NXP Precision 9DoF breakout combines two of the best motion sensors we've tested here at Adafruit: The FXOS8700 3-Axis accelerometer and magnetometer, and the FXAS21002 3-axis gyroscope

ARM® Cortex®-M7 S32K3 Microcontroller IC 32-Bit 160MHz 4MB (4M x 8) FLASH 172-QFP (16x16) S32K344EHT1VPBST is an automotive-grade 32-bit microcontroller from NXP Semiconductors based on the Arm Cortex-M7 core architecture. The device is designed for high-performance real-time automotive body, chassis, powertrain, and domain control applications requiring functional safety, security, and advanced communication interfaces. It integrates high-speed processing capability, extensive peripheral integration, hardware security acceleration, and deterministic control functions suitable for safety-critical embedded systems. The microcontroller operates with an Arm Cortex-M7 CPU core running at high frequency with floating-point support and DSP extensions for computationally intensive applications. Integrated flash memory and SRAM provide embedded program and data storage optimized for automotive embedded control systems. The device supports hardware-assisted security features including secure boot, cryptographic acceleration, and tamper protection for secure automotive network communication and firmware integrity. The S32K344EHT1VPBST includes multiple communication peripherals supporting CAN FD, FlexCAN, LIN, SPI, UART, I2C, and Ethernet interfaces for distributed automotive networking and gateway applications. Advanced analog integration includes ADC modules, timers, PWM generators, watchdogs, and motor-control-oriented peripherals enabling precision sensing and control functionality. The device supports functional safety development aligned with ISO 26262 requirements and includes error correction, memory protection, fault monitoring, and safety management features. Power management functionality supports low-power operating modes for energy-efficient automotive electronic control units. The microcontroller is housed in a thermally enhanced LQFP package suitable for automotive operating environments with extended temperature capability and AEC-Q100 qualification for automotive reliability standards. #commonpartslibrary #integratedcircuit #microcontroller #arm #m7

ARM® Cortex®-M33F, ARM® Cortex®-M7F RT1180 Microcontroller IC 32-Bit Dual-Core 240MHz, 800MHz 160KB (160K x 8) ROM 289-LFBGA (14x14) The MIMXRT1189XVM8C is a high-performance crossover microcontroller from the NXP Semiconductors i.MX RT1180 family, designed for advanced industrial and real-time embedded applications. It combines the real-time performance of a microcontroller with the connectivity and security features typically found in application processors. The device integrates dual Arm® Cortex® cores, high-speed networking with Time-Sensitive Networking (TSN), and advanced EdgeLock® security technology, making it ideal for industrial automation, robotics, motor control, automotive gateways, and Industry 4.0 systems. Key Features Dual-core architecture: Arm® Cortex®-M7 core running up to 800 MHz Arm® Cortex®-M33 core running up to 300 MHz Integrated Gigabit TSN Ethernet switch for deterministic real-time networking Supports industrial Ethernet protocols including: EtherCAT PROFINET Ethernet/IP CC-Link IE Advanced EdgeLock® Secure Enclave for secure boot, cryptography, and tamper detection Up to 1.5 MB on-chip SRAM with ECC protection High-speed external memory interfaces Multiple communication peripherals: CAN-FD UART SPI I2C USB Ethernet High-resolution ADCs and advanced PWM/timer modules Supports MCUXpresso SDK and Zephyr RTOS Industrial temperature range operation from -40°C to +125°C BGA package optimized for compact industrial designs #Commonpartlibrary #Microcontroller #MIMXRT1189

The RC522 is a 13.56MHz RFID module that is based on the MFRC522 controller from NXP semiconductors. The module can supports I2C, SPI and UART and normally is shipped with a RFID card and key fob. It is commonly used in attendance systems and other person/object identification applications. #RFID #Module

