder from the Bourns PEC11J series, designed for user interface applications requiring precise rotational input and long operational life. It features a quadrature output with 24 pulses per revolution and includes an integrated momentary push-button switch, making it suitable for menu navigation, volume control, tuning systems, and industrial control panels. Its rugged metal shaft construction and high durability make it reliable for both consumer and professional electronic equipment. Key Features Incremental rotary encoder with 2-bit quadrature output 24 pulses per revolution (24 PPR) resolution Integrated momentary push-button switch Surface-mount gull-wing terminals Compact 12 mm encoder body Durable metal shaft and bushing Long rotational life of up to 100,000 cycles No detents for smooth continuous rotation Supports up to 60 RPM operating speed Operating temperature range: -10 °C to +70 °C IP40 rated enclosure Flatted shaft design for secure knob attachment Suitable for: Audio equipment Lighting consoles Consumer appliances Communication devices Test and measurement equipment Component Category #Sensor #Encoder #Transducer #PEC11J

2 MP MIPI® CSI-2 FPD-Link III serializer for 2MP/60fps cameras & radar The DS90UB953-Q1 is an automotive-grade high-speed serializer designed to convert parallel image sensor data into a high-speed serial stream for transmission over a single differential pair using FPD-Link III technology. It is intended for use in camera-based systems where compact cabling, high data integrity, and low latency are required. The device interfaces directly with image sensors through a MIPI CSI-2 input and transmits video, control, and GPIO data over a single coaxial or shielded twisted pair cable. Integrated clocking and control features allow synchronization with remote deserializers, enabling robust communication in electrically noisy environments typical of automotive and industrial applications. Functional Description The device receives image data from a connected sensor through a MIPI CSI-2 interface and serializes this data for transmission over a high-speed differential link. In addition to video data, bidirectional control communication is supported through an embedded control channel, allowing configuration and monitoring of remote devices using an I²C interface. The serializer incorporates programmable GPIO functionality that can be used for control signaling or sensor monitoring, with the ability to transport these signals across the link. Internal clock generation and phase-locked loop circuitry support multiple clocking modes, enabling flexible system design with either local or remote reference clocks. The device also includes pattern generation capabilities for system testing and validation. Electrical Characteristics The component operates from multiple power domains supporting core logic, I/O, and phase-locked loop functions. It is designed to provide stable high-speed signal transmission with controlled impedance outputs and low jitter characteristics. The differential serial output supports reliable long-distance communication over coaxial or twisted-pair media. Input interfaces are optimized for compatibility with standard MIPI CSI-2 signaling, ensuring seamless integration with modern image sensors. The control interface uses an open-drain I²C protocol for configuration and communication. Mechanical Characteristics The device is provided in a compact quad flat no-lead package suitable for high-density PCB designs. The package includes an exposed thermal pad that serves both as a heat dissipation path and a low-impedance electrical ground connection. The small footprint and low profile make it well suited for space-constrained applications such as camera modules and embedded vision systems. Environmental Characteristics The DS90UB953-Q1 is qualified for automotive applications and is designed to operate reliably over extended temperature ranges and under conditions of electrical noise, vibration, and mechanical stress. The device is compatible with standard surface-mount assembly processes, including lead-free reflow soldering. Materials and construction comply with relevant environmental and reliability standards for automotive-grade electronic components. Materials and Construction The package body is constructed from high-temperature thermally stable materials suitable for reflow soldering. Electrical contacts are formed from copper-based alloys with plated finishes to ensure long-term conductivity, corrosion resistance, and mechanical durability. The exposed pad is designed to interface directly with the PCB ground plane for improved thermal and electrical performance.