ARM® Cortex®-M7 S32K3 Microcontroller IC 32-Bit Tri-Core 240MHz 8MB (8M x 8) FLASH 289-LFBGA (14x14) ## Engineering Specification ## General Description The **S32K358GHT1MJBST** is an NXP Semiconductors **S32K3 series automotive microcontroller** designed for high-performance embedded control applications in automotive, industrial, and electrically harsh environments. It is built around an **Arm Cortex-M7 architecture** and provides high processing capability, large embedded flash memory, automotive-grade qualification, security support, and a broad set of communication interfaces. The device is suitable for body control, gateway systems, vehicle networking, motor control, domain control, safety-related embedded systems, and general-purpose automotive electronic control units. ## Device Identification Manufacturer Part Number: **S32K358GHT1MJBST** Manufacturer: **NXP Semiconductors** Product Family: **S32K3** Device Category: **Integrated Circuit** Device Type: **Automotive Microcontroller** Core Architecture: **Arm Cortex-M7** Processing Class: **Thirty-Two-Bit MCU** Qualification: **Automotive Grade, AEC-Q100** ## Functional Description The device functions as a high-performance automotive microcontroller for embedded control and communication systems. It provides processing resources for real-time control, communication management, diagnostics, security handling, and system-level application logic. The microcontroller is designed for scalable automotive platforms where software reuse, safety capability, and peripheral integration are important. ## Core and Processing Description The **S32K358GHT1MJBST** uses an Arm Cortex-M7 based processing architecture with tri-core capability and high-speed operation. The core architecture supports digital signal processing, floating-point operation, interrupt handling, and real-time embedded software execution. This makes the device suitable for control systems that require strong computing performance and deterministic response. ## Memory Description The device includes large embedded flash memory for application firmware storage and integrated RAM for runtime operation, data buffering, communication stacks, and control algorithms. The memory architecture is suitable for complex embedded applications requiring large program space, diagnostics, bootloader support, and over-the-air update capability. ## Security and Safety Description The microcontroller includes hardware security support through **HSE-B security** and is intended for automotive applications where secure boot, cryptographic services, protected firmware operation, and system integrity are important. The S32K3 family also supports automotive safety-oriented development through features such as error correction, monitoring, and diagnostic capability. ## Communication and Interface Description The device supports multiple embedded communication interfaces suitable for vehicle and industrial networks. Supported interface types include CAN, Ethernet, I²C, SPI, UART, LIN, QSPI, SAI, SENT, and FlexIO. These interfaces allow the device to communicate with sensors, actuators, transceivers, memory devices, network controllers, and other electronic control units. ## Analog and Peripheral Description The microcontroller includes analog-to-digital conversion capability, timers, watchdog functions, direct memory access, serial audio support, and general-purpose input and output resources. These peripherals support sensing, control, timing, supervision, communication, and system management functions in embedded hardware designs. ## Electrical Description The device is designed for automotive low-voltage operation and supports use across a wide supply voltage range. It is intended for applications requiring reliable operation in automotive and industrial temperature environments. Proper power supply design, decoupling, reset control, clock configuration, and grounding should follow the manufacturer’s hardware design recommendations. ## Package and Mechanical Description The **S32K358GHT1MJBST** is supplied in a **surface-mount LFBGA package** with a compact ball-grid-array footprint. The package is intended for dense printed circuit board layouts requiring careful routing, controlled assembly process, thermal management, and proper solder joint reliability. ## Mounting and Assembly Description The component is intended for automated surface-mount PCB assembly using BGA-compatible manufacturing processes. PCB layout should follow the recommended footprint, ball escape routing, power-plane design, decoupling capacitor placement, thermal design, and inspection requirements for high-density automotive microcontroller assemblies. ## Application Suitability The device is suitable for automotive electronic control units, body control modules, gateway controllers, vehicle networking systems, motor control platforms, battery-related control systems, industrial controllers, safety-oriented embedded systems, and high-performance general-purpose control applications. ## Design Considerations The design should account for supply voltage range, clocking requirements, flash and RAM usage, thermal limits, package routing density, communication interface requirements, EMC performance, boot configuration, security provisioning, debugging access, software safety requirements, and compliance with automotive design guidelines. The device should not be operated beyond the manufacturer’s specified electrical, thermal, or mechanical limits. ## Hashtags #commonpartslibrary #integratedcircuit #microcontroller #automotivemcu #nxp #nxpsemiconductors #s32k3 #s32k358 #s32k358ght1mjbst #armcortexm7 #cortexm7 #thirtytwobit #automotiveelectronics #aecq100 #hsesecurity #canfd #ethernet #vehicleelectronics #embeddedhardware #embeddeddesign #ecu #gatewaycontroller #bodycontrolmodule #pcbdesign #hardwaredesign #electronicscomponents #electronicparts #componentlibrary #engineeringparts #electronicsengineering

Power Management IC for iMX8M 5V 6A 6 Buck + 5 LDO The PCA9450CHNY is a highly integrated Power Management Integrated Circuit (PMIC) from NXP Semiconductors, specifically designed to power the i.MX 8M family of application processors, particularly the i.MX 8M Plus. It integrates multiple high-efficiency DC-DC buck converters, LDO regulators, power sequencing logic, load switching, voltage monitoring, and system control functions into a single device. The PCA9450C variant features a configurable dual-phase 6 A buck regulator for powering high-current processor cores while supporting Dynamic Voltage Scaling (DVS) for optimized power efficiency. Key Features Six high-efficiency switching regulators (Buck converters) PCA9450C variant supports a configurable 6 A dual-phase buck regulator Three 3 A buck regulators with Dynamic Voltage Scaling (DVS) Remote-sense capability on major buck outputs for IR-drop compensation Five integrated LDO regulators Supports DDR4, LPDDR4, and DDR3L memory configurations 400 mA load switch with active discharge Dual-channel logic level translator Integrated 32.768 kHz crystal oscillator driver Fast-mode Plus (Fm+) 1 MHz I²C interface Programmable power sequencing and voltage control Power ON/OFF and Standby/Run mode control inputs Protection features including UVLO, thermal shutdown, fault monitoring, and soft-start Operating temperature range: −40°C to +105°C 56-pin HVQFN package (7 mm × 7 mm, 0.4 mm pitch) Optimized for i.MX 8M Mini, Nano, and Plus processors, especially the i.MX 8M Plus for the PCA9450C variant. #CommonPartsLibrary #PCA9450CHNY #PCA9450C #NXP #PMIC #PowerManagementIC #PowerSupply #VoltageRegulator #BuckConverter #LDO #DynamicVoltageScaling #DVS #IMX8M #IMX8MPlus #EmbeddedSystems #IndustrialElectronics #PowerManagement #HVQFN56 #Semiconductor #IntegratedCircuit #IC #CommonPartsLibrary #ElectronicsDesign #HardwareDesign #PCBDesign #EmbeddedLinux #IoT #ProcessorPowerManagement #PowerSequencing #SystemPower #NXPSemiconductors

ARM® Cortex®-M33 RT-600 Microcontroller IC 32-Bit Dual-Core 300MHz External Program Memory 176-VFBGA (9x9) The RT600 is a family of dual-core microcontrollers for embedded applications featuring an Arm Cortex-M33 CPU combined with a Cadence Xtensa HiFi4 advanced Audio Digital Signal Processor CPU. The Cortex-M33 includes two hardware coprocessors providing enhanced performance for an array of complex algorithms. The family offers a rich set of peripherals and very low power consumption. The Arm Cortex-M33 is a next generation core based on the ARMv8-M architecture that offers system enhancements, such as ARM TrustZone® security, single-cycle digital signal processing, and a tightly-coupled coprocessor interface, combined with low power consumption, enhanced debug features, and a high level of support block integration. The ARM Cortex-M33 CPU employs a 3-stage instruction pipe and includes an internal prefetch unit that supports speculative branching. A hardware floating-point processor is integrated into the core. On the RT600, the Cortex-M33 is augmented with two hardware coprocessors providing accelerated support for additional DSP algorithms and cryptography. The Cadence Xtensa HiFi 4 Audio DSP engine is a highly optimized audio processor designed especially for efficient execution of audio and voice codecs and pre- and post-processing modules. It supports four 32x32-bit MACs, some support for 72-bit accumulators, limited ability to support eight 32x16-bit MACs, and the ability to issue two 64-bit loads per cycle. There is a floating point unit providing up to four single-precision IEEE floating point MACs per cycle. The RT600 provides up to 4.5 MB of on-chip SRAM (plus an additional 128 KB of tightly-coupled HiFi4 ram) and several high-bandwidth interfaces to access off-chip flash. The FlexSPI flash interface supports two channels and includes an 32 KB cache and an on-the-fly decryption engine. The RT600 is designed to allow the CortexM33 to operate at frequencies of up to 300 MHz and the HiFi4 DSP to operate at frequencies of up to 600 MHz. Key Features Dual-core architecture with Arm Cortex-M33 CPU and Cadence Xtensa HiFi4 DSP Cortex-M33 operating at up to 300 MHz HiFi4 DSP operating at up to 600 MHz Up to 4.5 MB on-chip SRAM 128 KB DSP tightly coupled memory (TCM) FlexSPI interface supporting Quad/Octal SPI Flash with execute-in-place (XIP) High-speed USB 2.0 Host/Device with integrated PHY Digital microphone (DMIC) interface supporting up to 8 channels Multiple I2S, SPI, I²C, UART, SDIO, and I3C interfaces 12-bit ADC with up to 1 MSPS sampling rate Hardware cryptography acceleration (AES, SHA, RSA, ECC) Arm TrustZone® security technology Secure boot and physically unclonable function (PUF) key storage Multiple low-power operating modes for battery-powered applications Up to 147 GPIOs depending on package option 176-pin VFBGA package (9 mm × 9 mm) Typical Applications Voice-controlled smart devices Audio processing and DSP systems Smart speakers and soundbars Industrial HMI and control panels Edge AI and machine learning applications IoT gateways and connected devices Wearable and portable electronics #NXP #iMXRT685 #RT600 #CortexM33 #HiFi4DSP #Microcontroller #EmbeddedSystems #EdgeAI #VoiceRecognition #AudioProcessing #IoT #IndustrialAutomation #SecureMCU #MachineLearning #MCUDesign

NXP JN5164/JN5169 breakout module, SMD #RF #ZigBee #commonpartslibrary

NXP JN5164/JN5169 breakout module, SMD #RF #ZigBee #commonpartslibrary

8 bit Output Shift Register (DIP package) DIP254P762X420-16 NXP DIP-16 71R2683 1826799 74HC595N,112