50 Position Connector Receptacle, Center Strip Contacts Surface Mount Gold The DF40HC series connector is a high-density, low-profile board-to-board interconnect solution designed for compact electronic assemblies requiring reliable signal integrity and mechanical robustness. This connector is intended for parallel board stacking applications where space constraints demand minimal height and fine contact pitch. It provides secure mating with precise alignment features and is optimized for high-speed signal transmission in advanced electronic systems such as portable devices, embedded modules, and industrial electronics. Mechanical Characteristics The connector features a slim, rectangular form factor suitable for high-density PCB layouts. It incorporates a fine-pitch contact arrangement to maximize signal routing efficiency within a limited footprint. The housing is constructed from high-temperature thermoplastic material to support standard reflow soldering processes. Contacts are designed to ensure consistent normal force, enabling stable electrical connection under vibration and mechanical stress. The mating interface includes polarization features to prevent incorrect insertion and to guide proper alignment during assembly. Electrical Characteristics The connector is engineered to support reliable signal transmission across multiple contact points with low contact resistance and stable impedance characteristics. It is suitable for both signal and low-power applications. Contact plating is optimized to maintain conductivity and minimize wear over repeated mating cycles. The design supports high-speed data transfer by reducing crosstalk and maintaining signal integrity across adjacent contacts. Environmental Characteristics The component is designed to operate within standard industrial temperature ranges and is compatible with lead-free reflow soldering processes. Materials used in construction comply with common environmental and regulatory standards for electronic components. The connector maintains performance under typical environmental stresses such as humidity, temperature variation, and mechanical vibration. Materials and Finishes The insulating housing is manufactured from a high-performance thermoplastic with appropriate flammability rating. Contacts are formed from copper alloy and plated with a noble metal finish over a suitable underlayer to ensure durability, corrosion resistance, and consistent electrical performance. Application Notes This connector is intended for use in applications requiring compact stacking of printed circuit boards with reliable electrical interconnection. Proper PCB layout, including pad design and solder mask considerations, is essential to ensure optimal performance. Care should be taken during handling and assembly to avoid damage to fine-pitch contacts. Designers should follow recommended land patterns and assembly guidelines provided by the manufacturer to achieve consistent solder joints and mechanical stability. #commonpartslibrary #connector #receptacle #surfacemount

The ESP32-WROOM-32E (16MB) is a highly integrated Wi-Fi + Bluetooth + Bluetooth Low Energy (BLE) module developed by Espressif. It is based on the ESP32-D0WD-V3 chip and features a dual-core processor, rich peripherals, and large flash memory—making it ideal for IoT, embedded systems, and wireless applications. This module is part of the upgraded WROOM-32E series, offering improved RF performance, better stability, and enhanced reliability compared to earlier versions like the 32D. Key Features (16MB Variant) Processor & Memory Dual-core Xtensa® 32-bit LX6 CPU, up to 240 MHz 520 KB SRAM + 448 KB ROM 16 MB SPI Flash (large storage for firmware/data) Optional variants with PSRAM for memory-intensive tasks Connectivity 2.4 GHz Wi-Fi (802.11 b/g/n) Bluetooth v4.2 (BR/EDR + BLE) Integrated PCB antenna (no external antenna needed) Peripherals & Interfaces Up to 26–38 GPIOs (depending on usage) Supports: UART, SPI, I2C, I2S PWM (LED & motor control) ADC, DAC Capacitive touch sensors SD/SDIO/MMC, CAN (TWAI) Electrical & Physical Operating voltage: 3.0V – 3.6V Operating temperature: –40°C to +85°C (industrial range) Compact size: 18 × 25.5 × 3.1 mm Typical Applications Smart home devices (lighting, appliances) IoT sensors and gateways Industrial automation systems Wearables and smart gadgets Audio/voice processing (thanks to dual-core + large flash) #module #ESP32 #16MB

Electronic Fuse Regulator 4A 8-WSON (2x2) The TPS259530DSGR is a compact, integrated eFuse protection device designed to provide robust power-path management for low-voltage DC systems, particularly nominal five-volt rails. It combines multiple protection and control features into a single solution, enabling safe distribution of power to downstream circuitry while minimizing the need for external components. The device supports controlled inrush current during startup, continuous current monitoring, and rapid fault response to protect both the power source and the load. Integrated protection mechanisms include overvoltage protection, undervoltage lockout, overcurrent limiting, thermal shutdown, and reverse current blocking. This makes the device well suited for applications requiring high reliability, such as embedded systems, industrial electronics, consumer devices, and communication equipment. Functional Description The device operates as a high-side protection switch using an internal MOSFET to control current flow from the input supply to the load. It monitors input voltage, output current, and internal temperature to ensure operation within safe limits. When a fault condition such as overcurrent or overvoltage is detected, the device limits or interrupts current flow to prevent damage. The integrated control loop provides smooth startup by limiting inrush current and preventing supply droop. Reverse current blocking prevents unwanted current flow from the output back to the input when the input supply is removed or drops below the output level. Electrical Characteristics The device supports operation across a wide input voltage range suitable for low-voltage DC systems, including typical five-volt rails. It features an adjustable overvoltage protection threshold aligned with five-volt system requirements, along with configurable undervoltage lockout to ensure proper system startup and shutdown behavior. The current limit is externally programmable, allowing flexibility for different load conditions. The device exhibits low on-resistance to minimize power dissipation and voltage drop during normal operation. Protection Features The TPS259530DSGR integrates multiple protection functions to enhance system robustness. Overvoltage protection prevents excessive input voltage from reaching the load. Undervoltage lockout ensures the device only operates when the input supply is within a valid range. Overcurrent protection actively limits current during fault conditions and can respond rapidly to short circuits. Thermal shutdown protects the device from overheating by disabling operation when internal temperature exceeds safe limits. Reverse current blocking prevents backflow of current, safeguarding both the source and load. Control and Interface The device includes an enable control input that allows external control of the power path. It supports configurable behavior for fault response and recovery, depending on system design. External components can be used to set thresholds such as current limit and undervoltage lockout, providing design flexibility. Status signaling allows system-level monitoring of fault conditions. Mechanical and Package Information The TPS259530DSGR is provided in a compact surface-mount package suitable for space-constrained applications. The package is optimized for thermal performance and efficient PCB layout, enabling reliable operation under varying load conditions. It is supplied in tape-and-reel format for automated assembly processes. Applications This device is intended for use in systems requiring reliable power distribution and protection. Typical applications include five-volt power rails in embedded systems, industrial control modules, consumer electronics, communication devices, and peripheral power management circuits. Summary The TPS259530DSGR offers an integrated, high-reliability solution for power path protection and management in low-voltage systems. Its combination of protection features, configurability, and compact form factor makes it a widely used choice for safeguarding five-volt supply rails in modern electronic designs. #commonpartslibrary #integratedcircuit #powermanagement

4.7 µH Unshielded Drum Core, Wirewound Inductor 62 A 0.95mOhm Max Vertical, 2 PC Pin The IHDM1008BCEV4R7M30 is a surface-mount power inductor designed for energy storage and filtering in switching power supplies and DC-DC converter circuits. It provides stable inductance characteristics under varying current conditions, making it suitable for applications requiring efficient power conversion and noise suppression. The device is constructed using a magnetically shielded structure to minimize electromagnetic interference and ensure reliable operation in densely populated circuit environments. Its design supports high current handling capability while maintaining low core losses, contributing to overall system efficiency. Functional Overview The inductor stores energy in its magnetic field when current flows through it and releases that energy when the current changes. This behavior is essential for smoothing current in switching regulators and maintaining stable voltage levels in power circuits. Its low resistance winding helps reduce power loss, while the magnetic shielding limits flux leakage, improving performance in sensitive electronic systems. The component is optimized for high-frequency operation typically found in modern power management designs. Electrical Characteristics The device provides a fixed inductance value with stable performance across a range of operating currents. It supports relatively high saturation current levels, allowing it to function effectively in power circuits without significant degradation of inductance. Low direct current resistance contributes to improved efficiency and reduced heat generation. The inductor is designed to maintain consistent electrical behavior across typical operating temperatures and frequencies used in switching applications. Interface Requirements The component features standard surface-mount terminals for direct placement onto printed circuit boards. Proper soldering and pad design are required to ensure mechanical stability and optimal electrical performance. Placement considerations should include minimizing loop area and proximity to switching elements to reduce noise and maximize efficiency. Operating Conditions The inductor is intended for operation across a wide temperature range suitable for consumer and industrial electronics. It is capable of maintaining performance under continuous load conditions and varying thermal environments. Adequate thermal management and airflow may be necessary in high-current applications to prevent excessive temperature rise. Protection and Reliability Features The device is constructed with durable materials to ensure long-term reliability under electrical and thermal stress. Its magnetically shielded design reduces susceptibility to external interference and limits emissions that could affect nearby components. It is designed to withstand standard handling and soldering processes associated with surface-mount assembly. Packaging and Integration The IHDM1008BCEV4R7M30 is provided in a compact surface-mount package optimized for automated assembly processes. Its form factor allows efficient use of board space while supporting high-performance power designs. The package design ensures secure mounting and consistent electrical contact in high-density circuit layouts. Applications Typical applications include DC-DC converters, voltage regulator modules, power management circuits, filtering stages, and energy storage elements in portable devices, industrial equipment, and communication systems. #commonpartslibrary #inductors