NXP MCU T4240NSN7QTB FBGA-1932_L45.0-W45.0-P1.00-BL_10AX115SF45 LCSC Part Number: C1555511 undefined Manufactured by NXP(恩智浦)

NXP MCU MKE02Z64VQH4 LQFP-64_L14.0-W14.0-P0.80-LS16.0-BL LCSC Part Number: C110802 JLCPCB Part Class: undefined Manufactured by NXP(恩智浦)

NXP MCU LPC832M101FDH20FP TSSOP-20_L6.5-W4.4-P0.65-LS6.4-BL LCSC Part Number: C111582 JLCPCB Part Class: undefined Manufactured by NXP(恩智浦)

NXP MCU MKL16Z64VFM4 QFN-32_L5.0-W5.0-P0.50-BL-EP3.4 LCSC Part Number: C191270 JLCPCB Part Class: undefined Manufactured by NXP(恩智浦)

NXP MCU S9KEAZN8AMTG TSSOP-16_L5.0-W4.4-P0.65-LS6.4-BL LCSC Part Number: C181712 JLCPCB Part Class: undefined Manufactured by NXP(恩智浦)

ARM® Cortex®-A53 Microprocessor IC i.MX8ML 2 Core, 64-Bit 1.8GHz 548-LFBGA (15x15) Application Processor for embedded multimedia and industrial systems, integrating dual Arm® Cortex®-A53 cores operating up to 1.8 GHz and a Cortex®-M4 real-time core up to 400 MHz. It supports LPDDR4/DDR4/DDR3L memory, Gigabit Ethernet, PCIe, USB 2.0, MIPI-CSI/DSI, SAI audio interfaces, and 1080p video encode/decode, and is housed in a 0.8 mm pitch 486-ball FCBGA package. #ApplicationProcessor #NXP #iMX8MMini #ARMCortexA53 #CortexM4 #EmbeddedProcessor #MultimediaProcessor #FCBGA486 #LPDDR4 #DDR4 #PCIe #USB2 #GigabitEthernet #MIPI #SAI #EmbeddedSystems

NXP MCU LS1046ASN8MQA FCPBGA-780_L23.0-L23.0-P0.80-BL_NXP_BSC9132 LCSC Part Number: C1555624 undefined Manufactured by NXP(恩智浦)

NXP MCU FS32K144HAT0VLLR LQFP-100_L14.0-W14.0-P0.50-LS16.0-BL LCSC Part Number: C1850146 JLCPCB Part Class: undefined Manufactured by NXP(恩智浦)

NXP MCU SPC5607BAVLU6R LQFP-176_L24.0-W24.0-P0.50-LS26.0-BL LCSC Part Number: C2056904 JLCPCB Part Class: undefined Manufactured by NXP(恩智浦)

NXP MCU T1042NSN7PQB FCPBGA-780_L23.0-L23.0-P0.80-BL_NXP_BSC9132 LCSC Part Number: C1555394 undefined Manufactured by NXP(恩智浦)

NXP MCU LS1046ASN8T1A FCPBGA-780_L23.0-L23.0-P0.80-BL_NXP_BSC9132 LCSC Part Number: C1555382 undefined Manufactured by NXP(恩智浦)

RFID Reader IC 13.56MHz FeliCa, ISO 14443, ISO 15693, MIFARE, NFC I2C 1.65V ~ 1.95V, 3V ~ 3.6V 40-VFQFN Exposed Pad NFC controller providing contactless communication for NFC reader/writer, peer-to-peer, and card emulation applications. It supports a 13.56 MHz operating frequency, I²C host interface with NCI 2.0, a 2.8 V to 5.5 V supply voltage, and is housed in a 40-pin HVQFN (6 × 6 mm) package, with support for ISO/IEC 14443 Type A/B, ISO/IEC 15693, and ISO/IEC 18092 standards. #NXP #PN7160A1HN_C100E #NFCController #NFC #RFID #13_56MHz #I2C #NCI2_0 #ISO14443 #ISO15693 #ISO18092 #HVQFN40 #EmbeddedSystems

NXP MCU MK60FN1M0VLQ15 LQFP-144_L20.0-W20.0-P0.50-LS22.0-BL LCSC Part Number: C1337932 JLCPCB Part Class: undefined Manufactured by NXP(恩智浦)

NXP MCU LPC2388FBD144K LQFP-144_L20.0-W20.0-P0.50-LS22.0-BL LCSC Part Number: C1020281 JLCPCB Part Class: undefined Manufactured by NXP(恩智浦)

NXP MCU SPC5607BAVLQ6R LQFP-144_L20.0-W20.0-P0.50-LS22.0-BL LCSC Part Number: C2056974 JLCPCB Part Class: undefined Manufactured by NXP(恩智浦)